Rogers RT/duroid 5880LZ DK2.00 PTFE Laminates 0.25mm - 1.27mm High Frequency Low Loss PCB Material

Brief Introduction

RT/duroid 5880LZ is a filled PTFE composite laminate engineered for demanding stripline and microstrip circuit applications in high-frequency electronics. It provides a low-density, lightweight solution suitable for performance-critical and weight-sensitive designs, such as aerospace and advanced communication systems.

Technical Features & Benefits

Low and Stable Dielectric Constant: The dielectric constant (εr) remains consistently low at 2.00 across panels and over a wide frequency range, ensuring reliable signal integrity in RF and microwave circuits.
Low Dissipation Factor: With a typical loss tangent of 0.0021, the material supports low-loss performance up to Ku-band and beyond, ideal for high-frequency printed circuit boards.
Excellent Thermal and Dimensional Stability: Low thermal coefficient of εr (+20 ppm/°C) and minimal dimensional change (-0.38%) ensure reliable operation under varying environmental conditions.
Superior Electrical Properties: High volume and surface resistivity, along with strong dielectric strength (40 kV), provide robust insulation and performance in multilayer PCB designs.

Application Areas

Aerospace & Defense: Ideal for satellite communication systems, radar components, and phased-array antennas where low density and consistent electrical performance are critical.
Microwave & RF Circuits: Excellent for microstrip, stripline, and millimeter-wave applications up to Ku-band and beyond, enabling high signal fidelity.
Automotive Radar: Suited for 77 GHz automotive radar sensors and advanced driver-assistance systems (ADAS) requiring low loss and stable dielectric constant.
Wireless Infrastructure: Perfect for 5G base stations, backhaul antennas, and high-frequency filters that demand minimal signal attenuation.

Rogers RT/duroid 5880LZ Laminate

Typical Properties: RT/duroid 5880LZ

Property	Typical Value [1]	Direction	Units	Condition	Test Method
Dielectric Constant, εr (Process)	2.00 ± 0.04	Z		10 GHz / 23°C	IPC-TM-650, 2.5.5.5
Dielectric Constant, εr (Design)	2.00	Z		8 GHz - 40 GHz	Differential Phase Length
Dissipation Factor, tan δ	Typ: 0.0021 Max: 0.0027	Z		10 GHz / 23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	+20	Z	ppm/°C	-50°C to 150°C, 10 GHz	IPC-TM-650, 2.5.5.5
Volume Resistivity	1.74 × 10⁷		MΩ·cm	C-96/35/90	IPC-TM-650, 2.5.17.1
Surface Resistivity	2.08 × 10⁶		MΩ	C-96/35/90	IPC-TM-650, 2.5.17.1
Electrical Strength	40		kV	D48/50	IPC-TM-650, 2.5.6
Dimensional Stability	-0.38	X,Y	%		IPC-TM-650, 2.4.39A
Moisture Absorption	0.31		%	24 hr / 23°C	IPC-TM-650, 2.6.2.1
Thermal Conductivity	0.33	Z	W/m·K	80°C	ASTM C518
Coefficient of Thermal Expansion	54, 47 (X,Y) 40 (Z)	X,Y / Z	ppm/°C	0 to 150°C	IPC-TM-650, 2.4.41
Outgassing - TML	0.01		%		ASTM E-595
Outgassing - CVCM	0.01		%		ASTM E-595
Outgassing - WVR	0.01		%		ASTM E-595
Density	1.4		g/cm³		ASTM D792
Copper Peel Strength	>4.0		pli		IPC-TM-650, 2.4.8
Flammability Rating	V-0				UL 94
Lead-Free Process Compatible	YES

Available Configurations

Standard Thicknesses: 0.010" ±0.0007" (0.25mm), 0.020" ±0.0015" (0.51mm), 0.050" ±0.0015" (1.27mm) — additional thicknesses available upon request.
Standard Panel Sizes: 12" × 18" (305 × 457 mm), 24" × 18" (610 × 457 mm) — custom sizes available.
Standard Claddings: ½ oz ED Copper (HH/HH), 1 oz ED Copper (H1/H1) — other cladding weights and foil types available.

Standard Thicknesses	Standard Panel Sizes	Standard Claddings
0.010" ±0.0007" (0.25mm)	12" × 18" (305 × 457 mm)	½ oz ED Copper (HH/HH)
0.020" ±0.0015" (0.51mm)	24" × 18" (610 × 457 mm)	1 oz ED Copper (H1/H1)
0.050" ±0.0015" (1.27mm)	Additional sizes available	Other cladding weights available