TC600 Microwave PCB - 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
The TC600 Microwave PCB is a high-performance circuit board designed for applications requiring enhanced thermal conductivity and low dielectric loss. Built on Rogers' (Arlon) TC600 laminates, this PCB features a woven fiberglass-reinforced, ceramic-filled PTFE composite. With a thermal conductivity of 1.1 W/mk, the TC600 PCB provides superior heat dissipation, reduces hot spots, and improves device reliability. Its stable dielectric constant across a wide temperature range (-75 ppm/°C from -40°C to 140°C) ensures consistent performance, making it ideal for power amplifiers and antennas. The immersion silver surface finish offers excellent solderability and corrosion resistance.
Features
1.Very Low Loss Tangent (0.002 at 10 GHz): Enhances amplifier and antenna efficiency.
2.Mechanical Robustness: Improves processing and reliability, replacing brittle laminates.
3.Low Coefficient of Thermal Expansion (CTE): Matches active components for low-stress solder joints (X, Y: 9 ppm/°C; Z: 35 ppm/°C).
4.High Peel Strength: Ensures reliable narrow lines and robust circuit performance.
Benefits
1.Reduced Heat Generation: Minimizes transmission line loss.
2.Heat Dissipation and Management: Enhances thermal performance and device reliability.
3.Ceramic Replacement: Suitable for replacing ceramics in certain applications.
4.Large Panel Sizes: Allows multiple circuit layouts, reducing processing costs.
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Typical Applications
1.Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
2.GPS & Hand-held RFID Reader Antennas
3.Microwave Combiner and Power Divider Boards in Avionics Applications
4.Power Amplifiers, Filters, and Couplers
5.Small Footprint Antennas
Our PCB Capability (TC600)
| PCB Capability (TC600) | |
| PCB Material: | Ceramic Filled PTFE/Woven Fiberglass |
| Designation: | TC600 |
| Dielectric constant: | 6.15 (10 GHz) |
| Dissipation Factor | 0.002 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, Immersion gold, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc.. |
Appendix: Typical Properties of TC600
| Property | Unit | Value | Test Method |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1.8 MHz | - | 6.15 | Resonant Cavity |
| @10 GHz | - | 6.15 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @1.8 GHz | - | 0.0017 | Resonant Cavity |
| @10 GHz | - | 0.002 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | - | ||
| TCεr @ 10 GHz (-40-150°C) | ppm/ºC | -75 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 1.6x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 2.4x108 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 3.1x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 9.0x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 850 (34) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | 62 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
| 2. Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | °C | 512 | IPC TM-650 2.4.24.6 |
| 5% | °C | 572 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 9, 9 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 35 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | 1.5 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | 10 (1.8) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) | lb/in (N/mm) | 10 (1.8) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8 |
| Young’s Modulus | kpsi (MPa) | 280 (1930) | IPC TM-650 2.4.18.3 |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 9.60/9.30 (66/64) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 5.0/4.30 (34/30) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (MPa) | ASTM D-3410 | |
| Poisson’s Ratio | - | ASTM D-3039 | |
| 4. Physical Properties | |||
| Water Absorption | % | 0.02 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 2.9 | ASTM D792 Method A |
| Thermal Conductivity (z-axis) | W/mK | 1.1 | ASTM E1461 |
| Thermal Conductivity (x, y) | W/mK | 1.4 | ASTM E1461 |
| Specific Heat | J/gK | 0.94 | ASTM E1461 |
| Flammability | class | V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10-6 torr | |||
| Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
| Collected Volatiles | % | 0 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0 | NASA SP-R-0022A |