DiClad 870 Electronics PCB Material for High-Frequency Board Design
Brief Introduction
DiClad laminates are woven fiberglass/PTFE composite materials used as printed circuit board substrates. They provide greater dimensional stability compared to nonwoven fiberglass reinforced PTFE laminates of similar dielectric constants. The consistency and control of the PTFE coated fiberglass cloth result in better dielectric constant uniformity. DiClad laminates are frequently used in filter, coupler, low noise amplifier, power divider, and combiner applications where dielectric constant uniformity and low loss are critical.
Technical Features & Benefits
Woven fiberglass reinforcement for superior dimensional stability
Controlled PTFE/fiberglass ratio for consistent dielectric properties
Low dielectric constant and dissipation factor
Excellent dielectric constant uniformity
Suitable for high-frequency and low-loss applications
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Typical Properties:RT/duroid 5870
| Properties | Test Conditions | Typical Value | Units | Test Method |
|---|---|---|---|---|
| ELECTRICAL PROPERTIES | ||||
| Dielectric Constant | 23°C @ 50% RH, 10 GHz | 2.33 | - | IPC TM-650 2.5.5.5 |
| Dielectric Constant | 23°C @ 50% RH, 1 MHz | 2.33 | - | IPC TM-650 2.5.5.3 |
| Dissipation Factor | 23°C @ 50% RH, 10 GHz | 0.0013 | - | IPC TM-650 2.5.5.5 |
| Dissipation Factor | 23°C @ 50% RH, 1 MHz | 0.0009 | - | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Dielectric Constant | -10 to 140°C, 10 GHz | -161 | ppm/°C | IPC TM-650 2.5.5.5 |
| Volume Resistivity | C96/35/90 | 1.5 x 10⁹ | MΩ-cm | IPC TM-650 2.5.17.1 |
| Surface Resistivity | C96/35/90 | 3.4 x 10⁷ | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Breakdown | D48/50 | >45 | kV | ASTM D-149 |
| Arc Resistance | - | >180 | - | ASTM D-495 |
| THERMAL PROPERTIES | ||||
| Coefficient of Thermal Expansion - x | 50°C to 150°C | 17 | ppm/°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 50°C to 150°C | 29 | ppm/°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 50°C to 150°C | 217 | ppm/°C | IPC TM-650 2.4.24 |
| Thermal Conductivity | - | 0.26 | W/(m·K) | ASTM E1461 |
| MECHANICAL PROPERTIES | ||||
| Copper Peel Strength | 10s @ 288°C, 35 μm foil | 14 | lbs/in | IPC TM-650 2.4.8 |
| Young's Modulus | 23°C @ 50% RH | 485, 346 | kpsi | ASTM D-638 |
| Tensile Strength (MD, CMD) | 23°C @ 50% RH | 14.9, 11.2 | kpsi | ASTM D-882 |
| Compressive Modulus | 23°C @ 50% RH | 327 | kpsi | ASTM D-695 |
| Flex Modulus | 23°C @ 50% RH | 437 | kpsi | ASTM D-3039 |
| PHYSICAL PROPERTIES | ||||
| Flammability | C48/23/50 & C168/70 | V-0 | - | UL 94 |
| Moisture Absorption | E1/105+D24/23 | 0.02 | % | IPC TM-650 2.6.2.2 |
| Density | C24/23/50, Method A | 2.26 | g/cm³ | ASTM D792 |
| NASA Outgassing - Total Mass Lost | 125°C, ≤10⁻⁶ torr | 0.02 | % | NASA SP-R-0022A |
| NASA Outgassing - Collected Volatiles | 125°C, ≤10⁻⁶ torr | 0.00 | % | NASA SP-R-0022A |
| NASA Outgassing - Water Vapor Recovered | 125°C, ≤10⁻⁶ torr | 0.01 | % | NASA SP-R-0022A |
Application Areas
Filters
Couplers
Low Noise Amplifiers (LNAs)
Power Dividers and Combiners
Applications requiring dielectric constant uniformity and low loss
Avalable Configurations
Typical Thicknesses:
0.031" (0.79mm) ±0.0020"
0.093" (2.36mm) ±0.0030"
0.125" (3.18mm) ±0.0060"
Available Sheet Sizes:
8" x 12" (203 x 305mm)
18" x 24" (475 x 610mm)
Standard Claddings:
Electrodeposited Copper Foil: 1/2 oz. (18µm), 1 oz. (35µm)
Rolled Copper Foil: 1/2 oz. (18µm), 1 oz. (35µm)
Why Choose Us?
1. Engineering design prevents problems from occurring in pre-production;
2. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
3. AOI inspection;
4. Delivery on time higher than 98% on-time-delivery rate;
5. 16000m2 workshop;
6. 30000m2 output capability per month;
7. 8000 types of PCB's per month;
8. Quick CADCAM checking and free PCB quotation;
9. More than 18+ years of PCB experience;
10. Customer complaint rate: <1%
