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Rogers RO4003C 20mil 0.508mm Microwave PCB High-Frequency PCB for RF Applications

(Custom Printed Circuit Boards (PCBs) are tailored products; the images and specifications provided are for reference only)


RO4003C hydrocarbon ceramic laminates are specifically engineered to deliver superior high-frequency performance and cost-effective circuit fabrication. When operational frequencies reach 500 MHz and above, the variety of laminates available to designers is significantly limited.


Key Properties of RO4003C

The RO4003C material possesses essential characteristics required by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss enables the use of RO4003C in numerous applications where conventional circuit board materials struggle due to higher operating frequencies.



Dielectric Constant Stability: The temperature coefficient of dielectric constant is among the lowest of any circuit board material, ensuring stability over a broad frequency range.
Thermal Coefficient of Expansion (CTE): The expansion coefficient of RO4003C closely matches that of copper, providing excellent dimensional stability—a crucial requirement for mixed dielectric multilayer board constructions.

The low Z-axis CTE of RO4003C ensures reliable quality in plated through holes, even under severe thermal shock conditions. Additionally, RO4003C has a glass transition temperature (Tg) exceeding 280°C, which allows its expansion characteristics to remain stable across the complete range of PCB processing temperatures.


PCB Specifications

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Rogers 20mil 0.508mm RO4003C High Frequency PCB Double Sided RF PCB Repeater PA

PCB SIZE

67 x 72mm=1up

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 35um(1 oz)+plate TOP layer

RO4003C 0.508mm

copper ------- 35um(1oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

7.9 mil / 5.9 mil

Minimum / Maximum Holes:

0.4 mm / 0.4 mm

Number of Different Holes:

1

Number of Drill Holes:

3

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RO4003C Tg280℃, er<3.48, Rogers Corp.

Final foil external:

1.5 oz

Final foil internal:

N/A

Final height of PCB:

0.6 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold, 37%

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.4mm.

FLAMIBILITY RATING

N/A

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


Typical Applications

.Automotive Radar and Sensors

.Cellular Base Station Antennas

.Broadcast Satellites

.Low Noise Block Converters

.Amplifiers

.RFID Technology



Data Sheet of Rogers 4003C (RO4003C)

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RO4003C Typical Value

Property

RO4003C

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.38±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.55

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0027
0.0021

Z

 

10 GHz/23℃
2.5 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+40

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.7 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

4.2 x 109

 

MΩ

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

19,650(2,850)
19,450(2,821)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

139(20.2)
100(14.5)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

276
(40)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.3

X,Y

mm/m
(mil/inch)

after etch+E2/150℃

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

11
14
46

X
Y
Z

ppm/℃

-55℃to288℃

IPC-TM-650 2.4.41

Tg

>280

 

℃ TMA

A

IPC-TM-650 2.4.24.3

Td

425

 

℃ TGA

 

ASTM D 3850

Thermal Conductivity

0.71

 

W/M/oK

80℃

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50℃

ASTM D 570

Density

1.79

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

1.05
(6.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

N/A

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 



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