F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This printed circuit board (PCB) is designed as a double-sided board with two layers of copper, featuring a compact size of 171 mm x 58 mm. It supports surface mount components on the top side. The layer stackup consists of a top layer with 35 µm (1 oz) copper, starting with half-ounce plating, and is supported by a durable F4BTMS615 core material with a thickness of 1.524 mm in the middle. The PCB uses immersion gold for the surface finish and has a black solder mask applied to the top side.
The technology specifications include a minimum trace width of 4 mil and a minimum spacing of 6 mil, enabling precise circuit design. The surface finish is immersion gold, which enhances solderability and provides excellent corrosion resistance. Additionally, a black solder mask is applied to the top side of the PCB, offering durability and an appealing aesthetic while protecting the underlying circuitry from environmental factors.
PCB Specifications
F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold |
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PCB SIZE |
171 x 58mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35 um(0.5 oz+plate) TOP layer |
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F4BTMS615 -1.524 mm |
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copper ------- 35 um(0.5 oz + plate) BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
7 mil / 6 mil |
Minimum / Maximum Holes: |
0.5 mm / 1.5 mm |
Number of Different Holes: |
5 |
Number of Drill Holes: |
27 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
F4BTMS615 Dk6.15 |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.6 mm ±10% |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Top, Black |
Solder Mask Color: |
no |
Solder Mask Type: |
no |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Top |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.5mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BTMS High-Frequency Material
The F4BTMS series is an upgraded version of the F4BTM series, featuring significant advancements in material formulation and manufacturing processes. This material incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement, greatly enhancing its performance and resulting in a wider range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.
By incorporating a small amount of ultra-thin fiberglass cloth reinforcement along with a uniform mixture of special nanoceramics and polytetrafluoroethylene resin, the F4BTMS series minimizes dielectric loss and enhances dimensional stability. The material exhibits reduced anisotropy in the X/Y/Z directions, allowing for higher frequency usage, increased electrical strength, and improved thermal conductivity. It also possesses an excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.
The F4BTMS series comes standard with RTF low roughness copper foil, which reduces conductor loss and provides excellent peel strength. It can be paired with copper-based or aluminum-based options.
Features
1.Minimal dielectric constant tolerance and excellent batch-to-batch consistency.
2.Extremely low dielectric loss.
3.Stable dielectric constant and low loss within frequencies up to 40 GHz, meeting the requirements of phase-sensitive applications.
4.Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability between -55°C and 150°C.
5.Excellent resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation.
6.Low outgassing performance, meeting vacuum outgassing requirements for aerospace applications.
7.Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.
8.Improved thermal conductivity, suitable for high-power applications.
9.Excellent dimensional stability.
Data Sheet (F4BTMS)
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Product Technical Parameters |
Product Models & Data Sheet |
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Product Features |
Test Conditions |
Unit |
F4BTMS220 |
F4BTMS233 |
F4BTMS255 |
F4BTMS265 |
F4BTMS294 |
F4BTMS300 |
F4BTMS350 |
F4BTMS430 |
F4BTMS450 |
F4BTMS615 |
F4BTMS1000 |
Dielectric Constant (Typical) |
10GHz |
/ |
2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.00 |
3.50 |
4.30 |
4.50 |
6.15 |
10.20 |
Dielectric Constant Tolerance |
/ |
/ |
±0.02 |
±0.03 |
±0.04 |
±0.04 |
±0.04 |
±0.04 |
±0.05 |
±0.09 |
±0.09 |
±0.12 |
±0.2 |
Dielectric Constant (Design) |
10GHz |
/ |
2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.0 |
3.50 |
4.3 |
4.5 |
6.15 |
10.2 |
Loss Tangent (Typical) |
10GHz |
/ |
0.0009 |
0.0010 |
0.0012 |
0.0012 |
0.0012 |
0.0013 |
0.0016 |
0.0015 |
0.0015 |
0.0020 |
0.0020 |
20GHz |
/ |
0.0010 |
0.0011 |
0.0013 |
0.0014 |
0.0014 |
0.0015 |
0.0019 |
0.0019 |
0.0019 |
0.0023 |
0.0023 |
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40GHz |
/ |
0.0013 |
0.0015 |
0.0016 |
0.0018 |
0.0018 |
0.0019 |
0.0024 |
0.0024 |
0.0024 |
/ |
/ |
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Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-130 |
-122 |
-92 |
-88 |
-20 |
-20 |
-39 |
-60 |
-58 |
-96 |
-320 |
Peel Strength |
1 OZ RTF copper |
N/mm |
>2.4 |
>2.4 |
>1.8 |
>1.8 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>34 |
>40 |
>40 |
>42 |
>44 |
>45 |
>48 |
>23 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>35 |
>38 |
>40 |
>42 |
>48 |
>52 |
>55 |
>52 |
>54 |
>55 |
>42 |
Coefficientof Thermal Expansion (X, Y direction) |
-55 º~288ºC |
ppm/ºC |
40, 50 |
35, 40 |
15, 20 |
15, 20 |
10, 12 |
10, 11 |
10, 12 |
13, 12 |
12, 12 |
10, 12 |
16, 18 |
Coefficientof Thermal Expansion (Z direction) |
-55 º~288ºC |
ppm/ºC |
290 |
220 |
80 |
72 |
22 |
22 |
20 |
47 |
45 |
40 |
32 |
Thermal Stress |
260℃, 10s，3 times |
/ |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
0.02 |
0.02 |
0.025 |
0.025 |
0.02 |
0.025 |
0.03 |
0.08 |
0.08 |
0.1 |
0.03 |
Density |
Room Temperature |
g/cm3 |
2.18 |
2.22 |
2.26 |
2.26 |
2.25 |
2.28 |
2.3 |
2.51 |
2.53 |
2.75 |
3.2 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.26 |
0.28 |
0.31 |
0.36 |
0.58 |
0.58 |
0.6 |
0.63 |
0.64 |
0.67 |
0.81 |
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE，Ultra-thin and ultra-fine (quartz) fiberglass. |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
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