Home > Copper Clad Laminates > Wangling F4BME220 DK2.20 Df0.001 PIM ≤-159dBc (0.1-12.0mm) Copper Clad Laminate

Wangling F4BME220 RTF Copper Clad Laminate
Material:Wangling F4BME220 / PTFE + Fiberglass with RTF Copper
MOQ:1 Sheet
Price:199-799 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:7-13 working days
Payment Method:T/T, Paypal
 

Wangling F4BME220 DK2.20 Df0.001 PIM ≤-159dBc (0.1-12.0mm) Copper Clad Laminate


Brief Introduction

F4BME220 is a PTFE fiberglass copper-clad laminate from Taizhou Wangling Insulation Material Factory. Composed of fiberglass cloth, PTFE resin, and film, it offers improved electrical performance over standard F4B, including a wider DK range, lower loss, higher insulation resistance, and greater stability. It serves as a domestic alternative to similar imported products. F4BME220 utilizes reverse RTF copper foil, providing excellent PIM performance, precise circuit control, and lower conductor loss, distinguishing it from the ED copper foil used in F4BM.


Technical Features & Benefits

  • DK: 2.17~3.0 optional, DK 2.20 (Customizable) – Wide range of dielectric constants available to match design requirements.
  • Low loss – Dissipation factor of 0.001 at 10 GHz ensures minimal signal attenuation.
  • Excellent PIM performance (with RTF foil) – PIM ≤ -159 dBc for superior intermodulation distortion control.
  • Diverse sizes, cost-effective – Multiple panel sizes available with high cost-performance ratio.
  • Radiation resistant, low outgassing – Suitable for aerospace and high-reliability applications.
  • Commercial availability, high volume, high cost-performance – Readily available for mass production with excellent value.

Wangling F4BME220 Laminate


Typical Properties: F4BME 220

Property Test Condition Unit Value
Dielectric Constant (Typ.)10GHz2.20
Dielectric Constant Tolerance±0.04
Dissipation Factor (Typ.)10GHz0.001
20GHz0.0014
Dielectric Constant Temp. Coeff.-55℃~150℃ppm/℃-142
Peel Strength1 OZ F4BMEN/mm>1.6
Volume ResistivityNormalMΩ·cm≥6×10⁶
Surface ResistanceNormal≥1×10⁶
Electric Strength (Z)5KV, 500V/sKV/mm>23
Breakdown Voltage (XY)5KW, 500V/sKV>30
CTE (XY)-55℃~288℃ppm/℃25~34
CTE (Z)-55℃~288℃ppm/℃240
Thermal Stress260℃, 10s, 3 timesNo delamination
Water Absorption20±2℃, 24h%≤0.08
DensityRoom Temp.g/cm³2.18
Long-term Operating Temp.--55~+260
Thermal Conductivity (Z)Z-directionW/(m·K)0.24
PIM ValueFor F4BME onlydBc≤-159
FlammabilityUL-94V-0
Material CompositionPTFE, Fiberglass Cloth, Reverse RTF Copper Foil

Application Areas

  • Microwave, RF, Radar – High-frequency systems requiring stable performance.
  • Phase Shifters, Passive Components – Precision RF control elements.
  • Power Dividers, Couplers, Combiners – Signal distribution networks.
  • Feed Networks, Phased Array Antennas – Advanced antenna systems.
  • Satellite Communication, Base Station Antennas – Low PIM requirements.

Available Configurations

  • Copper Foil: RTF copper, various weights available.
  • Standard Sizes: 460×610 mm, 500×600 mm, 914×1220 mm, etc.
  • Thickness Options: 0.1 mm to 12.0 mm with specified tolerances.
  • Metal Substrate Options: Available with aluminum or copper backing.
 

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