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Rogers DiClad 880 DK2.17/2.20 Df0.0009 (0.508-1.524mm) Copper Clad Laminate
Brief Introduction
DiClad 880 is a woven fiberglass reinforced PTFE composite laminate designed for high-frequency printed circuit board applications. With dielectric constants of 2.17 and 2.20, it provides excellent electrical uniformity and low loss, making it ideal for RF and microwave circuits where signal integrity and dimensional stability are critical.
Technical Features & Benefits
Low Dielectric Constant: Dk = 2.17 or 2.20 at 10 GHz, with high uniformity across the panel.
Ultra-Low Loss: Dissipation factor as low as 0.0009 at 10 GHz.
Excellent Thermal Stability: Thermal coefficient of Dk = –160 ppm/°C for reliable performance over temperature.
High Electrical Insulation: Volume resistivity up to 1.4×10⁹ MΩ·cm, surface resistivity up to 2.9×10⁶ MΩ.
Good Mechanical Strength: Balanced tensile, compressive, and flexural modulus for reliable PCB fabrication.
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Typical Properties:
| Property |
Typical Value |
Units |
Test Conditions |
Test Method |
| Dielectric Constant @10 GHz | 2.17, 2.20 | – | 23°C @ 50% RH | IPC TM-650 2.5.5.5 |
| Dielectric Constant @1 MHz | 2.17, 2.20 | – | 23°C @ 50% RH | IPC TM-650 2.5.5.3 |
| Dissipation Factor @10 GHz | 0.0009 | – | 23°C @ 50% RH | IPC TM-650 2.5.5.5 |
| Dissipation Factor @1 MHz | 0.0008 | – | 23°C @ 50% RH | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Dk | –160 | ppm/°C | –10°C to 140°C, 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 1.4×10⁹ | MΩ·cm | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 2.9×10⁶ | MΩ | C96/35/90 | IPC TM-650 2.5.17.1 |
| Dielectric Breakdown | >45 | kV | D48/50 | ASTM D-149 |
| Arc Resistance | >180 | sec | – | ASTM D-495 |
| CTE – X Direction | 25 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.41 |
| CTE – Y Direction | 34 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.41 |
| CTE – Z Direction | 252 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.25 | W/(m·K) | – | ASTM E1461 |
| Copper Peel Strength | 14 | lbs/in | 10s @ 288°C, 35 μm foil | IPC TM-650 2.4.8 |
| Young's Modulus | 267, 202 | kpsi | 23°C @ 50% RH | ASTM D-638 |
| Tensile Strength (MD, CMD) | 8.1, 7.5 | kpsi | 23°C @ 50% RH | ASTM D-882 |
| Compressive Modulus | 237 | kpsi | 23°C @ 50% RH | ASTM D-695 |
| Flexural Modulus | 357 | kpsi | 23°C @ 50% RH | ASTM D-3039 |
| Flammability | V-0 | – | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.02 | % | E1/105 + D24/23 | IPC TM-650 2.6.2.2 |
| Density | 2.23 | g/cm³ | C24/23/50, Method A | ASTM D792 |
| Outgassing – Total Mass Loss | 0.01 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
| Outgassing – Collected Volatiles | 0.01 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
| Outgassing – Water Vapor Recovered | 0.00 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
Application Areas
RF and Microwave Circuits: Filters, couplers, low-noise amplifiers (LNAs).
Power Dividers and Combiners: Where low loss and high uniformity are essential.
Aerospace and Defense: Radar systems, communication payloads.
Test and Measurement: Calibration boards and high-frequency fixtures.
Telecommunications: 5G infrastructure, satellite ground equipment.
Available Configurations
Standard Thicknesses: 0.020" (0.508 mm), 0.030" (0.762 mm), 0.060" (1.524 mm) with tight tolerances.
Panel Sizes: 12" × 18" (305 × 457 mm), 18" × 12" (457 × 305 mm), 18" × 24" (457 × 610 mm), 24" × 18" (610 × 457 mm).
Copper Claddings: Electrodeposited copper foil (½ oz and 1 oz) or reverse-treated electrodeposited copper foil.
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