Home > Taconic PCB > Taconic TLY-3 High-Frequency PCB, 30mil 0.762mm, Microwave Circuit Board with Immersion Gold
Taconic TLY-3 High-Frequency PCB, 30mil 0.762mm, Microwave Circuit Board with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


In the rapidly advancing field of electronics, high-frequency PCBs are essential for enabling cutting-edge technologies. The Taconic TLY-3 High-Frequency PCB, with a thickness of 30mil (0.762mm), is a standout choice for engineers and designers working on RF and microwave applications. This double-sided PCB, featuring immersion gold surface finish, is designed to deliver exceptional performance in demanding environments.


Key Features of Taconic TLY-3 PCB

1.Low Dielectric Constant (DK2.17 - 2.20): The TLY-3 material is optimized for high-frequency applications, ensuring minimal signal loss and superior performance in RF and microwave circuits. Its low DK makes it ideal for applications requiring high signal integrity.
2.Low Dissipation Factor (0.0009): The TLY-3 PCB ensures efficient signal transmission, making it suitable for applications that require high signal integrity, such as 5G and satellite communications.
3.Immersion Gold Surface Finish: The immersion gold finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability in harsh environments.
4.Dimensionally Stable: The woven fiberglass construction provides greater dimensional stability compared to chopped fiber-reinforced PTFE composites, making it suitable for high-volume manufacturing.
5.Low Moisture Absorption: The TLY-3 material has low moisture absorption, ensuring stable performance in various environmental conditions.
6.High Copper Peel Strength: The material offers high copper peel strength, ensuring reliable performance in high-stress applications.



PCB Specifications

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Taconic TLY-3 30mil 0.762mm RF Antenna PCB DK2.33 High Frequency PCB for Satellite / Cellular Communications

PCB SIZE

100 x 90mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

TLY-3 0.762mm

copper ------- 18um(0.5 oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

4 mil / 4 mil

Minimum / Maximum Holes:

0.4mm

Number of Different Holes:

1

Number of Drill Holes:

1

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

TLY-3 0.762mm

Final foil external:

1oz

Final foil internal:

N/A

Final height of PCB:

0.8 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold (31%)

Solder Mask Apply To:

NO

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

Top Side

Colour of Component Legend

white

Manufacturer Name or Logo:

Marked on the board in a conductor and legend FREE AREA

VIA

N/A

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


Applications

The Taconic TLY-3 PCB is well-suited for a variety of high-frequency and high-power applications, including:

1.Automotive Radar: Ideal for 77 GHz automotive radar applications.
2.Satellite and Cellular Communications: Ensures reliable performance in space and terrestrial communication systems.
3.Power Amplifiers: Delivers efficient power handling and signal integrity.
4.LNBs, LNAs, and LNCs: Suitable for low-noise block downconverters, low-noise amplifiers, and low-noise converters.
5.Aerospace Applications: Provides stable performance in aerospace environments.
6.Ka, E, and W Band Applications: Ensures precise signal transmission in millimeter-wave frequencies.



Why Choose Taconic TLY-3?

Proven Performance: With a low dielectric constant and low dissipation factor, the TLY-3 PCB is designed to meet the demands of high-frequency and high-power applications.
Thermal Stability: Its thermal properties ensure reliable performance even under extreme conditions, making it a trusted choice for engineers.
Versatility: Available in multiple thicknesses and customizable to specific design needs, the TLY-3 PCB is suitable for a wide range of applications.
Global Availability: Ready to ship worldwide, ensuring timely delivery for your projects.


Data Sheet of Taconic TLY Material

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TLY TYPICAL VALUES

Property

Test Method

Unit

Value

Unit

Value

DK at 10 GHz

IPC-650 2.5.5.5

 

2.2

 

2.2

Df at 10 GHz

IPC-650 2.5.5.5

 

0.0009

 

0.0009

Moisture Absorption

IPC-650 2.6.2.1

%

0.02

%

0.02

Dielectric Breakdown

IPC-650 2.5.6

kV

>45

kV

>45

Dielectric Strength

ASTM D 149

V/mil

2,693

V/mil

106,023

Volume Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms/cm

1010

Mohms/cm

1010

Volume Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms/cm

1010

Mohms/cm

109

Surface Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms

108

Mohms

108

Surface Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms

108

Mohms

108

Flex Strength(MD)

IPC-650 2.4.4

psi

14,057

N/mm2

96.91

Flex Strength(CD)

IPC-650 2.4.4

psi

12,955

N/mm2

89.32

Peel Stength(½ oz.ed copper)

IPC-650 2.4.8

Ibs./inch

11

N/mm

1.96

Peel Stength(1 oz.CL1 copper)

IPC-650 2.4.8

Ibs./inch

16

N/mm

2.86

Peel Stength(1 oz..CV1 copper)

IPC-650 2.4.8

Ibs./inch

17

N/mm

3.04

Peel Stength

IPC-650 2.4.8(after elevated temp.)

Ibs./inch

13

N/mm

2.32

Young's Modulus(MD)

ASTM D 3039/IPC-650 2.4.19

psi

1.4 x 106

N/mm2

9.65 x 103

Poisson's Ratio(MD)

ASTM D 3039/IPC-650 2.4.19

 

0.21

 

0.21

Thermal Conductivity

ASTM F 433

W/M*K

0.22

W/M*K

0.22

Dimensional Stability(MD,10mil)

IPC-650 2.4.39(avg.after bake&thermal stress)

mils/inch

-0.038

 

-0.038

Dimensional Stability(CD,10mil)

IPC-650 2.4.39(avg.after bake&thermal stress)

mils/inch

-0.031

 

-0.031

Density(Specific Gravity)

ASTM D 792

g/cm3

2.19

g/cm3

2.19

CTE(X axis)(25-260℃)

ASTM D 3386(TMA)

ppm/℃

26

ppm/℃

26

CTE(Y axis)(25-260℃)

ASTM D 3386(TMA)

ppm/℃

15

ppm/℃

15

CTE(Z axis)(25-260℃)

ASTM D 3386(TMA)

ppm/℃

217

ppm/℃

217

NASA Outgassing(% TML)

 

 

0.01

 

0.01

NASA Outgassing(% CVCM)

 

 

0.01

 

0.01

NASA Outgassing(% WVR)

 

 

0.00

 

0.00

UL-94 Flammability Rating

UL-94

 

V-0

 

V-0



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