F4B PCB/F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold

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F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This is a 2-layer high-frequency printed circuit board (PCB) built on Wangling F4BTME320 substrates. Both the top and bottom layers feature 70 µm (2 oz) copper, starting from 1 oz plating. The design supports surface mount components on the top side, while through-hole components are not utilized.

The technology specifications include a minimum trace width of 4 mil and a minimum spacing of 6 mil, enabling precise circuit design. The surface finish is immersion gold, which enhances solderability and provides excellent corrosion resistance. Additionally, a black solder mask is applied to the top side of the PCB, offering durability and an appealing aesthetic while protecting the underlying circuitry from environmental factors.

PCB Specifications

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F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold
PCB SIZE	70 x 70mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 70 um(1 oz+plate) TOP layer
	F4BTME320 - 1.0mm
	copper ------- 70um(1 oz + plate) BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 6 mil
Minimum / Maximum Holes:	0.4 mm / 1.2 mm
Number of Different Holes:	7
Number of Drill Holes:	92
Number of Milled Slots:	2
Number of Internal Cutouts:	1
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	F4BTME320 Dk3.2
Final foil external:	2 oz
Final foil internal:	N/A
Final height of PCB:	1.1 mm ±10%
PLATING AND COATING
Surface Finish	Immersion Gold
Solder Mask Apply To:	Top, Black
Solder Mask Color:	no
Solder Mask Type:	no
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top
Colour of Component Legend	White
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

F4BTME High-Frequency Laminates

F4BTME high-frequency laminates are composed of glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene resin, produced through scientific preparation and strict pressing processes. This series is based on the F4BM dielectric layer, enhanced with high-dielectric and low-loss nanoscale ceramics, resulting in:

Higher dielectric constant
Improved heat resistance
Lower coefficient of thermal expansion
Higher insulation resistance
Better thermal conductivity
Maintained low loss characteristics

F4BTME is cladded with reverse treated copper foil (RTF), offering an excellent PIM index, more accurate line control, and lower conductor loss, with optional thicknesses available in 0.5 oz and 1 oz.

Our PCB Capability (F4BTMS)

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PCB Capability (F4BTME)
PCB Material:	PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTME )	F4BTM	DK (10GHz)	DF (10 GHz)
	F4BTME298	2.98±0.06	0.0018
	F4BTME300	3.0±0.06	0.0018
	F4BTME320	3.2±0.06	0.0020
	F4BTME350	3.5±0.07	0.0025
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness)	0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

Data Sheet (F4BTME)

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Product Technical Parameters

Product Model & Data Sheet

Product Features

Test Conditions

Unit

F4BME217

F4BME220

F4BME233

F4BME245

F4BME255

F4BME265

F4BME275

F4BME294

F4BME300

Dielectric Constant (Typical)

10GHz

2.17

2.2

2.33

2.45

2.55

2.65

2.75

2.94

3.0

Dielectric Constant Tolerance

±0.04

±0.05

±0.06

Loss Tangent (Typical)

10GHz

0.001

0.0011

0.0012

0.0013

0.0015

0.0016

0.0017

20GHz

0.0014

0.0015

0.0017

0.0018

0.0019

0.0021

0.0023

0.0025

Dielectric Constant Temperature Coefficient

-55ºC～150ºC

PPM/℃

-150

-142

-130

-120

-110

-100

-92

-85

-80

Peel Strength

1 OZ F4BM

N/mm

>1.8

1 OZ F4BME

N/mm

>1.6

Volume Resistivity

Standard Condition

MΩ.cm

≥6×10^6

Surface Resistivity

Standard Condition

MΩ

≥1×10^6

Electrical Strength (Z direction)

5KW，500V/s

KV/mm

>23

>25

>28

>30

Breakdown Voltage (XY direction)

5KW，500V/s

>30

>32

>34

>35

>36

Coefficientof Thermal Expansion

XY direction

-55 º~288ºC

ppm/ºC

25, 34

22, 30

20, 25

16, 21

14, 17

14, 16

12, 15

Z direction

-55 º~288ºC

ppm/ºC

240

205

187

173

142

112

Thermal Stress

260℃, 10s，3 times

No delamination

Water Absorption

20±2℃, 24 hours

≤0.08

Density

Room Temperature

g/cm3

2.17

2.18

2.20

2.22

2.25

2.28

2.29

Long-Term Operating Temperature

High-Low Temperature Chamber

℃

-55～+260

Thermal Conductivity

Z direction

W/(M.K)

0.24

0.28

0.30

0.33

0.36

0.38

0.41

0.42

PIM

Only applicable to F4BME

dBc

≤-159

Flammability

UL-94

V-0

Material Composition

PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

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Next F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold

PCB Categories

F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold