F4BTMS265 High Frequency PCB 0.8mm Substrates 1oz Copper With Immersion Gold and Black Solder Mask
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This is a double-sided PCB featuring two layers of copper and designed exclusively for surface mount components. The PCB measures 120mm x 65mm and utilizes a single piece in the panel. It starts with 17 µm (0.5 oz) copper plating on both the top and bottom layers. The core material, F4BTMS265, has a thickness of 0.762 mm and is positioned in the center. The surface finish is immersion gold, and the solder mask on the top layer is black.
PCB Specifications
F4BTMS265 High Frequency PCB 0.8mm Substrates 1oz Copper With Immersion Gold and Black Solder Mask |
|
PCB SIZE |
120 x 65mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 17um(0.5 oz)+plate TOP layer |
F4BTMS265 -0.762mm |
|
copper ------- 17um(0.5 oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
5 mil / 5 mil |
Minimum / Maximum Holes: |
0.35 mm / 0.6 mm |
Number of Different Holes: |
6 |
Number of Drill Holes: |
81 |
Number of Milled Slots: |
1 |
Number of Internal Cutouts: |
1 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
F4BTMS265 Dk2.65 |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.8 mm ±10% |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Top, Black |
Solder Mask Color: |
no |
Solder Mask Type: |
no |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Top |
Colour of Component Legend |
NO |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.35mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BTMS High-Frequency Material
The F4BTMS series is an upgraded version of the F4BTM series, featuring significant technological advancements in material formulation and manufacturing processes. This material incorporates a higher concentration of ceramics and utilizes ultra-thin, ultra-fine fiberglass cloth reinforcement, enhancing performance and offering a wider range of dielectric constants. It is suitable for high-reliability applications, particularly in aerospace, and can replace similar foreign products.
By integrating a small amount of ultra-thin fiberglass reinforcement with a uniform mixture of special nanoceramics and polytetrafluoroethylene resin, the F4BTMS series minimizes dielectric loss and enhances dimensional stability. The material exhibits reduced anisotropy in the X/Y/Z directions, allowing for higher frequency usage, increased electrical strength, and improved thermal conductivity. It also has an excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.
The F4BTMS series comes standard with RTF low roughness copper foil, which reduces conductor loss and provides excellent peel strength. It can be paired with either copper-based or aluminum-based options.
Typical Applications
Aerospace equipment
Space and cabin equipment
Microwave and radio frequency applications
Radar and military radar systems
Feed networks
Phase-sensitive and phased array antennas
Satellite communications
Our PCB Capability (F4BTMS)
PCB Capability (F4BTMS) |
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PCB Material: |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
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Designation (F4BTMS ) |
F4BTMS |
DK (10GHz) |
DF (10 GHz) |
F4BTMS220 |
2.2±0.02 |
0.0009 |
|
F4BTMS233 |
2.33±0.03 |
0.0010 |
|
F4BTMS255 |
2.55±0.04 |
0.0012 |
|
F4BTMS265 |
2.65±0.04 |
0.0012 |
|
F4BTMS294 |
2.94±0.04 |
0.0012 |
|
F4BTMS300 |
3.0±0.04 |
0.0013 |
|
F4BTMS350 |
3.5±0.05 |
0.0016 |
|
F4BTMS430 |
4.3±0.09 |
0.0015 |
|
F4BTMS450 |
4.5±0.09 |
0.0015 |
|
F4BTMS615 |
6.15±0.12 |
0.0020 |
|
F4BTMS1000 |
10.2±0.2 |
0.0020 |
|
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
||
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
||
Dielectric thickness |
0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) |
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PCB size: |
≤400mm X 500mm |
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Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
||
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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Data Sheet (F4BTMS)
Product Technical Parameters |
Product Models & Data Sheet |
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Product Features |
Test Conditions |
Unit |
F4BTMS220 |
F4BTMS233 |
F4BTMS255 |
F4BTMS265 |
F4BTMS294 |
F4BTMS300 |
F4BTMS350 |
F4BTMS430 |
F4BTMS450 |
F4BTMS615 |
F4BTMS1000 |
Dielectric Constant (Typical) |
10GHz |
/ |
2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.00 |
3.50 |
4.30 |
4.50 |
6.15 |
10.20 |
Dielectric Constant Tolerance |
/ |
/ |
±0.02 |
±0.03 |
±0.04 |
±0.04 |
±0.04 |
±0.04 |
±0.05 |
±0.09 |
±0.09 |
±0.12 |
±0.2 |
Dielectric Constant (Design) |
10GHz |
/ |
2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.0 |
3.50 |
4.3 |
4.5 |
6.15 |
10.2 |
Loss Tangent (Typical) |
10GHz |
/ |
0.0009 |
0.0010 |
0.0012 |
0.0012 |
0.0012 |
0.0013 |
0.0016 |
0.0015 |
0.0015 |
0.0020 |
0.0020 |
20GHz |
/ |
0.0010 |
0.0011 |
0.0013 |
0.0014 |
0.0014 |
0.0015 |
0.0019 |
0.0019 |
0.0019 |
0.0023 |
0.0023 |
|
40GHz |
/ |
0.0013 |
0.0015 |
0.0016 |
0.0018 |
0.0018 |
0.0019 |
0.0024 |
0.0024 |
0.0024 |
/ |
/ |
|
Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-130 |
-122 |
-92 |
-88 |
-20 |
-20 |
-39 |
-60 |
-58 |
-96 |
-320 |
Peel Strength |
1 OZ RTF copper |
N/mm |
>2.4 |
>2.4 |
>1.8 |
>1.8 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>34 |
>40 |
>40 |
>42 |
>44 |
>45 |
>48 |
>23 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>35 |
>38 |
>40 |
>42 |
>48 |
>52 |
>55 |
>52 |
>54 |
>55 |
>42 |
Coefficientof Thermal Expansion (X, Y direction) |
-55 º~288ºC |
ppm/ºC |
40, 50 |
35, 40 |
15, 20 |
15, 20 |
10, 12 |
10, 11 |
10, 12 |
13, 12 |
12, 12 |
10, 12 |
16, 18 |
Coefficientof Thermal Expansion (Z direction) |
-55 º~288ºC |
ppm/ºC |
290 |
220 |
80 |
72 |
22 |
22 |
20 |
47 |
45 |
40 |
32 |
Thermal Stress |
260℃, 10s，3 times |
/ |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
0.02 |
0.02 |
0.025 |
0.025 |
0.02 |
0.025 |
0.03 |
0.08 |
0.08 |
0.1 |
0.03 |
Density |
Room Temperature |
g/cm3 |
2.18 |
2.22 |
2.26 |
2.26 |
2.25 |
2.28 |
2.3 |
2.51 |
2.53 |
2.75 |
3.2 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.26 |
0.28 |
0.31 |
0.36 |
0.58 |
0.58 |
0.6 |
0.63 |
0.64 |
0.67 |
0.81 |
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
/ |
/ |
PTFE，Ultra-thin and ultra-fine (quartz) fiberglass. |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
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