Home > Copper Clad Laminates > Wangling F4BTMS265 DK2.65 Df0.0012 (0.127-6.35mm+) Ceramic-Filled PTFE Laminate

Wangling F4BTMS265 Ceramic-Filled PTFE Laminate
Material:Wangling F4BTMS265 / Ceramic-Filled PTFE + Ultra-thin Fiberglass
MOQ:1 Sheet
Price:249-899 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:6-12 working days
Payment Method:T/T, Paypal
 

Wangling F4BTMS265 DK2.65 Df0.0012 (0.127-6.35mm+) Ceramic-Filled PTFE Laminate


Brief Introduction

F4BTMS series is an upgraded version of the F4BTM series, featuring significant technological breakthroughs in material formulation and manufacturing processes. The material incorporates a high volume of uniformly dispersed ceramic fillers combined with ultra-thin, fine-weave fiberglass reinforcement. F4BTMS265 is an aerospace-grade, high-reliability material that serves as a domestic alternative to similar international products. The advanced composition minimizes glass weave effects during electromagnetic wave propagation, reduces dielectric loss, enhances dimensional stability, and improves anisotropy in the X/Y/Z directions, enabling higher operating frequencies and increased electrical strength.


Technical Features & Benefits

  • Tight dielectric constant tolerance with excellent batch-to-batch consistency (±0.04)
  • Ultra-low dissipation factor (Df 0.0012 @10GHz, 0.0014 @20GHz, 0.0018 @40GHz)
  • Stable Dk and low loss up to 40GHz, suitable for phase-sensitive applications
  • Excellent thermal stability of Dk and Df from -55°C to 150°C (TCDk -88 ppm/°C)
  • Superior radiation resistance - maintains stable electrical and physical properties after irradiation
  • Low outgassing - meets space vacuum requirements
  • Low CTE in X/Y/Z directions for excellent thermal stability and plated-through hole reliability
  • Enhanced thermal conductivity (0.36 W/m·K) for higher power applications
  • Excellent dimensional stability
  • Very low moisture absorption (0.025%)
  • Standard RTF low-profile copper foil for reduced conductor loss and excellent peel strength

Wangling F4BTMS265 Laminate


Typical Properties: Wangling F4BTMS265

Property Test Condition Unit F4BTMS265
Electrical Properties
Dielectric Constant (Typical)10 GHz2.65
Dielectric Constant Tolerance±0.04
Dielectric Constant (Design)10 GHz2.65
Dissipation Factor (Typical)10 GHz0.0012
20 GHz0.0014
40 GHz0.0018
Dielectric Constant Temp. Coeff.-55°C to 150°Cppm/°C-88
Peel Strength1 oz RTF CopperN/mm>1.8
Volume ResistivityNormalMΩ·cm≥1×10⁸
Surface ResistanceNormal≥1×10⁸
Electric Strength (Z-direction)5 kW, 500 V/skV/mm>34
Breakdown Voltage (XY-direction)5 kW, 500 V/skV>42
Thermal & Mechanical Properties
CTE (X, Y-direction)-55°C to 288°Cppm/°C15~20
CTE (Z-direction)-55°C to 288°Cppm/°C72
Thermal Stress260°C, 10s, 3 cyclesNo Delamination
Water Absorption20±2°C, 24 hours%0.025
DensityRoom Temperatureg/cm³2.26
Long-term Operating Temperature°C-55 to +260
Thermal Conductivity (Z-direction)Z-directionW/(m·K)0.36
FlammabilityUL-94V-0
Material CompositionPTFE, Ultra-thin Fine-weave Fiberglass, Ceramic Fillers

Application Areas

  • Aerospace equipment, spaceborne and onboard equipment
  • Microwave and RF systems
  • Radar, military radar
  • Feed networks
  • Phase-sensitive antennas, phased array antennas
  • Satellite communications

Available Configurations

  • Copper Foil Options: Standard RTF low-profile copper foil; 0.5 oz (0.018mm), 1 oz (0.035mm); other thicknesses available upon request. Optional 50Ω embedded resistor foil, aluminum base, or copper base available.
  • Standard Panel Sizes: 305×460mm (12×18"), 460×610mm (18×24"), 610×920mm (24×36"); custom sizes available upon request.
  • Dielectric Thickness Options: F4BTMS265 minimum thickness 0.127mm, available in 0.127mm multiples.
    • Available thicknesses include: 0.127mm, 0.254mm, 0.508mm, 0.635mm, 0.762mm, 0.787mm, 1.016mm, 1.270mm, 1.50mm, 1.524mm, 1.575mm, 2.03mm, 2.54mm, 3.175mm, 4.06mm, 5.08mm, 6.35mm
    • Tolerances range from ±0.0127mm to ±0.25mm depending on thickness
  • Metal Base Options: Available with aluminum or copper backing for shielding or heat dissipation (F4BTMS265-AL or F4BTMS265-CU).
    • Copper base (purple brass/brass): Thermal conductivity 380 W/(m·K), CTE 17 ppm/°C
    • Aluminum base: Thermal conductivity 180 W/(m·K), CTE 24 ppm/°C

 


 

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