F4BTM320 High Frequency PCB 2oz Copper 1.27mm Substrates With Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This PCB features a size of 110 mm x 76 mm and is designed as a double-sided layout with two layers. It accommodates surface mount components while excluding through-hole components. The layer stackup includes a top layer of 70 µm (2 oz) copper with starting 1 oz plating, supported by a robust F4BTM320 core material with a thickness of 1.27 mm. The bottom layer has the same copper specifications to ensure consistent performance.
The PCB allows for a minimum trace width of 5 mil and a minimum spacing of 9 mil, facilitating precise circuit design. The surface finish is immersion gold, which ensures excellent solderability and durability. Both the top and bottom sides are coated with a black solder mask, providing protection and aesthetic appeal, while white silkscreen is applied to the top side for clear labeling and identification.
PCB Specifications
F4BTM320 High Frequency PCB 2oz Copper 1.27mm Substrates With Immersion Gold |
|
PCB SIZE |
110mm x 76 mm =1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 70 um(1 oz+plate) TOP layer |
F4BTM320 - 1.27mm |
|
copper ------- 70 um(1 oz + plate) BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
5 mil / 9 mil |
Minimum / Maximum Holes: |
0.35 mm / 1.0 mm |
Number of Different Holes: |
4 |
Number of Drill Holes: |
61 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
F4BTM320 DK3.2 |
Final foil external: |
2 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.4 mm |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Top side & Bottom Side |
Solder Mask Color: |
Black |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Top Side |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.35mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
.jpg)
F4BTM High-Frequency Laminates
The F4BTM series laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. This series is based on the F4BM dielectric layer, enhanced with high-dielectric and low-loss nano-level ceramics. These enhancements result in:
Higher dielectric constant
Improved heat resistance
Lower thermal expansion coefficient
Higher insulation resistance
Better thermal conductivity
Maintained low loss characteristics
Optional copper foil is available with ED copper in thicknesses of 0.5 oz, 1 oz, 1.5 oz, and 2 oz.
Features & Benefits
Dielectric constant (DK) range: 2.98 - 3.5 (optional)
Addition of ceramics improves performance
Excellent PIM indicators
Thickness options ranging from 0.254 mm to 12 mm
Diverse sizes from 460 mm x 610 mm to 914 mm x 1220 mm
Cost-saving properties
Suitable for commercialization and mass production
High cost-performance ratio
Radiation resistance
Low outgassing
Our PCB Capability (F4BTM)
PCB Capability (F4BTM) |
|||
PCB Material: |
PTFE / glass fiber cloth / Nano-ceramic filler |
||
Designation (F4BTM ) |
F4BTM |
DK (10GHz) |
DF (10 GHz) |
F4BTM298 |
2.98±0.06 |
0.0018 |
|
F4BTM300 |
3.0±0.06 |
0.0018 |
|
F4BTM320 |
3.2±0.06 |
0.0020 |
|
F4BTM350 |
3.5±0.07 |
0.0025 |
|
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
||
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
||
Dielectric thickness (or overall thickness) |
0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
||
PCB size: |
≤400mm X 500mm |
||
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
||
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
||
Data Sheet (F4BTM)
Product Technical Parameters |
Product Models & Data Sheet |
||||||
Product Features |
Test Conditions |
Unit |
F4BTM298 |
F4BTM300 |
F4BTM320 |
F4BTM350 |
|
Dielectric Constant (Typical) |
10GHz |
/ |
2.98 |
3.0 |
3.2 |
3.5 |
|
Dielectric Constant Tolerance |
/ |
/ |
±0.06 |
±0.06 |
±0.06 |
±0.07 |
|
Loss Tangent (Typical) |
10GHz |
/ |
0.0018 |
0.0018 |
0.0020 |
0.0025 |
|
20GHz |
/ |
0.0023 |
0.0023 |
0.0026 |
0.0035 |
||
Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-78 |
-75 |
-75 |
-60 |
|
Peel Strength |
1 OZ F4BTM |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
|
1 OZ F4BTME |
N/mm |
>1.4 |
>1.4 |
>1.4 |
>1.4 |
||
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
|
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
|
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>32 |
|
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>34 |
>35 |
>40 |
>40 |
|
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
15，16 |
15，16 |
13，15 |
10，12 |
Z direction |
-55 º~288ºC |
ppm/ºC |
78 |
72 |
58 |
51 |
|
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
||
Water Absorption |
20±2℃, 24 hours |
% |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
|
Density |
Room Temperature |
g/cm3 |
2.25 |
2.25 |
2.20 |
2.20 |
|
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
|
Thermal Conductivity |
Z direction |
W/(M.K) |
0.42 |
0.42 |
0.50 |
0.54 |
|
PIM |
Only applicable to F4BTME |
dBc |
≤-160 |
≤-160 |
≤-160 |
≤-160 |
|
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
|
Material Composition |
/ |
/ |
PTFE, Fiberglass Cloth, nano-ceramics |
||||