High-Performance 10-Layer HDI PCBs Using IT-180 for Reliable Circuit Design
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to IT-180
IT-180ATC is an advanced high Tg (175°C by DSC) multifunctional filled epoxy known for its high thermal reliability and CAF resistance. This material is suitable for a wide range of applications and can withstand 260°C lead-free assembly processes, making it ideal for modern electronic designs.
RO4003C laminates are available in various configurations, using both 1080 and 1674 glass fabric styles, all meeting strict electrical performance specifications. The material is non-brominated and not UL 94 V-0 rated.
Key Features of IT-180
High Tg: 175°C (DSC)
Dielectric Constant: 4.4 @ 10GHz
Dissipation Factor: 0.015 @ 10GHz
Low CTE: 11-13 ppm/°C (X/Y Axis), 13-15 ppm/°CB
High Thermal Reliability: T266 > 60 minutes; T288 > 20 minutes
Excellent CAF Resistance: Good through-hole reliability
Improved Z-Axis Thermal Expansion
Anti-CAF Capability
Lead-Free Compatibility
UL 94 V0 Flammability Rating
Basic PCB Specifications
| Specification | Details |
|---|---|
| Board Type | 10 layers, N+4+N HDI PCB |
| Material Type | FR-4 ITEQ IT-180A |
| Solder Mask | Both sides, Green |
| Silkscreen Print | Both sides, White |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Total Board Thickness | 1.6mm ± 10% |
| Board Size | 269mm x 213mm (1 PCS) |
| Minimum Hole Size | 0.2mm |
| Solder Mask Thickness | 10µm |
| Minimum Dielectric Thickness | 100µm |
| Minimum Trace Line Width | 110µm |
| Minimum Spacing | 110µm |
| Blind Vias | Yes, between L1-L2 and L7-L10 |
| Buried Vias | Yes, between L2-L8 |
| Via Filling | Filled and capped by Type VII |
PCB Stack-Up (10-Layer Rigid PCB)
| Material | Copper Layer | Thickness (µm) | Specification |
|---|---|---|---|
| Copper | 1 | 45 | 18µm base copper + 17µm plating |
| IT-180 PP | Prepreg | 100 | IPC-4101/24 |
| Copper | 2 | 18 | |
| IT-180 | Prepreg | 160 | IPC-4101/24 |
| Copper | 3 | 18 | |
| FR-4 IT-180 | Core | 200 | IPC-4101/24 |
| Copper | 4 | 18 | |
| IT-180 PP | Prepreg | 160 | IPC-4101/24 |
| Copper | 5 | 18 | |
| FR-4 IT-180 | Core | 200 | IPC-4101/24 |
| Copper | 6 | 18 | |
| IT-180 PP | Prepreg | 160 | IPC-4101/24 |
| Copper | 7 | 18 | |
| FR-4 IT-180 | Core | 100 | IPC-4101/24 |
| Copper | 8 | 18 | |
| IT-180 PP | Prepreg | 160 | IPC-4101/24 |
| Copper | 9 | 18 | |
| IT-180 PP | Prepreg | 100 | IPC-4101/24 |
| Copper | 10 | 45 | 18µm base copper + 17µm plating |
PCB Statistics:
Components: 281
Total Pads: 381
Through Hole Pads: 145
Top SMT Pads: 140
Bottom SMT Pads: 96
Vias: 3051
Nets: 10
Artwork and Standards Information
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Typical Applications
Automotive (Engine Room ECU)
Backplanes
Data Storage
Server and Networking
Telecommunications
Power Boards