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Wangling F4BM275 DK2.75 Df0.0015 (0.2-12.0mm) ED Copper Clad Laminate
Brief Introduction
Wangling F4BM series are PTFE glass fabric copper-clad laminates made from PTFE resin, PTFE film, and woven glass fabric. They offer improved electrical performance over standard F4B, including a wider dielectric constant range, lower loss, higher insulation resistance, and better stability, making them suitable substitutes for similar international products. F4BM275 uses standard ED copper foil and is ideal for applications without PIM requirements.
Technical Features & Benefits
- Selectable Dielectric Constant (Dk) from 2.17 to 3.0; Dk 2.75 with customizable options available
- Low dissipation factor (Df 0.0015 @10GHz, 0.0021 @20GHz)
- Good dimensional stability and enhanced size control
- Radiation resistance and low outgassing
- Commercial, high-volume, cost-effective production
- UL 94 V-0 flammability rating
- Long-term operating temperature: -55°C to +260°C
- Very low moisture absorption (≤0.08%)
- Note: Higher Dk achieved with increased glass content, resulting in better dimensional stability, lower CTE, and improved thermal stability
Typical Properties: Wangling F4BM275
| Properties |
Test Conditions |
Unit |
F4BM275 |
| Electrical Properties | | | |
| Dielectric Constant (Typical) | 10 GHz | – | 2.75 |
| Dielectric Constant Tolerance | – | – | ±0.05 |
| Dissipation Factor (Typical) | 10 GHz | – | 0.0015 |
| 20 GHz | – | 0.0021 |
| Temperature Coefficient of Dk | -55°C to 150°C | ppm/°C | -92 |
| Peel Strength | 1 oz. F4BM | N/mm | >1.8 |
| Volume Resistivity | Normal Condition | MΩ·cm | ≥6×10⁶ |
| Surface Resistance | Normal Condition | MΩ | ≥1×10⁶ |
| Dielectric Strength (Z-direction) | 5 kW, 500 V/s | kV/mm | >28 |
| Breakdown Voltage (XY-direction) | 5 kW, 500 V/s | kV | >35 |
| Thermal & Mechanical Properties | | | |
| CTE | XY-direction, -55°C to 288°C | ppm/°C | 14~16 |
| Z-direction, -55°C to 288°C | ppm/°C | 112 |
| Thermal Stress | 260°C, 10s, 3 cycles | – | No Delamination |
| Water Absorption | 20±2°C, 24 hours | % | ≤0.08 |
| Density | Room Temperature | g/cm³ | 2.28 |
| Long-term Operating Temperature | – | °C | -55 to +260 |
| Thermal Conductivity | Z-direction | W/(m·K) | 0.38 |
| Flammability Rating | – | UL-94 | V-0 |
| Material Composition | – | – | PTFE, Glass Fiber Cloth; F4BM uses ED copper foil |
Application Areas
- Microwave, RF, Radar
- Phase Shifters, Passive Components
- Power Dividers, Couplers, Combiners
- Feed Networks, Phased Array Antennas
- Satellite Communication, Base Station Antennas
Available Configurations
- Copper Foil Options for F4BM: ED Copper Foil. Available thicknesses: 0.5 oz (0.018mm), 1 oz (0.035mm), 1.5 oz (0.05mm), 2 oz (0.07mm).
- Standard Panel Sizes Available:
- 460 × 610 mm
- 500 × 600 mm
- 850 × 1200 mm
- 914 × 1220 mm
- 1000 × 1200 mm
- Available Thicknesses & Tolerances (Conventional):
- Thickness (mm): 0.2 (core, minimum for Dk ≥2.7), 0.25, 0.5, 0.508, 0.762, 0.8, 1.0, 1.5, 1.524, 1.575, 2.0, 2.5, 3.0, 4.0, 5.0, 6.0, 8.0, 10.0, 12.0.
- Corresponding tolerances range from ±0.02mm to ±0.20mm.
- Note: For Dk ≥2.7, minimum core thickness is 0.2mm.
- F4BM Series with Metal Core (Aluminum/Copper Base):
- Models: F4BM*-AL (Aluminum base), F4BM*-CU (Copper base)
- Serves for shielding or heat dissipation
- Example: F4BM275-AL represents F4BM275 with aluminum base; F4BM275-CU represents F4BM275 with copper base
- Standard sizes available: 460×610 mm, 460×305 mm; other sizes upon request
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