(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Overview of RF-60A
RF-60A is an organic-ceramic laminate from Taconic, part of the ORganic CERamic (ORCER) family. It features woven glass reinforcement and combines Taconic's expertise in ceramic fill technology with coated PTFE fiberglass. RF-60A is renowned for its exceptional interlaminar bond strength and solder resistance, with a proprietary composition that results in low moisture absorption and uniform electrical properties.
RF-60A's woven glass reinforcement ensures excellent dimensional stability and enhances flexural strength. It has low Z-axis expansion, which allows for reliable plated-through holes in extreme thermal environments. With a dielectric constant of approximately 6.15, it is ideal for high DK applications that require reduced circuit size and weight. Its low electrical loss factor makes it an excellent choice for RF circuits.
RF-60A laminates fully comply with RoHS and WEEE directives and are compatible with the temperatures required for new lead-free solders. They can be sheared, drilled, milled, and plated using standard methods for PTFE-woven fiberglass materials, enabling efficient mass production.
Benefits
Low Moisture Absorption: Minimizes the risk of delamination and enhances stability.
Stable Dielectric Constant (DK) over Frequency: Maintains consistent electrical properties across various frequencies.
Dimensionally Stable: Ensures reliable performance in diverse environmental conditions.
Low Z-axis Expansion: Improves reliability for plated-through-hole applications in extreme thermal conditions.
High Flexural Strength: Provides durability and resistance to mechanical stress.
Exceptional Interlaminar Bonds: Guarantees strong internal connections within the laminate.
Typical Applications
1.Power amplifiers
2.Filters & couplers
3.Passive components
4.Antennas
Our PCB Capabilities (RF-60A)
Our PCB Capability (RF-60A) |
|
PCB Material: |
Organic-ceramic Woven Fiberglass Reinforced Laminates |
Designation: |
RF-60A |
Dielectric constant: |
6.15 ±0.25 |
Dissipation Factor |
DF 0.0038@10 GHz |
Thermal Conductivity |
0.4 W/MK |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 25mil (0.635mm), 31mil (0.787mm), 50mil (1.27mm), 60mil (1.524mm), 125mil (3.175mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold, etc.. |
Data Sheet of Taconic RF-60A
RF-60A Typical Values |
|||||
Property |
Test Method |
Unit |
Value |
Unit |
Value |
Dk @ 10 GHz |
IPC-650 2.5.5.6 |
|
6.15 |
|
6.15 |
Df @ 10 GHz |
IPC-650 2.5.5.5.1 |
|
0.0038 |
|
0.0038 |
Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.02 |
% |
0.02 |
Dielectric Breakdown |
IPC-650 2.5.6 |
kV |
53 |
kV |
53 |
Dielectric Strength |
ASTM D 149 |
V/mil |
880 |
kV/mm |
35 |
Volume Resistivity |
IPC-650 2.5.17.1 (After Humidity) |
Mohm/cm |
9.0 x 108 |
Mohm/cm |
9.0 x 108 |
Surface Resistivity |
IPC-650 2.5.17.1 (After Humidity) |
Mohm |
2.28 x 108 |
Mohm |
2.28 x 108 |
Arc Resistance |
IPC-650 2.5.1 |
Seconds |
193 |
Seconds |
193 |
Flexural Strength (MD) |
ASTM D 790 |
psi |
18,300 |
N/mm2 |
126.2 |
Flexural Strength (CD) |
ASTM D 790 |
psi |
14,600 |
N/mm2 |
100.7 |
Tensile Strength (MD) |
ASTM D 3039 |
psi |
19,500 |
N/mm2 |
134.4 |
Tensile Strength (CD) |
ASTM D 3039 |
psi |
16,300 |
N/mm2 |
112.4 |
Young’s Modulus |
ASTM D 3039 |
kpsi |
1,590 |
N/mm2 |
11,000 |
Poisson’s Ratio |
ASTM D 3039 |
|
0.068 |
N/mm2 |
0.068 |
Compressive Modulus |
ASTM D 695 (23°C) |
kpsi |
338 |
|
2,330 |
Peel Strength (1 oz. ED) |
IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) |
lbs/in |
8 |
N/mm |
1.4 |
Dimensional Stability (MD) |
IPC-650 2.4.39 Sec. 5.4 (After Bake) |
mils/in |
0.68 |
mm/M |
0.68 |
Dimensional Stability (CD) |
IPC-650 2.4.39 Sec. 5.4 (After Bake) |
mils/in |
1.05 |
mm/M |
1.05 |
Density (Specific Gravity) |
ASTM D 792 |
g/cm3 |
2.79 |
g/cm3 |
2.79 |
Thermal Conductivity |
ASTM F 433 |
W/M*K |
0.4 |
W/M*K |
0.4 |
CTE (X axis) |
ASTM D 3386 (-30°C - 125°C) |
ppm/°C |
9 |
ppm/°C |
9 |
CTE (Y axis) |
ASTM D 3386 (-30°C - 125°C) |
ppm/°C |
8 |
ppm/°C |
8 |
CTE (Z axis) |
ASTM D 3386 (-30°C - 125°C) |
ppm/°C |
69 |
ppm/°C |
69 |
Outgassing (% TML) |
ASTM E 595* |
% |
0.02 |
% |
0.02 |
Outgassing (% CVCM) |
ASTM E 595* |
% |
0.00 |
% |
0.00 |
Outgassing (% WVR) |
ASTM E 595* |
% |
0.01 |
% |
0.01 |
Flammability Rating |
UL 94 |
|
V-0 |
|
V-0 |