F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This PCB features a square design with dimensions of 85 mm x 85 mm, utilizing a double-sided layout that contains two layers of copper. It is compatible with surface mount components, while through-hole components are not included in this design.
The layer stackup consists of a top layer made of 70 µm (2 oz) copper starting with 1 oz plating, complemented by a durable F4BM300 core material with a thickness of 0.508 mm. The bottom layer also incorporates 70 µm (2 oz) copper with plating, ensuring reliable performance.
The surface finish is immersion gold, which enhances solderability and provides excellent protection against corrosion. A black solder mask is applied to the top side of the PCB, offering both durability and a sleek appearance while safeguarding the underlying circuitry.
PCB Specifications
F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold |
|
PCB SIZE |
85 x 85mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 70um (1 oz+plate) TOP layer |
F4BM300 - 0.508mm |
|
copper ------- 70um(1 oz + plate) BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
5 mil / 8 mil |
Minimum / Maximum Holes: |
0.3 mm / 1.2 mm |
Number of Different Holes: |
5 |
Number of Drill Holes: |
79 |
Number of Milled Slots: |
2 |
Number of Internal Cutouts: |
2 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
F4BM300 DK 3.0 |
Final foil external: |
2oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.6 mm ±10% |
PLATING AND COATING |
|
Surface Finish |
Immersion gold |
Solder Mask Apply To: |
Top |
Solder Mask Color: |
Black |
Solder Mask Type: |
no |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Top |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Non-Plated through hole(PTH), minimum size 0.3mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BM High-Frequency Laminates
F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to the F4B series, primarily due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. This material can replace similar foreign products.
Features & Benefits
Dielectric Constant (DK) Options: 2.17 to 3.0, customizable DK
Low Loss: Enhanced performance
PIM Performance: Excellent with F4BME paired with RTF copper foil
Cost-Effective: Diverse sizes available
Radiation Resistance: Suitable for demanding applications
Low Outgassing: Meets aerospace requirements
Commercialized for Large-Scale Production: High cost-effectiveness
Typical Applications
Microwave and RF applications
Radar systems
Phase shifters and passive components
Power dividers, couplers, and combiners
Feed networks and phased array antennas
Satellite communication and base station antennas
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