Metal Based High Frequency PCB Aluminum Based Copper Based RF PCB Immersion Gold
(Printed Circuit Boards are custom-made products, the pictures and parameters shown are just for reference)
Metal-Based High-Frequency PCB Overview
Brief Introduction
Metal-based substrates combine metal-based high-frequency materials with an intermediate layer of high-frequency materials like PTFE. One side is coated with copper foil, while the other side features either a copper or aluminum base, serving purposes such as shielding and heat dissipation. The printed circuit board (PCB) fabricated from this modified material is known as a metal-based high-frequency PCB
Wangling’s series of high-frequency materials, including F4BM, F4BME, F4BTM, F4BTME, and F4BTMS, provide options for aluminum or copper bases. Specific details are outlined in the tables below.
F4BM and F4BME Series Aluminum/Copper Substrates
F4BM and F4BME series aluminum/copper substrates |
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Model |
Metal base |
Proportion |
Thermal Conductivity |
Available thicknesses of Copper or aluminum base |
Thickness tolerance of Metal base |
Availabe size |
F4BM217-AL |
Aluminum base |
2.7 |
180 W/mK |
0.48mm, 0.98mm, 1.48mm, 1.98mm, 2.98mm, 3.98mm, other thicknessnes are availabe for customization |
+0.02mm, -0.05mm |
460mm x 610mm (18"x24"), 460mm x 305mm (18"x12") |
F4BM220-AL |
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F4BM233-AL |
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F4BM245-AL |
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F4BM255-AL |
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F4BM265-AL |
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F4BM275-AL |
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F4BM294-AL |
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F4BM300-AL |
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F4BME217-AL |
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F4BME220-AL |
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F4BME233-AL |
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F4BME245-AL |
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F4BME255-AL |
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F4BME265-AL |
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F4BME275-AL |
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F4BME294-AL |
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F4BME300-AL |
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F4BM217-CU |
Red copper brass |
8.9 |
380 W/mK |
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F4BM220-CU |
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F4BM233-CU |
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F4BM245-CU |
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F4BM255-CU |
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F4BM265-CU |
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F4BM275-CU |
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F4BM294-CU |
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F4BM300-CU |
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F4BME217-CU |
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F4BME220-CU |
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F4BME233-CU |
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F4BME245-CU |
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F4BME255-CU |
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F4BME265-CU |
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F4BME275-CU |
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F4BME294-CU |
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F4BME300-CU |
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Model |
Metal base |
Proportion |
Thermal Conductivity |
Available thicknesses of Copper or aluminum base |
Thickness tolerance of Metal base |
Availabe size |
F4BTM298-AL |
Aluminum base |
2.7 |
180 W/mK |
0.48mm, 0.98mm, 1.48mm, 1.98mm, 2.98mm, 3.98mm, other thicknessnes are availabe for customization |
+0.02mm, -0.05mm |
460mm x 610mm (18"x24"), 460mm x 305mm (18"x12") |
F4BTM300-AL |
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F4BTM320-AL |
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F4BTM350-AL |
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F4BTME298-AL |
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F4BTME300-AL |
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F4BTME320-AL |
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F4BTME350-AL |
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F4BTM298-CU |
Red copper brass |
8.9 |
380 W/mK |
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F4BTM300-CU |
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F4BTM320-CU |
