Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Overview of TMM10i
Rogers’ TMM10i thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high reliability in plated-thru-hole stripline and microstrip applications. These laminates combine the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring specialized production techniques.
TMM10i laminates feature an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The isotropic coefficients of thermal expansion are closely matched to copper, allowing for the reliable production of plated-through holes and minimal etch shrinkage. Additionally, the thermal conductivity of TMM10i laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating effective heat removal.
As these laminates are based on thermoset resins, they do not soften when heated. This characteristic enables wire bonding of component leads to circuit traces without concerns about pad lifting or substrate deformation.
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Some Typical Applicationss
1.Chip Testers
2.Dielectric Polarizers and Lenses
3.Filters and Couplers
4.Global Positioning Systems Antennas
5.Patch Antennas
6.Power Amplifiers and Combiners
7.RF and Microwave Circuitry
8.Satellite Communication Systems
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PCB Capabilities
Our PCB Capability (TC350) |
|
PCB Material: |
Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
Designation: |
TC350 |
Dielectric constant: |
3.5±0.05 |
Thermal Conductivity |
0.72 W/m-K |
Dissipation Factor |
Df .002@10 GHz |
Layer count: |
Single Layer, Double Layer, Multi-layer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc.. |
Typical Applications
1.Microwave combiners and power dividers
2.Power amplifiers, filters, and couplers
3.Tower-mounted amplifiers (TMA) and tower-mounted boosters (TMB)
4.Thermally cycled antennas sensitive to dielectric drift
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Typical Properties of TC350
Typical Properties:TC350 |
|||
Property |
Units |
Value |
Test Merthod |
1. Electrical Properties |
|
||
Dielectric Constant (may vary by thickness) |
|
|
|
@1 MHz |
－ |
3.50 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
3.50 |
RESONANT CAVITY |
@10 GHz |
－ |
3.50 |
IPC TM-650 2.5.5.5 |
Dissipation Factor |
|
|
|
@1 MHz |
－ |
0.0015 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
0.0018 |
RESONANT CAVITY |
@10 GHz |
－ |
0.0020 |
IPC TM-650 2.5.5.5 |
Temperature Coefficient of Dielectric |
－ |
|
|
TC r @ 10 GHz (-40-150°C) |
ppm/ºC |
-9 |
IPC TM-650 2.5.5.5 |
Volume Resistivity |
|
|
|
C96/35/90 |
MΩ-cm |
7.4x106 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ-cm |
1.4x108 |
|
Surface Resistivity |
|
|
|
C96/35/90 |
MΩ |
3.2x107 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ |
4.3x108 |
IPC TM-650 2.5.17.1 |
Electrical Strength |
Volts/mil (kV/mm) |
780 (31) |
IPC TM-650 2.5.6.2 |
Dielectric Breakdown |
kV |
40 |
IPC TM-650 2.5.6 |
Arc Resistance |
sec |
>240 |
IPC TM-650 2.5.1 |
2.Thermal Properties |
|
||
Decomposition Temperature (Td) |
|
|
|
Initial |
°C |
520 |
IPC TM-650 2.4.24.6 |
5% |
°C |
567 |
IPC TM-650 2.4.24.6 |
T260 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T288 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T300 |
min |
>60 |
IPC TM-650 2.4.24.1 |
Thermal Expansion, CTE (x,y) 50-150ºC |
ppm/ºC |
7, 7 |
IPC TM-650 2.4.41 |
Thermal Expansion, CTE (z) 50-150ºC |
ppm/ºC |
23 |
IPC TM-650 2.4.24 |
% z-axis Expansion (50-260ºC) |
% |
1.2 |
IPC TM-650 2.4.24 |
3. Mechanical Properties |
|
||
Peel Strength to Copper (1 oz/35 micron) |
|
|
|
After Thermal Stress |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
At Elevated Temperatures (150ºC) |
lb/in (N/mm) |
9 (1.6) |
IPC TM-650 2.4.8.2 |
After Process Solutions |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
Young’s Modulus |
kpsi (MPa) |
|
IPC TM-650 2.4.18.3 |
Flexural Strength (Machine/Cross) |
kpsi (MPa) |
14/10 (97/69) |
IPC TM-650 2.4.4 |
Tensile Strength (Machine/Cross) |
kpsi (MPa) |
11/8 (76/55) |
IPC TM-650 2.4.18.3 |
Compressive Modulus |
kpsi (MPa) |
|
ASTM D-3410 |
Poisson’s Ratio |
－ |
|
ASTM D-3039 |
4. Physical Properties |
|
||
Water Absorption |
% |
0.05 |
IPC TM-650 2.6.2.1 |
Density, ambient 23ºC |
g/cm3 |
2.30 |
ASTM D792 Method A |
Thermal Conductivity |
W/mK |
0.72 |
ASTM D5470 |
Specific Heat |
J/gK |
0.90 |
ASTM D5470 |
Flammability |
class |
V-0 |
UL-94 |
NASA Outgassing, 125ºC, ≤10- 6 torr |
|
|
|
Total Mass Loss |
% |
0.02 |
NASA SP-R-0022A |
Collected Volatiles |
% |
0.01 |
NASA SP-R-0022A |
Water Vapor Recovered |
% |
0.01 |
NASA SP-R-0022A |