TMM3 High Frequency PCB, 20mil 0.508mm Microwave PCB, DK3.27 with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
we are excited to introduce our latest innovation in high-frequency PCB technology – the TMM3 High Frequency PCB, 20mil 0.508mm Microwave PCB with DK3.27 and Immersion Gold. Designed for demanding applications in RF and microwave circuitry, this double-layer PCB offers exceptional performance, reliability, and precision, making it an ideal choice for advanced electronic systems.
Why Choose TMM3 High Frequency PCB?
1.High-Frequency Performance: Built on a 20mil TMM3 substrate with a dielectric constant (DK) of 3.27, this PCB is optimized for high-frequency applications, ensuring minimal signal loss and superior performance.
2.Immersion Gold Surface Finish: The immersion gold surface finish provides excellent conductivity, corrosion resistance, and solderability, making it ideal for high-reliability applications.
3.IPC Class 3 Standards: Manufactured according to IPC Class 3 standards, this PCB meets the highest quality and reliability requirements, ensuring durability in even the most demanding environments.
4.Customizable Design: With a green solder mask on the top layer and an open bottom layer, this PCB is designed for flexibility and can be tailored to meet specific application needs.
5.Wide Range of Applications: From patch antennas to satellite communication systems, this PCB is versatile and suitable for a variety of high-frequency applications.
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PCB Specifications
PCB SIZE |
35 x 51mm=1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 17um(0.5 oz)+plate TOP layer |
TMM3 0.508mm |
|
copper ------- 17um(0.5 oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
5 mil / 5 mil |
Minimum / Maximum Holes: |
0.40 mm / 2.50 mm |
Number of Different Holes: |
3 |
Number of Drill Holes: |
3 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
no |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
TMM3 0.508mm |
Final foil external: |
1.0 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.68 mm ±0.1 |
PLATING AND COATING |
|
Surface Finish |
Immersion gold, 99% |
Solder Mask Apply To: |
Top Layer |
Solder Mask Color: |
Green |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.40mm. |
FLAMIBILITY RATING |
94V-0 |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Applications:
Our TMM3 High Frequency PCB is designed for a wide range of applications, including:
Patch Antennas
RF and Microwave Circuitry
Satellite Communication Systems
Global Positioning Systems (GPS) Antennas
Power Amplifiers and Combiners
Filters and Couplers
Dielectric Polarizers and Lenses
Chip Testers
Why Partner With Us?
Global Availability: We ship worldwide, ensuring you get the products you need, no matter where you are.
High-Quality Standards: Our PCBs are manufactured to meet IPC-Class-3 standards, ensuring top-notch quality and reliability.
Custom Solutions: We work closely with our clients to provide tailored solutions that meet their unique requirements.
Our PCB Capability (TMM3)
PCB Capability (TMM3) |
|
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM3 |
Dielectric constant: |
3.27 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc.. |
Get in Touch!
If you're looking for a reliable, high-performance PCB solution for high-frequency applications, our TMM3 High Frequency PCB is the answer. Contact us today to learn more about how this innovative product can benefit your projects.
Data Sheet of TMM3
TMM3 Typical Value |
||||||
Property |
TMM3 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
3.27±0.032 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Dielectric Constant,εDesign |
3.45 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor (process) |
0.002 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Thermal Coefficient of dielectric constant |
+37 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
|
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
|
Volume Resistivity |
2 x 109 |
- |
Mohm.cm |
- |
ASTM D257 |
|
Surface Resistivity |
>9x 10^9 |
- |
Mohm |
- |
ASTM D257 |
|
Electrical Strength(dielectric strength) |
441 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
|
Thermal Properties |
||||||
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
|
Coefficient of Thermal Expansion - x |
15 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Y |
15 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Z |
23 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Thermal Conductivity |
0.7 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
|
Mechanical Properties |
||||||
Copper Peel Strength after Thermal Stress |
5.7 (1.0) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
|
Flexural Strength (MD/CMD) |
16.53 |
X,Y |
kpsi |
A |
ASTM D790 |
|
Flexural Modulus (MD/CMD) |
1.72 |
X,Y |
Mpsi |
A |
ASTM D790 |
|
Physical Properties |
||||||
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.06 |
- |
% |
D/24/23 |
ASTM D570 |
3.18mm (0.125") |
0.12 |
|||||
Specific Gravity |
1.78 |
- |
- |
A |
ASTM D792 |
|
Specific Heat Capacity |
0.87 |
- |
J/g/K |
A |
Calculated |
|
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
|