8-Layer TU-883 HDI PCB with ENEPIG Finish and Advanced Specifications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Introduction of TU-883
TU-883 (ThunderClad 2) is a very low loss material made from high-performance resin. This material is reinforced with woven E-glass and features a low dielectric constant and dissipation factor, making it ideal for high-speed, low-loss, radio frequency, and wireless applications. TU-883 is compatible with lead-free processes and modified FR-4 processes. It also exhibits excellent moisture resistance, improved Coefficient of Thermal Expansion (CTE), superior chemical resistance, thermal stability, and CAF resistance.
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Key Features (TU-883)
High Tg (TMA): 170°C
Dielectric Constant: 3.39 @ 10GHz
Dissipation Factor: 0.0045 @ 10GHz
Stable Dk/Df Performance: Consistent over frequency and temperature.
FR-4 Compatibility: Works well with modified FR-4 processes.
Moisture Resistance: Suitable for demanding environments.
Lead-Free Reflow Process Compatible: Supports eco-friendly manufacturing.
Improved Z-Axis Thermal Expansion: Enhances dimensional stability.
Anti-CAF Capability: Reduces the risk of conductive anodic filament failures.
Excellent Through-Hole and Soldering Reliability: Ensures durability in assembly.
Halogen Free: Complies with environmental standards.
Basic PCB Specifications
| Specification | Details |
|---|---|
| Board Type | 8 layers |
| Material Type | TU-883 |
| Solder Mask | Both sides, Matt Black |
| Silkscreen Print | Top side, white |
| Surface Finish | ENEPIG |
| Total Board Thickness | 1.45mm ± 10% |
| Board Size | 97.3mm x 67.7mm (1 PCS) |
| Minimum Hole Size | 0.25mm |
| Solder Mask Thickness | 10um |
| Minimum Dielectric Thickness | 100um |
| Minimum Trace Line Width | 150um |
| Minimum Spacing | 160um |
| Blind Via | Yes (L1-L2, L7-L8) |
| Buried Via | Yes (L2-L7) |
| Back Drilled Via | Yes (L1-L6) |
| Impedance Controlled | 100 ohm, differential pairs, top layer, 4mil/5mil trace/gap (reference layer 2) |
| 90 ohm, differential pairs, bottom layer, 4mil/7mil trace/gap (reference layer 7) | |
| 50 ohm, differential pairs, layer 6 signal, 5mil/6mil trace/gap (reference layers 5, 7) | |
| Counterholes | Applied on top layer, 90 degrees, 0.5mm deep. |
| Edge Plating | Applied in designated areas. |
PCB Stack-up:8-Layer Rigid PCB (Component Side at Top)
| MATERIAL | COPPER LAYER | THICKNESS (um) | SPECIFICATION |
|---|---|---|---|
| COPPER | 1 | 45 | 18um base copper + 17um plating |
| TUC-TU883P | Prereg | 89 | IPC-4101/24 |
| COPPER | 2 | 35 | |
| S1000-2MB | Prepreg | 160 | IPC-4101/24 |
| COPPER | 3 | 35 | |
| FR-4 TU-883 | CORE | 254 | IPC-4101/24 |
| COPPER | 4 | 35 | |
| S1000-2MB | Prepreg | 160 | IPC-4101/24 |
| COPPER | 5 | 35 | |
| FR-4 TU-883 | CORE | 254 | IPC-4101/24 |
| COPPER | 6 | 35 | |
| S1000-2MB | Prepreg | 160 | IPC-4101/24 |
| COPPER | 7 | 35 | |
| TUC-TU883P | Prepreg | 89 | IPC-4101/24 |
| COPPER | 8 | 35 | 18um base copper + 17um plating |
PCB Statistics
Components: 49
Total Pads: 98
Thru Hole Pads: 46
Top SMT Pads: 38
Bottom SMT Pads: 14
Vias: 63
Nets: 6
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Additional Information
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
Typical Applications
Radio Frequency
Backplane, High Performance Computing
Line Cards, Storage
Servers
Telecom, Base Stations
Office Routers
