Taconic TLF-35 Microwave Printed Circuit Board 30mil 0.762mm TLF-35 RF PCB with OSP
(Printed Circuit Boards are custom-made products; the picture and parameters shown are just for reference)
Overview of TLF-35A
TLF-35A is an economical RF material designed for low-cost, high-volume commercial microwave and radio frequency applications. This laminate is particularly noted for its excellent peel strength with 1/2 ounce and 1 ounce copper, surpassing standard epoxy materials. This quality is crucial for rework situations.
The TLF-35A features an extremely low moisture absorption rate and a low dissipation factor, which helps to reduce phase shift across frequencies. Its design incorporates woven fabrics, ensuring excellent dimensional stability. Additionally, TLF-35A materials have a flammability rating of V-0 and are tested according to IPC-TM-650 standards.
The dielectric constant of TLF-35A is low at 3.5 ± 0.05, with a minimal dissipation factor of 0.002.
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Key Benefits:
1.Cost-Effective: Ideal for budget-sensitive projects.
2.Exceptional Peel Strength: Ensures reliability during rework.
3.Ultra-Low Dissipation Factor: Minimizes phase shift across frequencies.
4.Low Moisture Absorption: Maintains performance in varying environmental conditions.
5.High Thermal Reliability: Suitable for demanding thermal environments.
Typical Applications:
Filters, couplers, splitters, combiners, and mixers
Antennas
High Power Amplifiers, TMAs, TMBs, LNAs
Repeaters
Passive RF components
Medical scanners
PCB Specifications:
Taconic TLF-35 30mil 0.762mm RF Antenna PCB for Size Effective Antenna |
|
PCB SIZE |
90 x 79mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35um(1 oz)+plate TOP layer |
TLF-35 0.762mm |
|
copper ------- 35um(1oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
6 mil / 6 mil |
Minimum / Maximum Holes: |
0.4mm/2.2mm |
Number of Different Holes: |
0 |
Number of Drill Holes: |
0 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
TLF-35 0.762mm |
Final foil external: |
1.5 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.9mm |
PLATING AND COATING |
|
Surface Finish |
OSP |
Solder Mask Apply To: |
NO |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Appendix: Typical Values of TLF-35
TLF-35A Typcial Value |
|||||
Property |
Test Method |
Units |
Value |
Units |
Value |
Dielectric Constant @ 1.9 GHz |
IPC-TM650 2.5.5.5.1 Mod |
|
3.50 ±0.05 |
|
3.50 ±0.05 |
Dissipation Factor @ 1.9 GHz |
IPC-TM650 2.5.5.5.1 Mod |
|
0.0016 |
|
0.0016 |
Dissipation Factor @ 10 GHz |
IPC-TM650 2.5.5.5.1 Mod |
|
0.0022 |
|
0.0022 |
Water Absorption |
IPC-TM 650 2.6.2.1 |
% |
0.03 |
% |
0.03 |
Peel Strength (1 oz. copper) |
IPC-TM 650 2.4.8 |
Lbs./linear inch |
10 |
N/mm |
1.8 |
Volume Resistivity |
IPC-TM 650 2.5.17.1 |
Mohm·cm |
2.0 x 1099 |
Mohm·cm |
2.0 x 109 |
Surface Resistivity |
IPC-TM 650 2.5.17.1 |
Mohm |
3.0 x 108 |
Mohm |
3.0 x 108 |
Flexural Strength Lengthwise |
IPC-TM 650 650 2.4.4 |
psi |
13000 |
N/mm2 |
90 |
Flexural Strength Crosswise |
IPC-TM 650 650 2.4.4 |
psi |
13000 |
N/mm2 |
90 |
Thermal Conductivity |
IPC-TM 650 2.4.50 |
W/m/K |
0.37 |
W/m/K |
0.37 |
x-y CTE (50 ~ 150℃) |
IPC-TM 650 2.4.41 |
ppm/℃ |
9-12 |
ppm/℃ |
9-12 |
z CTE (50 ~ 150℃) |
IPC-TM 650 2.4.41 |
ppm/℃ |
80 |
ppm/℃ |
80 |
Flammability |
UL-94 |
|
V-0 |
|
V-0 |