Advanced 4-Layer RO3203 Blind Via PCB for High-Frequency Circuitry
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to RO3203
RO3203 High Frequency Circuit Materials are ceramic-filled laminates reinforced with woven fiberglass. They are designed to deliver exceptional electrical performance and mechanical stability at competitive prices. RO3203 is an extension of the RO3000 Series, featuring improved mechanical stability. With a dielectric constant of 3.02 and a dissipation factor of 0.0016, these materials are suitable for frequencies exceeding 40 GHz.
Features
Materials: Rogers RO3203 ceramic-filled PTFE composites
Dielectric Constant: 3.02 ± 0.04 at 10 GHz/23°C
Dissipation Factor: 0.0016 at 10 GHz/23°C
Thermal Degradation Temperature: > 500°C
Thermal Conductivity: 0.87 W/mK
Coefficient of Thermal Expansion: X axis 13 ppm/°C, Y axis 13 ppm/°C, Z axis 58 ppm/°C
Compatibility: Lead-free process, 94V-0 flammability
PCB Construction Details
| Parameter | Details |
|---|---|
| Base Material | RO3203 |
| Layer Count | 4 layers |
| Board Dimensions | 49.6mm x 25.2mm (1 PCS) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | L1 to L2 |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1 oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion Silver |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Testing | 100% electrical test prior to shipment |
PCB Stackup
| Layer | Details |
|---|---|
| Copper Layer 1 | 35 µm |
| Rogers RO3203 Substrate | 10 mil (0.254mm) |
| Copper Layer 2 | 35 µm |
| Prepreg FR-28 | - |
| Copper Layer 3 | 35 µm |
| Rogers RO3203 Substrate | 10 mil (0.254mm) |
| Copper Layer 4 | 35 µm |
PCB Statistics:
Components: 10
Total Pads: 20
Through Hole Pads: 10
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 15
Nets: 4
Artwork and Standards:
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2B
Availability: Worldwide
Benefits:
Woven Glass Reinforcement: Improves rigidity for easier handling
Uniform Performance: Ideal for complex multi-layer high-frequency structures
Low Dielectric Loss: Suitable for applications exceeding 20 GHz
Low Expansion Coefficient: Matches copper for reliable assemblies
Excellent Dimensional Stability: Ensures high production yields
Cost-Effective: Economically priced for volume manufacturing
Smooth Surface: Allows finer line etching tolerances
Typical Applications:
Automotive collision avoidance systems
Global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas
Direct broadcast satellites
Datalink systems for cable
Remote meter reading
Power backplanes
LMDS and wireless broadband
Base station infrastructure