Rogers RO4830 High-Frequency PCB: Low Profile Copper for Thermoset Circuit Boards
(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)
Introduction
The Rogers RO4830 high-frequency laminates represent a thermoset material that provides a reliable and economical alternative to conventional PTFE-based laminates. These laminates are particularly optimized for millimeter wave applications where cost efficiency is crucial, such as automotive radar sensors operating in the 76-81 GHz range. RO4830 can be manufactured using standard FR-4 processes and is designed to serve as the cap layer in multi-layer FR-4 board designs commonly used in automotive radar sensor PCBs.
In comparison to PTFE-woven glass laminates, RO4830 exhibits a slightly higher dielectric constant of 3.2 at 77 GHz. The use of low-profile reverse-treated copper foil cladding enhances the insertion loss performance, achieving an impressive 2.2 dB per inch at 77 GHz. The laminates feature a flat woven e-glass and a filler with smaller, more uniform particle sizes, which contribute to excellent laser drilling capabilities. Additionally, RO4830 laminates incorporate an advanced anti-oxidant package that provides exceptional resistance to oxidation, outperforming other hydrocarbon-based laminate materials. They also hold a UL 94 V-0 flame retardant rating and are compatible with lead-free solder processes.
Key Features
1.Dielectric Constant: 3.24
2.Excellent Insertion Loss: 2.2 dB/in at 77 GHz
3.UL 94 V-0 Flame Retardant Rating
4.Optimized Filler, Resin, and Glass Composite System
5.Reverse Treated Smooth Low Profile Copper Foil
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Benefits
1.Remarkable Resistance to Oxidation
2.Consistent Within-Sheet Dielectric Constant: Ensuring reliable laser drilling performance
3.Cost-Effective: Lower overall costs compared to PTFE laminate options, reducing PCB manufacturing expenses
4.Ideal for Automotive Radar Sensor Applications
Our PCB Capability (RO4830)
| PCB Capability (RO4830) | |
| PCB Material: | Hydrocarbon/ Ceramic/ Spread Woven Glass |
| Designation: | RO4830 |
| Dielectric constant: | 3.24 |
| Dissipation factor | 0.0033-0.0032 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 5mil (0.127mm), 9.4mil (0.239mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
Typical Applications
76-81 GHz Automotive Radar Sensors
RO4830 Data Sheet
| Property | Typical Values [1] RO4830(TM) |
Units | Condition | Test Method | ||
| Dielectric Thickness | ||||||
| 0.005” | 0.0095” | |||||
| Dielectric Constant, εr Design | 3.24 | 3.24 | - | 77 GHz | microstrip differential phase length | |
| Transmission Line Loss | 2.2 | 1.8 | dB/in | 77 GHz | microstrip differential phase length | |
| Dissipation Factor, tan δ | 0.0033 | 0.0032 | - | 10 GHz | split-post dielctric resonator | |
| Thermal Coefficient of εr (z direction) | -30 | -30 | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 | |
| Dielectric Strength | 78.7 | 59.1 | kV/mm | 48 hrs @ 50°C | IPC-TM-650, 2.5.6.2 | |
| 2000 | 1500 | V/mil | ||||
| Water Absorption | 0.15 | 0.13 | % | D-48/50 | ASTM D570 | |
| Peel Strength after Thermal Stress | 0.67 | 0.67 | N/mm | 18 micron reverse treated EDfoil |
IPC-TM-650 2.4.8 | |
| 3.8 | 3.8 | lbs/in | ||||
| Flammability Rating | V-0 | V-0 | - | C-48/23/50 | UL94 | |
| Dimensional Stability |
MD | -1.8 (-1.8) |
-1.5 (-1.5) | mm/m (mils/in) | 4 hrs @ 105°C | IPC-TM-650 2.4.39A |
| CMD | -1.8 (-1.8) |
-1.6 (-1.6) | ||||
| Decomposition Temperature | 408 | 412 | °C | - | ASTM D3850 | |
| Time to Delamination (T288) | >30 | >30 | minutes | with Cu | IPC-TM-650, 2.4.24.1 | |
| Lead-Free Process Capable | YES | YES | - | - | - | |
| Thermal Conductivity (calculated) | 0.45 | 0.47 | W/mK | 50°C | Through-plane calculation with series mixing rule |
|
| CTE | x,y | 23 | 21 | ppm/°C | 0 to 150°C | IPC-TM-650 2.4.41 |
| z | 110 | 83 | ||||
About Bicheng
Established in 2003, Bicheng Electronics Technology Co., Ltd has become a reputable supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 20 years of experience, we serve various industries worldwide, including cellular base station antennas, satellites, high-frequency passive components, microstrip line and band line circuits, millimeter wave equipment, radar systems, digital radio frequency antennas, and more.
Our high-frequency PCBs primarily utilize three renowned material brands: Rogers Corporation, Taconic, and Wangling. These materials offer a wide range of dielectric constants, from 2.2 to 10.2, ensuring versatility for different applications.
In addition to high-frequency PCBs, we specialize in FR-4 circuit boards, flexible circuits, and metal core PCBs. Our capabilities range from prototyping and small runs to large-scale production. We actively engage in research and development of high-value-added PCB projects, including HDI (high-density interconnect), quick turn, impedance control, heavy copper, and backplane boards. This diversification allows us to offer a comprehensive product line that meets both low-end and high-end requirements.
Our PCBs are utilized across various industries such as computer networking, safety and surveillance, power supply, telecommunications, automotive electronics, medical devices, national defense, and industrial equipment. We are committed to meeting the diverse needs of our customers and providing reliable PCB solutions for a multitude of applications.