Advanced 6-Layer Hybrid PCBs with RO4003C and FR-4 for High-Frequency Applications
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction of RO4003C
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics that combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. These laminates provide tight control over the dielectric constant (Dk) and exhibit low loss, utilizing standard epoxy/glass processing methods at a fraction of the cost of conventional microwave laminates. Unlike PTFE-based materials, RO4003C does not require special through-hole treatments or handling procedures.
RO4003C materials are non-brominated and are not rated UL 94 V-0.
Features of RO4003C
Dielectric Constant: DK 3.38 ± 0.05 at 10GHz
Dissipation Factor: 0.0027 at 10GHz
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C (ranging -50°C to 150°C)
CTE Matched to Copper: X-axis 11 ppm/°C, Y-axis 14 ppm/°C
Low Z-axis CTE: 46 ppm/°C
Tg: >280°C
Low Moisture Absorption: 0.06%
Basic PCB Specifications
| Specification | Details |
|---|---|
| Base Material | RO4003C and FR-4 mixed |
| Layer Count | 6 layers |
| Board Dimensions | 83.50mm x 66mm (1 PCS), ± 0.15mm |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.2mm |
| Blind and Buried Vias | Top layer to inner layer 1 (L2), inner layer 2 to inner layer 3 (L3-L4) |
| Finished Board Thickness | 1.1mm |
| Finished Copper Weight | 1oz (1.4 mils) inner/outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Matt Green |
| Bottom Solder Mask | Matt Green |
| Impedance Control | 50 ohm on 4mil / 4mil traces/gaps, top layer |
| Print Series Number | Included |
| Via Filling | 0.2mm vias filled and capped |
| Electrical Testing | 100% electrical test prior to shipment |
PCB Stack-Up (6-Layer Rigid PCB)
| Layer | Material | Thickness |
|---|---|---|
| Copper Layer 1 | Copper | 35 µm |
| Copper Layer 2 | RO4003C | 0.305 mm (12 mil) |
| Copper Layer 3 | Copper | 35 µm |
| Prepreg Bondply | 1080 RC63% | 0.0644 mm (2.5 mil) |
| Copper Layer 4 | Copper | 35 µm |
| FR-4 | Core | 0.076 - 0.203 mm (3 mil) |
| Copper Layer 5 | Copper | 35 µm |
| Prepreg Bondply | 1080 RC63% | 0.0644 mm (2.5 mil) |
| Copper Layer 6 | Copper | 35 µm |
| RO4003C | Core | 0.305 mm (12 mil) |
PCB Statistics:
Components: 51
Total Pads: 82
Through Hole Pads: 53
Top SMT Pads: 29
Bottom SMT Pads: 0
Vias: 49
Nets: 6
Artwork and Standards Information
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Typical Applications
Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter wave applications
Radar systems
Guidance systems
Point-to-point digital radio antennas