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Rogers CLTE-XT DK2.79-2.94 Df0.0010 (0.0051-0.030") PTFE/Ceramic/Woven Glass Laminate
Brief Introduction
CLTE-XT laminates are ceramic-filled, woven glass reinforced PTFE composites designed for high-frequency circuit applications requiring ultra-low loss. These materials offer excellent dimensional stability and low planar CTE, providing consistent performance for demanding applications. CLTE-XT laminates are available with a full range of cladding types and have proven performance that makes them a top choice for ground-based and airborne communications and radar systems.
Technical Features & Benefits
- Dielectric Constant (process): 2.79 to 2.94 (varies by thickness, see table below)
- Dielectric Constant (design): 2.93
- Ultra-low dissipation factor: 0.0010 @ 10 GHz
- Low planar CTE: X-axis 12.7 ppm/°C, Y-axis 13.7 ppm/°C
- Very low Z-axis CTE: 40.8 ppm/°C for reliable plated through holes
- Excellent dimensional stability
- High electrical strength: 1000 V/mil
- High thermal conductivity: 0.56 W/(m·K)
- UL 94 V-0 flammability rating
- Very low moisture absorption: 0.02%
- Low outgassing (NASA compliant)
- Excellent PIM performance
Typical Properties: Rogers CLTE-XT
| Property |
Typical Value¹ |
Units |
Test Conditions |
Test Method |
| Electrical Properties |
| Dielectric Constant (process) | See Table Below | - | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dielectric Constant (design) | 2.93 | - | C-24/23/50, 10 GHz | Microstrip Differential Phase Length |
| Dissipation Factor | 0.0010 | - | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dk | -8 | ppm/°C | -50 to 150°C, 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 4.25 x 10⁸ | MΩ·cm | C-96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 2.49 x 10⁸ | MΩ | C-96/35/90 | IPC TM-650 2.5.17.1 |
| Electrical Strength | 1000 | V/mil | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | 58 | kV | D-48/50, X/Y Direction | IPC TM-650 2.5.6 |
| Thermal Properties |
| Decomposition Temperature (Td) | 539 | °C | 2hrs @ 105°C, 5% Weight Loss | IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x | 12.7 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 13.7 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 40.8 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.56 | W/(m·K) | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received, 288°C | IPC TM-650 2.4.24.1 |
| Mechanical Properties |
| Copper Peel Strength after Thermal Stress | 1.7 (9) | N/mm (lbs/in) | 10s @ 288°C, 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD, CMD) | 40.7, 40.0 (5.9, 5.8) | MPa (ksi) | 25°C ± 3°C | ASTM D790 |
| Tensile Strength (MD, CMD) | 29.0, 25.5 (4.2, 3.7) | MPa (ksi) | 23°C/50% RH | ASTM D638 |
| Flex Modulus (MD, CMD) | 3247, 3261 (471, 473) | MPa (ksi) | 25°C ± 3°C | ASTM D790 |
| Dimensional Stability (MD, CMD) | -0.37, -0.67 | mm/m | 4 hr at 105°C | IPC-TM-650 2.4.39a |
| Physical Properties |
| Flammability | V-0 | - | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.02 | % | E1/105 + D24/23 | IPC TM-650 2.6.2.1 |
| Density | 2.17 | g/cm³ | C-24/23/50 | ASTM D792 |
| Specific Heat Capacity | 0.61 | J/g·°K | 2 hours at 105°C | ASTM E2716 |
| NASA Outgassing |
| Total Mass Lost | 0.02 | % | - | ASTM E595 |
| Collected Volatiles | 0.00 | % | - | ASTM E595 |
CLTE-XT Dielectric Constant by Thickness:
| Grade | Panel Thickness | Process Dk (10 GHz) | Tolerance |
|---|
| CLTE-XT | 0.0051" (0.130 mm) | 2.79 | ± 0.03 |
| CLTE-XT | 0.0094" (0.239 mm) | 2.89 | ± 0.03 |
| CLTE-XT | 0.020" (0.508 mm) | 2.92 | ± 0.03 |
| CLTE-XT | 0.030" (0.762 mm) | 2.94 | ± 0.03 |
NOTES:
[1] SI units given first, with other frequently used units in parentheses
[2] References: internal TRs 3824, 5016, 5017, 5035. Tests were at 23°C unless otherwise noted.
Application Areas
- Ground-based communications systems
- Airborne communications and radar systems
- Phased array antennas
- High-reliability microwave components
- Aerospace and defense electronics
- Filters and couplers
- Power amplifiers
- Applications requiring ultra-low loss performance
Available Configurations
- Standard Thicknesses:
- 0.0051" (0.130 mm) ± 0.0005"
- 0.0094" (0.239 mm) ± 0.0007"
- 0.020" (0.508 mm) ± 0.0010"
- 0.030" (0.762 mm) ± 0.0010"
- Standard Panel Sizes:
- 18" x 12" (457 x 305 mm)
- 18" x 24" (457 x 610 mm)
- Standard Claddings:
- Electrodeposited Copper Foil:
- Reverse Treated Electrodeposited Copper Foil:
- Additional claddings (including rolled copper, resistor foil, and more), thicknesses, and panel sizes available upon request.
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