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F4BTM350-CU |
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F4BTME298-CU |
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F4BTME300-CU |
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F4BTME320-CU |
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F4BTME350-CU |
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F4BTMS Series Aluminum/Copper Substrates
Product Technical Parameters |
Product Models & Data Sheet |
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Product Features |
Test Conditions |
Unit |
F4BTMS220 |
F4BTMS233 |
F4BTMS255 |
F4BTMS265 |
F4BTMS294 |
F4BTMS300 |
F4BTMS350 |
F4BTMS430 |
F4BTMS450 |
F4BTMS615 |
F4BTMS1000 |
Dielectric Constant (Typical) |
10GHz |
/ |
2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.00 |
3.50 |
4.30 |
4.50 |
6.15 |
10.20 |
Dielectric Constant Tolerance |
/ |
/ |
±0.02 |
±0.03 |
±0.04 |
±0.04 |
±0.04 |
±0.04 |
±0.05 |
±0.09 |
±0.09 |
±0.12 |
±0.2 |
Dielectric Constant (Design) |
10GHz |
/ |
2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.0 |
3.50 |
4.3 |
4.5 |
6.15 |
10.2 |
Loss Tangent (Typical) |
10GHz |
/ |
0.0009 |
0.0010 |
0.0012 |
0.0012 |
0.0012 |
0.0013 |
0.0016 |
0.0015 |
0.0015 |
0.0020 |
0.0020 |
20GHz |
/ |
0.0010 |
0.0011 |
0.0013 |
0.0014 |
0.0014 |
0.0015 |
0.0019 |
0.0019 |
0.0019 |
0.0023 |
0.0023 |
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40GHz |
/ |
0.0013 |
0.0015 |
0.0016 |
0.0018 |
0.0018 |
0.0019 |
0.0024 |
0.0024 |
0.0024 |
/ |
/ |
|
Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-130 |
-122 |
-92 |
-88 |
-20 |
-20 |
-39 |
-60 |
-58 |
-96 |
-320 |
Peel Strength |
1 OZ RTF copper |
N/mm |
>2.4 |
>2.4 |
>1.8 |
>1.8 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>34 |
>40 |
>40 |
>42 |
>44 |
>45 |
>48 |
>23 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>35 |
>38 |
>40 |
>42 |
>48 |
>52 |
>55 |
>52 |
>54 |
>55 |
>42 |
Coefficientof Thermal Expansion (X, Y direction) |
-55 º~288ºC |
ppm/ºC |
40, 50 |
35, 40 |
15, 20 |
15, 20 |
10, 12 |
10, 11 |
10, 12 |
13, 12 |
12, 12 |
10, 12 |
16, 18 |
Coefficientof Thermal Expansion (Z direction) |
-55 º~288ºC |
ppm/ºC |
290 |
220 |
80 |
72 |
22 |
22 |
20 |
47 |
45 |
40 |
32 |
Thermal Stress |
260℃, 10s，3 times |
/ |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
0.02 |
0.02 |
0.025 |
0.025 |
0.02 |
0.025 |
0.03 |
0.08 |
0.08 |
0.1 |
0.03 |
Density |
Room Temperature |
g/cm3 |
2.18 |
2.22 |
2.26 |
2.26 |
2.25 |
2.28 |
2.3 |
2.51 |
2.53 |
2.75 |
3.2 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.26 |
0.28 |
0.31 |
0.36 |
0.58 |
0.58 |
0.6 |
0.63 |
0.64 |
0.67 |
0.81 |
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
/ |
/ |
PTFE，Ultra-thin and ultra-fine (quartz) fiberglass. |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
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Our PCB Capability (F4B-AL, F4B-CU)
PCB Capability (F4B**-AL / CU) |
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PCB Material: |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
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F4B Aluminum / Copper Base |
F4B |
DK (10GHz) |
DF (10 GHz) |
F4BM**-AL |
2.17 - 3.00 |
0.001 - 0.0018 |
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F4BME**-AL |
2.17 - 3.00 |
0.001 - 0.0018 |
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F4BTM**-AL |
2.98 - 3.50 |
0.0018 - 0.0025 |
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F4BTME**-AL |
2.98 - 3.50 |
0.0018 - 0.0025 |
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F4BTMS**-AL |
2.94 -10.2 |
0.0009-0.0022 |
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F4BM**-CU |
2.17 - 3.00 |
0.001 - 0.0018 |
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F4BME**-CU |
2.17 - 3.00 |
0.001 - 0.0018 |
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F4BTM**-CU |
2.98 - 3.50 |
0.0018 - 0.0025 |
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F4BTME**-CU |
2.98 - 3.50 |
0.0018 - 0.0025 |
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F4BTMS**-CU |
2.94 -10.2 |
0.0009-0.0022 |
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Layer count: |
Single Sided / Single Layer |
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Copper weight: |
1oz (35µm), 2oz (70µm) |
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Dielectric thickness |
0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) |
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PCB size: |
≤400mm X 500mm |
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Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
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Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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