Rogers TMM6 Microwave PCB, 50mil 1.27mm, High-Frequency PCB with DK 6.0 and Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
We are excited to introduce our latest high-performance product – the Rogers TMM6 Microwave PCB, 50mil 1.27mm, High-Frequency PCB with DK 6.0 and Immersion Gold. Designed for advanced RF and microwave applications, this double-layer PCB offers exceptional electrical performance, thermal stability, and reliability, making it an ideal choice for high-frequency and high-power systems.
Why Choose Rogers TMM6 Microwave PCB?
1.High Dielectric Constant (DK6.0): With a dielectric constant of 6.0, the TMM6 PCB is optimized for high-frequency applications, ensuring minimal signal loss and superior performance in RF and microwave circuits.
2.Low Dissipation Factor (0.0023): The low dissipation factor ensures efficient signal transmission, making it ideal for applications requiring high signal integrity.
3.Excellent Thermal Stability: TMM6 features a low thermal coefficient of dielectric constant and thermal expansion coefficients that closely match those of copper, ensuring reliable plated-through holes and minimal etch shrinkage.
4.High Thermal Conductivity: With approximately twice the thermal conductivity of traditional PTFE/ceramic laminates, TMM6 facilitates effective heat removal, making it suitable for high-power applications.
5.Immersion Gold Surface Finish: The immersion gold surface finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability.
6.Customizable Design: Available in various thicknesses and copper weights, the TMM6 PCB can be tailored to meet your specific design requirements.
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PCB Specifications
PCB SIZE |
117 x 88mm=1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 17um(0.5 oz)+plate TOP layer |
TMM6 1.270mm |
|
copper ------- 17um(0.5 oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
4 mil / 4 mil |
Minimum / Maximum Holes: |
0.30 mm / 2.0 mm |
Number of Different Holes: |
5 |
Number of Drill Holes: |
2500 |
Number of Milled Slots: |
2 |
Number of Internal Cutouts: |
no |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
TMM6 1.270mm |
Final foil external: |
1.0 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.4mm ±0.1 |
PLATING AND COATING |
|
Surface Finish |
Immersion gold, 59% |
Solder Mask Apply To: |
Top Layer and Bottom Layer |
Solder Mask Color: |
Green |
Solder Mask Type: |
LPI |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Component Side |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Kuangshun |
VIA |
Plated through hole(PTH), minimum size 0.30mm. |
FLAMIBILITY RATING |
94V-0 |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Some Typical Applicationss
The Rogers TMM6 Microwave PCB is designed for a wide range of high-frequency and high-power applications, including:
RF and Microwave Circuitry
Satellite Communication Systems
Global Positioning Systems (GPS) Antennas
Patch Antennas
Power Amplifiers and Combiners
Filters and Couplers
Dielectric Polarizers and Lenses
Chip Testers
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1.Certified Quality: We are ISO9001, ISO14001, IATF16949, ISO13485, and UL certified, ensuring the highest quality standards.
2.18+ Years of Experience: With over 18 years of experience in high-frequency PCB manufacturing, we deliver reliable and innovative solutions.
3.No MOQ Required: We accept small quantity orders with no minimum order quantity (MOQ).
4.On-Time Delivery: Our on-time delivery rate exceeds 98%, with a customer complaint rate of less than 1%.
5.Robust Production Capacity: Our 16,000㎡ workshop produces 30,000㎡ of PCBs monthly, supporting over 8,000 types of PCBs.
Our PCB Capability (TMM6)
PCB Capability (TMM6) |
|
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM6 |
Dielectric constant: |
6 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc.. |
Data Sheet of TMM6
TMM6 Typical Value |
||||||
Property |
TMM6 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
6.0±0.08 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Dielectric Constant,εDesign |
6.3 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor (process) |
0.0023 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Thermal Coefficient of dielectric constant |
-11 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
|
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
|
Volume Resistivity |
2 x 10^8 |
- |
Mohm.cm |
- |
ASTM D257 |
|
Surface Resistivity |
1 x 10^9 |
- |
Mohm |
- |
ASTM D257 |
|
Electrical Strength(dielectric strength) |
362 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
|
Thermal Properties |
||||||
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
|
Coefficient of Thermal Expansion - x |
18 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Y |
18 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Z |
26 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Thermal Conductivity |
0.72 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
|
Mechanical Properties |
||||||
Copper Peel Strength after Thermal Stress |
5.7 (1.0) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
|
Flexural Strength (MD/CMD) |
15.02 |
X,Y |
kpsi |
A |
ASTM D790 |
|
Flexural Modulus (MD/CMD) |
1.75 |
X,Y |
Mpsi |
A |
ASTM D790 |
|
Physical Properties |
||||||
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.06 |
- |
% |
D/24/23 |
ASTM D570 |
3.18mm (0.125") |
0.2 |
|||||
Specific Gravity |
2.37 |
- |
- |
A |
ASTM D792 |
|
Specific Heat Capacity |
0.78 |
- |
J/g/K |
A |
Calculated |
|
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
|