High-Performance 4-Layer FR408HR PCBs with ENIG Finish for Advanced Applications
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to FR408HR:
FR408HR laminates and prepregs are produced using Isola's patented high-performance multifunctional resin system, reinforced with electrical grade E-glass fabric. This innovative system provides a 30% improvement in Z-axis expansion and delivers 25% more electrical bandwidth (lower loss) compared to competing products. These features, coupled with enhanced moisture resistance during reflow, create a product that excels in both thermal and electrical performance.
The FR408HR system is also designed to be laser fluorescing and UV blocking, ensuring maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems, and photo-imagable solder mask imaging.
Key Features of FR408HR:
Glass Transition Temperature (Tg): 190°C (measured by DSC)
Dielectric Constant: 3.65 at 10 GHz
Dissipation Factor: 0.0095 at 10 GHz
RoHS Compliant
Compatible with FR-4 processes
CAF Resistant
Lead-Free Assembly Compatible
0.8 mm Pitch Capable
6x 260°C Reflow Capable
6x 288°C Solder Float Capable
Time to Delaminate (unclad) by TMA: T260 > 60 minutes, T288 > 30 minutes
Flammability Rating: UL-94 V0 (for laminate and laminated prepreg)
Basic PCB Specifications:
| Specification | Details |
|---|---|
| Material Type | FR408HR |
| Board Type | 4 layers |
| Solder Mask | Both sides, Blue |
| Silkscreen Print | Both sides, White |
| Surface Finish | ENIG |
| Total Board Thickness | 1.6mm ± 10% |
| Board Size | 140mm x 160mm (1 PCS) |
| Minimum Hole Size | 0.3mm |
| Solder Mask Thickness | 10 µm |
| Minimum Dielectric Thickness | 100 µm |
| Minimum Trace Line Width | 102 µm |
| Minimum Spacing | 102 µm |
| Blind Via | Top to Inner Layer 1 |
| Buried Via | Inner Layer 2 to Inner Layer 3 |
| Via Filled and Capped | Yes |
PCB Stack-Up:
| Material | Copper Layer | Thickness (µm) | Specification |
|---|---|---|---|
| Copper | 1 | 45 | 35 µm base copper + 17 µm plating |
| FR408HR | Prepreg | 100 | IPC-4101/24 |
| Copper | 2 | 35 | |
| FR408HR | Core | 1230 | IPC-4101/24 |
| Copper | 3 | 35 | |
| FR408HR | Prepreg | 100 | IPC-4101/24 |
| Copper | 4 | 45 | 35 µm base copper + 17 µm plating |
PCB Statistics:
Components: 92
Total Pads: 201
Through Hole Pads: 75
Top SMT Pads: 87
Bottom SMT Pads: 39
Vias: 72
Nets: 8
Artwork and Standards Information
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Typical Applications:
High Density Interconnect (HDI) PCBs
High-Speed Digital Applications
High Thermal Reliability
Networking and Communications
Storage and Peripherals
Medical, Industrial, and Instrumentation