20-Layer TU-883 HDI PCB with Immersion Gold and 50 Ohm Impedance
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Brief Introduction
This low-loss, high-performance multi-layer PCB is constructed using TUC’s TU-883 core and features 20 copper layers. The copper foils alternate between 1 oz and 0.5 oz. The overall thickness of the PCB is 3.0 mm, with immersion gold plating on the pads, a green solder mask, and white silkscreen. The board includes an HDI configuration with blind vias from the top to inner layer 1, from inner layer 18 to the bottom side, and buried vias connecting inner layer 1 to inner layer 18. It is designed as an impedance-controlled PCB, maintaining 50 ohm impedance on each signal layer with a tolerance of 10%. Fabricated according to IPC-class 2 standards, each set of 10 boards is vacuum packed for shipment.
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PCB Specifications
| Item | Properties | Value |
| 1. Laminate | Material Type | TU-883 |
| Tg | 170℃ | |
| Supplier | TUC | |
| Thickness | 2.8-3.1mm | |
| 2.Plating thickness | Hole Wall | 26.51µm |
| Outer copper | 41.09µm | |
| Inner Copper | 15µm / 31µm | |
| 3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D |
| Color | Green | |
| Rigidity (Pencil Test) | 5H | |
| S/M Thickness | 20.11µm | |
| Location | Both Sides | |
| 4. Component Mark | Material Type | IJR-4000 MW300 |
| Color | White | |
| Location | C/S, S/S | |
| 5. Vias | Throught holes | L1-L20 |
| Blind vias | L1-L2, L18-L20 | |
| Buried vias | L2-L19 | |
| 6. Identification | UL Mark | YES |
| Date Code | 1025 | |
| Mark Location | Solder Side | |
| 7. Surface Finish | Method | Immersion Gold |
| Nickel Thickness | 4.06µm | |
| Gold Thickness | 0.056µm | |
| 8. Normativeness | RoHS | Directive 2015/863/EU |
| REACH | Directive 1907 /2006 | |
| 9.Annular Ring | Min. Line Width (mil) | 4.8mil |
| Min. Spacing (mil) | 5.2mil | |
| 10.V-groove | Angle | / |
| Residual thickness | / | |
| 11. Beveling | Angle | / |
| Height | / | |
| 12. Function | Electrical Test | 100% PASS |
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 |
| Visual Inspection | IPC-A-600J &6012D Class 2 | |
| Warp and Twist | 0.21% | |
| 14. Reliability Test | Tape Test | No Peeling |
| Solvent Test | No Peeling | |
| Solderability Test | 265 ±5℃ | |
| Thermal Stress Test | 288 ±5℃ | |
| Ionic Contamination Test | 0.56µg/c㎡ |
Stackup & Impedance Controlled
HDI Vias
Applications
Radio Frequency: Suitable for RF applications.
Backplane: Designed for high-performance computing environments.
Line Cards: Optimized for efficient data handling.
Storage Solutions: Ideal for data storage systems.
Servers: Supports high-demand server applications.
Telecommunications: Essential for telecom infrastructure.
Base Stations: Suitable for mobile network base stations.
Office Routers: Ideal for routing solutions in office settings.
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