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6-Layer S1000-2M HDI PCB with HASL and 90 Ohm Impedance Control

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


Brief Introduction

This 6-layer printed circuit board utilizes high-Tg S1000-2M material, designed for differential impedance control on layer 3 (6 mil/7 mil and 6 mil/10 mil) and layer 4 (7 mil/7 mil and 6 mil/7 mil track/gap). Each layer is plated with 1 oz of copper and coated with hot air solder leveling (HASL) along with a green solder mask. The board features a high-density interconnection (HDI) configuration, incorporating blind vias from the top side to inner layer 4 and buried vias from inner layer 3 to inner layer 4. Fabricated according to IPC-class 2 standards, it is supplied with V-cut, with 25 boards packed for shipment.



PCB Parameters

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PCB Parameters
Item  Description  Requirement Actual Result
1. Laminate           Material Type  FR-4 S1000-2M FR-4 S1000-2M ACC
Tg 170℃ 170℃ ACC
Supplier SHENGYI SHENGYI ACC
Thickness 1.6±10% mm 1.63-1.68mm ACC
2.Plating thickness       Hole Wall ≥25µm 30.17µm ACC
Outer copper 35µm 41.09µm ACC
Inner Copper 30µm 33.69µm ACC
3.Solder mask                   Material Type TAIYO/ PSR-2000GT600D TAIYO/ PSR-2000GT600D ACC
Color  Green Green ACC
Rigidity (Pencil Test) ≥4H or above 5H ACC
S/M Thickness ≥10 µm 20.11µm ACC
Location Both Sides Both Sides ACC
4. Component Mark      Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S C/S ACC
5.Vias  Through holes Yes L1-L6 ACC
Blind vias Yes L1-L5 ACC
Buried vias Yes L4-L5 ACC
6. Identification        UL Mark  YES YES ACC
Date Code WWYY 0421  ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method HASL Lead Free HASL Lead Free ACC
Tin Thickness 3-6µm 4.06µm ACC
Nickel Thickness
Gold Thickness
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring  Min. Line Width (mil) 6mil 5.8mil ACC
Min. Spacing (mil) 5mil 5.2mil ACC
10.V-groove  Angle 30° 30° ACC
Residual thickness 0.5mm 0.5mm ACC
11. Beveling  Angle
Height
12. Function                 Electrical Test 100% PASS 100% PASS ACC
13. Appearance     IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.21% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5℃ OK ACC
Thermal Stress Test 288 ±5℃ OK ACC
Ionic Contamination Test ≦ 1.56 µg/c㎡ 0.56µg/c㎡ ACC

Applications

Computers: Suitable for high-performance computing systems.
Communications: Ideal for telecommunications devices.
Automotive Electronics: Meets the demands of automotive applications.


Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

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Hole Code PTH Required Actual value Result
1 Y 0.375  0.375  0.400  0.400  0.375  ACC
2 Y 0.500  0.500  0.550  0.525  0.525  ACC
3 Y 0.7*2.4 0.7*2.4 0.7*2.41 0.69*2.4 0.7*2.4 ACC
4 Y 0.625  0.625  0.600  0.625  0.600  ACC
5 Y 0.725  0.725 0.725 0.750 0.725 ACC
6 Y 0.900  0.925 0.900 0.900 0.900 ACC
7 Y 1.000  1.000 0.950 0.975 1.000 ACC
8 N 1.050  1.050 1.050 1.075 1.050 ACC
9 Y 1.300  1.300 1.300 1.325 1.325 ACC
10 Y 1.350  1.350 1.325 1.350 1.325 ACC
11 Y 1.575  1.575 1.600 1.600 1.575 ACC
12 Y 1.650  1.650 1.700 1.675 1.675 ACC
13 Y 1.700  1.700 1.750 1.725 1.725 ACC
14 Y 3.250  3.250 3.250 3.275 3.250 ACC
15 Y 3.450  3.450 3.400 3.425 3.450 ACC
16 Y 0.7*2.6 0.7*259 0.7*2.61 0.69*2.6 0.7*2.59 ACC

Impedance Test Report

Sample NO. Layer Line Width(mil)±10% Line Space (mil)±10% Impedance Type Required Value (ohm) Tolerance Actual Value Result
Single End Differential
1 L3 6.000  7.000  V 90.00  ±10% 93.59 ACC
L3 6.000  10.000  V 100.00  ±10% 102.33 ACC
L4 7.000  7.000  V 90.00  ±10% 88.99 ACC
L4 6.000  7.000  V 90.00  ±10% 90.76 ACC


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