18-Layer RO4350B High-Frequency PCB | 3.2mm Thick | ENIG + Selective Hard Gold Finish

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

Product Overview

Our 18-layer high frequency PCB utilizes Rogers RO4350B laminate with RO4450F bondply, designed for demanding RF and microwave applications. This multilayer board features a robust 3.2mm thickness with dual surface finish (ENIG + selective hard gold) for superior performance in high-power applications.

Key Specifications

Parameter	Specification
Base Material	Rogers RO4350B + RO4450F Bondply
Layer Count	18 layers
Dimensions	218 × 497 mm (±0.15mm)
Thickness	3.2mm
Copper Weight	1oz (35μm) all layers
Trace/Space	4/4 mils minimum
Min Hole Size	0.4mm
Via Technology	Blind vias (L11-L18)
Via Treatment	All resin-filled and capped
Surface Finish	ENIG + Selective Hard Gold (50μ")
Solder Mask	Blue (both sides)
Silkscreen	White (both sides)
Special Features	Via-in-pad, Press-fit holes
Quality Standard	IPC-Class 2
Testing	100% electrical test

Material Properties

RO4350B Core:
Dielectric Constant: 3.48±0.05 @10GHz/23°C
Dissipation Factor: 0.0037 @10GHz/23°C
Thermal Conductivity: 0.69 W/m/KB
CTE: X=10, Y=12, Z=32 ppm/°C
Tg: >280°C
Water Absorption: 0.06%
UL 94 V-0 rated

RO4450F Bondply:
Dielectric Constant: 3.52±0.05 @10GHz/23°C
Dissipation Factor: 0.004 @10GHz/23°C
Thermal Conductivity: 0.65 W/m/K
CTE: X=19, Y=17, Z=50 ppm/°C
Excellent lamination compatibility

PCB Stackup

Copper_layer_1 - 35 μm
Rogers RO4350B Core - 0.102 mm (4mil)
Copper_layer_2 - 35 μm
-----------4mil RO4450F Bondply -------------
Copper_layer_3 - 35 μm
Rogers RO4350B Core - 0.102 mm (4mil)
Copper_layer_4 - 35 μm
-----------4mil RO4450F Bondply -------------
..................
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Copper_layer_15 - 35 μm
Rogers RO4350B Core - 0.102 mm (4mil)
Copper_layer_16 - 35 μm
-----------4mil RO4450F Bondply -------------
Copper_layer_17 - 35 μm
Rogers RO4350B Core - 0.102 mm (4mil)
Copper_layer_18 - 35 μm

PCB Statistics

Components: 651
Total Pads: 779
Thru-hole Pads: 338
SMT Pads: 441 (Top:262, Bottom:179)
Vias: 632
Nets: 12

Artwork Format: Gerber RS-274-X
Global Availability

Typical Applications

5G Cellular Base Station Antennas
High-Power RF Amplifiers
Automotive Radar Systems
Satellite Communication (LNB)
RF Identification Systems
Aerospace Electronics

Quality Assurance

IPC-Class 2 compliant
100% electrical testing
Dimensional stability control
Reliable plated through-hole quality
Severe thermal shock resistant