10-Layer BGA PCB for High-Performance PLC Modules
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
General description
This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on the top of the circuit board, high pin-count on a 0.5mm pitch. The base material is from Shengyi and supplying 1 up board. It features HDI structure with blind via from inner layer 8 to bottom side, buried vias in inner layer 3 to inner layer 5. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.
A BGA (Ball Grid Array) package is positioned on the top layer, accommodating high pin-count components with a 0.5 mm pitch. The base material is sourced from Shengyi, and the PCB is fabricated according to IPC 6012 Class 2 standards, utilizing provided Gerber data. Each shipment consists of 20 boards, carefully packed for delivery.
Features and benefits
High Tg industrial-grade materials ensure exceptional thermal reliability.
Immersion gold plating guarantees excellent wetting during soldering and prevents copper corrosion.
In-house engineering design minimizes potential pre-production issues.
Certifications include ISO9001, ISO14001, IATF16949, ISO13485, and UL.
Customer complaint rate is maintained below 1%, with a delivery rate exceeding 98%.
Capable of transitioning from prototype to volume production.
Supports multilayer and any layer HDI PCB configurations.
Over 20 years of experience in PCB manufacturing.
.jpg)
Applications:
This PCB is suitable for a variety of applications, including:
Converters
USB Wireless Adapters
12V Inverters
Wireless Routers
Ladder Logic Controllers
Battery Inverters
CCTV Security Systems
Wireless G Routers
Programmable Controllers
Backplanes
PCB Specifications
| Item | Description | Value |
| Layer count | 10 Layers PCB | 10 Layers Board |
| Board type | Multilayer PCB | Multilayer PCB Board |
| Board size | 168.38 x 273.34mm=1up | 168.38 x 273.34mm=1up |
| Laminate | Laminate Type | FR4 |
| Supplier | SHENGYI | |
| Tg | TG ≧170 | |
| Finished thickness | 2.0+/-10% MM | |
| Plating Thickness | PTH Cu thickness | >20 um |
| Inner layer Cu Thickness | 1/1 OZ | |
| Surface Cu thickness | 35 um | |
| Solder Mask | Material type | LP-4G G-05 |
| Supplier | Nan Ya | |
| Color | Green | |
| Single / both sides | Both Sides | |
| S/M thickness | >=10.0 um | |
| 3M tape test | NO Peel Off | |
| Legend | Material type | S-380W |
| Supplier | Tai yo | |
| Color | White | |
| Location | Both Sides | |
| 3M tape test | No peel off | |
| Circuit | Trace Width (mm) | 0.203+/-20%mm |
| Spacing (mm) | 0.203+/- 20%mm | |
| Identification | UL mark | 94V-0 |
| Company Logo | QM2 | |
| Date code | 1017 | |
| Mark location | CS | |
| Immersion Gold | Nickel | 100u'' |
| Gold | ≧2u'' | |
| Reliabilty Tests | Thermal shock test | 288±5℃, 10sec ,3 cycles |
| solder abllity test | 245±5℃ | |
| Function | Electrioal Test | 233+/-5℃ |
| Standard | IPC-A 600H class 2, IPC_6012C CLASS 2 | 100% |
| Appearance | Visual inspection | 100% |
| warp and twist | <= 0.75% |
BGA and Via Plug Information:
The BGA package type provides several advantages:
Reduced packaging area with increased functionality and pin count.
Self-centering solder during reflow soldering for easy assembly.
High reliability and excellent electrical performance at a lower cost.
PCBs featuring BGA typically have smaller via holes, designed to be 8-12 mil in diameter. Vias beneath BGA pads must be plugged with resin, prohibiting solder ink on pads and drilling on BGA pads. Available plug sizes include 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, and 0.55 mm.
.jpg)