Home > Copper Clad Laminates > Wangling F4BTMS294 DK2.94 Df0.0012 (0.127-6.35mm+) Ceramic-Filled PTFE Laminate with 50Ω Resistor Foil Option

Wangling F4BTMS294 Ceramic-Filled PTFE Laminate with 50Ω Resistor Foil Option
Material:Wangling F4BTMS294 / Ceramic-Filled PTFE + Ultra-thin Fiberglass
MOQ:1 Sheet
Price:279-949 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:6-12 working days
Payment Method:T/T, Paypal
 

Wangling F4BTMS294 DK2.94 Df0.0012 (0.127-6.35mm+) Ceramic-Filled PTFE Laminate with 50Ω Resistor Foil Option


Brief Introduction

F4BTMS series is an upgraded version of the F4BTM series, featuring significant technological breakthroughs in material formulation and manufacturing processes. The material incorporates a high volume of uniformly dispersed ceramic fillers combined with ultra-thin, fine-weave fiberglass reinforcement. F4BTMS294 is an aerospace-grade, high-reliability material that serves as a domestic alternative to similar international products. The advanced composition minimizes glass weave effects during electromagnetic wave propagation, reduces dielectric loss, enhances dimensional stability, and improves anisotropy in the X/Y/Z directions. F4BTMS294 can be paired with embedded 50Ω resistor foil to create resistive film laminates.


Technical Features & Benefits

  • Tight dielectric constant tolerance with excellent batch-to-batch consistency (±0.04)
  • Ultra-low dissipation factor (Df 0.0012 @10GHz, 0.0014 @20GHz, 0.0018 @40GHz)
  • Exceptional temperature stability: TCDk -20 ppm/°C (-55°C to 150°C) - near-zero variation
  • Stable Dk and low loss up to 40GHz, suitable for phase-sensitive applications
  • Unique 50Ω embedded resistor foil option (nickel-phosphorus alloy, 0.2μm thickness, 50±5Ω/sq)
  • Superior radiation resistance - maintains stable electrical and physical properties after irradiation
  • Low outgassing - meets space vacuum requirements
  • Ultra-low CTE: X/Y 10-12 ppm/°C, Z 22 ppm/°C for excellent thermal stability and plated-through hole reliability
  • High thermal conductivity (0.58 W/m·K) for higher power applications
  • Excellent dimensional stability
  • Very low moisture absorption (0.02%)
  • Standard RTF low-profile copper foil for reduced conductor loss and excellent peel strength

Wangling F4BTMS294 Laminate


Typical Properties: Wangling F4BTMS294

Property Test Condition Unit F4BTMS294
Electrical Properties
Dielectric Constant (Typical)10 GHz2.94
Dielectric Constant Tolerance±0.04
Dielectric Constant (Design)10 GHz2.94
Dissipation Factor (Typical)10 GHz0.0012
20 GHz0.0014
40 GHz0.0018
Dielectric Constant Temp. Coeff.-55°C to 150°Cppm/°C-20
Peel Strength1 oz RTF CopperN/mm>1.2
Volume ResistivityNormalMΩ·cm≥1×10⁸
Surface ResistanceNormal≥1×10⁸
Electric Strength (Z-direction)5 kW, 500 V/skV/mm>40
Breakdown Voltage (XY-direction)5 kW, 500 V/skV>48
Thermal & Mechanical Properties
CTE (X, Y-direction)-55°C to 288°Cppm/°C10~12
CTE (Z-direction)-55°C to 288°Cppm/°C22
Thermal Stress260°C, 10s, 3 cyclesNo Delamination
Water Absorption20±2°C, 24 hours%0.02
DensityRoom Temperatureg/cm³2.25
Long-term Operating Temperature°C-55 to +260
Thermal Conductivity (Z-direction)Z-directionW/(m·K)0.58
FlammabilityUL-94V-0
Material CompositionPTFE, Ultra-thin Fine-weave Fiberglass, Ceramic Fillers

Application Areas

  • Aerospace equipment, spaceborne and onboard equipment
  • Microwave and RF systems
  • Radar, military radar
  • Feed networks
  • Phase-sensitive antennas, phased array antennas
  • Satellite communications
  • Applications requiring embedded 50Ω resistive elements

Available Configurations

  • Copper Foil Options: Standard RTF low-profile copper foil; 0.5 oz (0.018mm), 1 oz (0.035mm); other thicknesses available upon request.
  • Special 50Ω Embedded Resistor Foil: Nickel-phosphorus alloy resistive film, 0.2μm thickness, sheet resistance 50±5Ω/sq. Available for F4BTMS294.
  • Metal Base Options: Available with aluminum or copper backing for shielding or heat dissipation (F4BTMS294-AL or F4BTMS294-CU).
    • Copper base (purple brass/brass): Thermal conductivity 380 W/(m·K), CTE 17 ppm/°C
    • Aluminum base: Thermal conductivity 180 W/(m·K), CTE 24 ppm/°C
  • Standard Panel Sizes: 305×460mm (12×18"), 460×610mm (18×24"), 610×920mm (24×36"); custom sizes available upon request.
  • Dielectric Thickness Options: F4BTMS294 minimum thickness 0.127mm, available in 0.127mm multiples.
    • Available thicknesses include: 0.127mm, 0.254mm, 0.508mm, 0.635mm, 0.762mm, 0.787mm, 1.016mm, 1.270mm, 1.50mm, 1.524mm, 1.575mm, 2.03mm, 2.54mm, 3.175mm, 4.06mm, 5.08mm, 6.35mm
    • Tolerances range from ±0.0127mm to ±0.25mm depending on thickness

 


 

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