DiClad 527 High-Frequency PCB: Advanced Composite Substrate Solutions
(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)
Substrate Introduction
Rogers DiClad 527 laminates are advanced composite materials designed for use as substrates in printed circuit boards. These laminates feature a higher proportion of fiberglass reinforcement compared to PTFE content, resulting in a balanced ratio that enhances dielectric constant (Dk) range and improves dimensional stability and registration.
Standard Panel Sizes for DiClad 527:
18" x 12" (457 x 305mm)
18" x 24" (457 x 610mm)
Standard Thicknesses for DiClad 527:
0.020" (0.508mm) with a tolerance of +/- 0.0020"
0.030" (0.762mm) with a tolerance of +/- 0.0020"
0.060" (1.524mm) with a tolerance of +/- 0.0020"
Standard Claddings for DiClad 527:
Electrodeposited Copper Foil
1/2 oz. (18µm)
1 oz. (35µm)
For additional PCB configurations, including different thicknesses, panel sizes, and claddings, please contact our Customer Service or Sales Engineering teams.
Key Benefits
1.Stable Dk: Maintains stability across a wide frequency range
2.Low Circuit Losses: Minimizes losses at high frequencies
3.Performance in Humidity: Exhibits minimal variation in high humidity environments
4.Dimensional Stability: Ensures consistent dimensions
5.Consistent Performance: Reliable product performance across applications
6.Uniform Electrical Properties: Provides uniformity across frequencies
7.Mechanical Reliability: Ensures robust mechanical performance
8.Chemical Resistance: Offers excellent resistance to chemicals
Our PCB Capability (DiClad 527)
| PCB Capability (DiClad 527) | |
| PCB Material: | Woven Fiberglass/PTFE composite |
| Designation: | DiClad 527 |
| Dielectric constant: | 2.40-2.60 10GHz/23˚C |
| Dissipation factor | 0.0017 10GHz/23˚C |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
Typical Applications
1.Radar feed networks
2.Commercial phased array networks
3.Low-loss base station antennas
4.Guidance systems
5.Digital radio antennas
6.Filters, couplers, and LNAs
DiClad 527 Data Sheet
| Properties | DiClad 527 | Units | Test Conditions | Test Method | ||
| Electrical Properties | ||||||
| Dielectric Constant | 2.40-2.60 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | |
| Dielectric Constant | 2.40-2.60 | - | 23˚C @ 50% RH | 1 MHz | IPC TM-650 2.5.5.3 | |
| Dissapation Factor | 0.0017 | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | ||
| Dissapation Factor | 0.0010 | 23˚C @ 50% RH | 1 MHz | IPC TM-650 2.5.5.3 | ||
| Thermal Coefficient of Dielectric Constant |
-153 | ppm/˚C | -10 to 140˚C | 10 GHz | IPC TM-650 2.5.5.5 | |
| Volume Resistivity | 1.2 x 109 | MΩ-cm | C96/35/90 | - | IPC TM-650 2.5.17.1 | |
| Surface Resistivity | 4.5 x 107 | MΩ | C96/35/90 | - | IPC TM-650 2.5.17.1 | |
| Dielectric Breakdown | >45 | kV | D48/50 | - | ASTM D-149 | |
| Arc Resistance |
>180 | - | - | ASTM D-495 | ||
| Thermal Properties | ||||||
| Coefficient of Thermal Expansion - x | 14 | ppm/˚C | - | 50˚C to 150˚C | IPC TM-650 2.4.41 | |
| Coefficient of Thermal Expansion - y | 21 | ppm/˚C | - | 50˚C to 150˚C | IPC TM-650 2.4.41 | |
| Coefficient of Thermal Expansion - z | 173 | ppm/˚C | - | 50˚C to 150˚C | IPC TM-650 2.4.24 | |
| Thermal Conductivity |
0.26 | W/(m.K) | ASTM E1461 | |||
| Mechanical Properties | ||||||
| Copper Peel Strength | 14 | Lbs/in | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 | |
| Young’s Modulus | 517, 706 | kpsi | 23˚C @ 50% RH | - | ASTM D-638 | |
| Tensile Strength (MD, CMD) | 19.0, 15.0 | kpsi | 23˚C @ 50% RH | - | ASTM D-882 | |
| Compressive Modulus | 359 | kpsi | 23˚C @ 50% RH | - | ASTM D-695 | |
| Flex Modulus |
537 | kpsi | 23˚C @ 50% RH | ASTM D-3039 | ||
| Physical Properties | ||||||
| Flammability | V-0 | C48/23/50 & C168/70 |
UL 94 | |||
| Moisture Absorption | 0.03 | % | E1/105+D24/23 | IPC TM-650 2.6.2.2 | ||
| Density | 231 | g/cm³ | C24/23/50 | Method A | ASTM D792 | |
| NASA Outgassing |
Total Mass Lost | 0.02 | % | 125°C, ≤ 10-6 torr | NASA SP-R-0022A | |
| Collected Volatiles | 0.00 | % | ||||
| Water Vapor Recovered | 0.01 | % | ||||