Taconic TLY-5 High Frequency Printed Circuit Board TLY-5 7.5mil 0.191mm RF PCB Taconic DK2.2 PCB with Immersion Silver
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Overview of TLY laminate:
Taconic TLY laminates represent advanced low-loss materials designed for high frequency applications. Constructed with lightweight woven fiberglass, these laminates offer superior dimensional stability compared to traditional chopped fiber reinforced PTFE composites. The woven structure enhances mechanical stability, making it ideal for high-volume manufacturing.
The low dissipation factor (DF) of TLY laminates facilitates their use in automotive radar applications operating at 77 GHz, as well as in various antennas for millimeter wave frequencies.
Dielectric Properties:
.Dielectric Constant: 2.17 - 2.20 ± 0.02
.Dissipation Factor: ≤ 0.0009
Benefits of Taconic TLY-5:
.Dimensionally stable
.Lowest DF
.Low moisture absorption
.High copper peel strength
.Uniform & consistent DK
.Laser ablatable
Typical Applications
- Automotive radar systems
- Satellite and cellular communications
- Power amplifiers
- LNBs, LNAs, LNCs
- Aerospace applications
- Ka, E, and W band technologies
.jpg)
PCB Specifications:
Taconic TLY-5 7.5mil 0.191mm RF Antenna PCB DK2.2 High Frequency PCB for Automotive Radar |
|
PCB SIZE |
76 x 51mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
TLY-5 0.191mm |
|
copper ------- 18um(0.5 oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
10 mil / 10 mil |
Minimum / Maximum Holes: |
0.4mm / 2.0mm |
Number of Different Holes: |
0 |
Number of Drill Holes: |
0 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
TLY-5 |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.25 mm ±0.1 |
PLATING AND COATING |
|
Surface Finish |
OSP |
Solder Mask Apply To: |
NO |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Bicheng specializes in offering prototype, small-batch, and mass production services.
If you have any questions, please feel free to contact us. Thank you for reading!
Appendix:Typical Values of TLY
TLY TYPICAL VALUES |
|||||
Property |
Test Method |
Unit |
Value |
Unit |
Value |
DK at 10 GHz |
IPC-650 2.5.5.5 |
|
2.2 |
|
2.2 |
Df at 10 GHz |
IPC-650 2.5.5.5 |
|
0.0009 |
|
0.0009 |
Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.02 |
% |
0.02 |
Dielectric Breakdown |
IPC-650 2.5.6 |
kV |
>45 |
kV |
>45 |
Dielectric Strength |
ASTM D 149 |
V/mil |
2,693 |
V/mil |
106,023 |
Volume Resistivity |
IPC-650 2.5.17.1(after elevated temp.) |
Mohms/cm |
1010 |
Mohms/cm |
1010 |
Volume Resistivity |
IPC-650 2.5.17.1(after humidity) |
Mohms/cm |
1010 |
Mohms/cm |
109 |
Surface Resistivity |
IPC-650 2.5.17.1(after elevated temp.) |
Mohms |
108 |
Mohms |
108 |
Surface Resistivity |
IPC-650 2.5.17.1(after humidity) |
Mohms |
108 |
Mohms |
108 |
Flex Strength(MD) |
IPC-650 2.4.4 |
psi |
14,057 |
N/mm2 |
96.91 |
Flex Strength(CD) |
IPC-650 2.4.4 |
psi |
12,955 |
N/mm2 |
89.32 |
Peel Stength(½ oz.ed copper) |
IPC-650 2.4.8 |
Ibs./inch |
11 |
N/mm |
1.96 |
Peel Stength(1 oz.CL1 copper) |
IPC-650 2.4.8 |
Ibs./inch |
16 |
N/mm |
2.86 |
Peel Stength(1 oz..CV1 copper) |
IPC-650 2.4.8 |
Ibs./inch |
17 |
N/mm |
3.04 |
Peel Stength |
IPC-650 2.4.8(after elevated temp.) |
Ibs./inch |
13 |
N/mm |
2.32 |
Young's Modulus(MD) |
ASTM D 3039/IPC-650 2.4.19 |
psi |
1.4 x 106 |
N/mm2 |
9.65 x 103 |
Poisson's Ratio(MD) |
ASTM D 3039/IPC-650 2.4.19 |
|
0.21 |
|
0.21 |
Thermal Conductivity |
ASTM F 433 |
W/M*K |
0.22 |
W/M*K |
0.22 |
Dimensional Stability(MD,10mil) |
IPC-650 2.4.39(avg.after bake&thermal stress) |
mils/inch |
-0.038 |
|
-0.038 |
Dimensional Stability(CD,10mil) |
IPC-650 2.4.39(avg.after bake&thermal stress) |
mils/inch |
-0.031 |
|
-0.031 |
Density(Specific Gravity) |
ASTM D 792 |
g/cm3 |
2.19 |
g/cm3 |
2.19 |
CTE(X axis)(25-260℃) |
ASTM D 3386(TMA) |
ppm/℃ |
26 |
ppm/℃ |
26 |
CTE(Y axis)(25-260℃) |
ASTM D 3386(TMA) |
ppm/℃ |
15 |
ppm/℃ |
15 |
CTE(Z axis)(25-260℃) |
ASTM D 3386(TMA) |
ppm/℃ |
217 |
ppm/℃ |
217 |
NASA Outgassing(% TML) |
|
|
0.01 |
|
0.01 |
NASA Outgassing(% CVCM) |
|
|
0.01 |
|
0.01 |
NASA Outgassing(% WVR) |
|
|
0.00 |
|
0.00 |
UL-94 Flammability Rating |
UL-94 |
|
V-0 |
|
V-0 |