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An In-Depth Look at IT-180A 4-Layer PCBs with Superior Thermal Properties

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)


Introduction of IT-180A

IT-180ATC is a high Tg (175°C by DSC) multifunctional filled epoxy known for its excellent thermal reliability and CAF resistance. It is suitable for various applications and can withstand lead-free assembly processes at temperatures up to 260°C.


Typical Properties

Glass Transition Temperature (Tg): 175°C by DSC
Lead-Free Process Compatibility: Yes
Coefficient of Thermal Expansion: X-Axis 11-13 ppm/°C, Y-Axis 13-15 ppm/°C
Time to Delaminate (Copper removed): T260 of 60 minutes, T288 of 20 minutes
Dielectric Constant (DK): 4.4 at 1 GHz, 4.5 at 1 MHz
Loss Tangent (Df): 0.014 at 1 MHz, 0.015 at 1 GHz
CAF Resistance: Excellent
Through-Hole Reliability: Good
Moisture Resistance: 0.1%
Flammability Rating: UL94-V0 for laminate and laminated prepreg



Basic PCB Specifications

Specification Details
Base Material FR-4 (IT-180)
Layer Count 4 layers
Board Dimensions 130mm x 175mm (6 PCS), ± 0.15mm
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.2mm
Blind Vias L1-L2
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 µm
Surface Finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen White
Top Solder Mask Green
Bottom Solder Mask Green
Electrical Testing 100% electrical test prior to shipment
Countersink Holes On the top side

PCB Stack-Up (4-Layer Rigid PCB)

Layer Material Thickness
Copper Layer 1 Copper 0.035 mm
Prepreg 7628H X 1 0.21 mm
Copper Layer 2 Copper 0.035 mm
IT-180ATC Core Core 1.03 mm (40.5 mil)
Copper Layer 3 Copper 0.035 mm
Prepreg 7628H X 1 0.21 mm
Copper Layer 4 Copper 0.035 mm

PCB Statistics:

Components: 59
Total Pads: 137
Through Hole Pads: 86
Top SMT Pads: 51
Bottom SMT Pads: 12
Vias: 73
Nets: 4


Artwork and Standards Information

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide


Typical Applications

Automotive engine room ECU
Backplanes
Data storage
Server and networking equipment
Telecommunications



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