S1000-2M High-Performance High Tg PCB with Low CTE
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
General Description
S1000-2M is a high-Tg printed circuit board material produced by Shengyi, known for its high performance and low Coefficient of Thermal Expansion (CTE). This material is ideal for multilayer PCBs and offers a thickness range of 0.05 mm to 3.2 mm, with copper weights varying from 0.5 oz to 3 oz.
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Features
Lead-Free Compatible: FR-4 laminate suitable for eco-friendly processes.
Tg of 170°C (DSC): Ensures thermal reliability.
UV Blocking and AOI Compatible: Facilitates automated inspection processes.
High Heat Resistance: Suitable for demanding applications.
Lower Z-axis CTE: Enhances dimensional stability.
Excellent Through-Hole Reliability: Ensures durability in assembly.
Anti-CAF Performance: Reduces the risk of conductive anodic filament failures.
Low Water Absorption: Protects against moisture-related issues.
Excellent Mechanical Processability: Facilitates easy manufacturing.
Applications
Computer: Ideal for high-performance computing applications.
Communication: Suitable for telecommunications equipment.
Automotive Electronics: Meets the rigorous demands of automotive applications.
High Layer Count PCBs: Designed for complex multilayer circuit boards.
Our PCB Capability (S1000-2M)
| Our PCB Capability (S1000-2M) | |
| PCB Material: | High Tg, High Performance and Low CTE Epoxy Resin |
| Designation: | S1000-2M |
| Dielectric constant: | 4.6 at 10GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver, ENEPIG, Pure gold etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
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General Properties of S1000-2M
| Test Items | Test Method | Test Condition | Unit | Typical Value |
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 |
| IPC-TM-650 2.4.25D | DSC | ℃ | 180 | |
| Td | IPC-TM-650 2.4.24.6 | TGA (5% W.L) | ℃ | 355 |
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 15 |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 41 |
| IPC-TM-650 2.4.24 | After Tg | ppm/℃ | 208 | |
| IPC-TM-650 2.4.24 | 50-260℃ | % | 2.4 | |
| Permittivity (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | - | 4.6 |
| Loss Tangent (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | - | 0.018 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ-cm | 8.7×108 |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 2.2×107 |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-0.5/23 | s | 133 |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-0.5/23 | kV | >45 |
| Peel Strength (1oz) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [lb/in] | 1.3 [7.43] |
| Flexural Strength (LW/CW) | IPC-TM-650 2.4.4 | A | Mpa | 567/442 |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.08 |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
| CTI | IEC60112 | A | Rating | PLC 3 |