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Wangling F4BM233 DK2.33 Df0.0011 (0.1-12.0mm) PTFE Glass Fabric Copper Clad Laminate
Brief Introduction
Wangling F4BM series are PTFE glass fabric copper-clad laminates made from PTFE resin, PTFE film, and woven glass fabric. They offer improved electrical performance over standard F4B, including a wider dielectric constant range, lower loss, higher insulation resistance, and better stability, making them a suitable substitute for similar international products. F4BM233 uses standard ED copper foil and is ideal for applications without PIM requirements.
Technical Features & Benefits
- Selectable Dielectric Constant (Dk): Available from 2.17 to 3.0; customizable Dk available to match specific design requirements.
- Low Dissipation Factor (Low Loss): Df of 0.0011 at 10 GHz ensures minimal signal attenuation in high-frequency circuits.
- Good Dimensional Stability: Enhanced size control for reliable fabrication and assembly processes.
- Radiation Resistance and Low Outgassing: Suitable for aerospace and high-reliability applications.
- Commercial, High-Volume, Cost-Effective Production: Readily available for mass production with excellent value.
- UL 94 V-0 Flammability Rating: Meets industry safety standards for flame resistance.
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Typical Properties: F4BM233
| Properties |
Test Conditions |
Unit |
F4BM233 |
| Electrical Properties | | | |
| Dielectric Constant (Typical) | 10 GHz | - | 2.33 |
| Dielectric Constant Tolerance | / | - | ±0.04 |
| Dissipation Factor (Typical) | 10 GHz | - | 0.0011 |
| 20 GHz | - | 0.0015 |
| Temperature Coefficient of Dk | -55°C to 150°C | ppm/°C | -130 |
| Peel Strength | 1 oz. F4BM | N/mm | >1.8 |
| Volume Resistivity | Normal Condition | MΩ·cm | ≥6×10⁶ |
| Surface Resistance | Normal Condition | MΩ | ≥1×10⁶ |
| Dielectric Strength (Z-direction) | 5 kW, 500 V/s | kV/mm | >23 |
| Breakdown Voltage (XY-direction) | 5 kW, 500 V/s | kV | >32 |
| Thermal & Mechanical Properties | | | |
| CTE | XY-direction, -55°C to 288°C | ppm/°C | 22~30 |
| Z-direction, -55°C to 288°C | ppm/°C | 205 |
| Thermal Stress | 260°C, 10s, 3 cycles | - | No Delamination |
| Water Absorption | 20±2°C, 24 hours | % | ≤0.08 |
| Density | Room Temperature | g/cm³ | 2.20 |
| Long-term Operating Temperature | High/Low Temp Chamber | °C | -55 to +260 |
| Thermal Conductivity | Z-direction | W/(m·K) | 0.28 |
| Flammability Rating | / | UL-94 | V-0 |
| Material Composition | / | / | PTFE, Glass Fiber Cloth; F4BM uses ED copper foil. |
Application Areas
- Microwave, RF, Radar: High-frequency systems requiring stable performance.
- Phase Shifters, Passive Components: Precision RF control elements.
- Power Dividers, Couplers, Combiners: Signal distribution and combining networks.
- Feed Networks, Phased Array Antennas: Advanced antenna systems for communication and defense.
- Satellite Communication, Base Station Antennas: Reliable performance in telecom infrastructure.
Available Configurations
- Copper Foil Options for F4BM: ED Copper Foil. Available thicknesses: 0.5 oz (0.018mm), 1 oz (0.035mm), 1.5 oz (0.05mm), 2 oz (0.07mm).
- Standard Panel Sizes: 460×610 mm, 500×600 mm, 850×1200 mm, 914×1220 mm, 1000×1200 mm.
- Available Thicknesses & Tolerances: Thicknesses from 0.1mm to 12.0mm available (e.g., 0.1, 0.127, 0.2, 0.25, 0.5, 0.8, 1.0, 1.5, 2.0, 3.0, 4.0, 5.0, 6.0, 8.0, 10.0, 12.0mm) with corresponding tolerances.
- F4BM Series with Metal Core (Aluminum/Copper Base): Models: F4BM*-AL (Aluminum base), F4BM*-CU (Copper base) for shielding or heat dissipation. Standard sizes: 460×610 mm, 460×305 mm. Other sizes upon request.
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