RO3003™ + FR4 Hybrid 4-Layer PCB with Countersink Slot L2-L4 for Microwave, Radar & Automotive Applications

(Note: Printed Circuit Boards are custom-made. Images and parameters are for reference only.)

Introduction to RO3003™ Hybrid High Frequency PCB

Rogers RO3003 is a ceramic-filled PTFE composite laminate with a dielectric constant (Dk) of 3.00 ± 0.04 at 10GHz and an extremely low dissipation factor (Df) of 0.0010, offering exceptional high-frequency performance. This material is ideal for commercial microwave and RF applications, including automotive radar (up to 77GHz), band pass filters, microstrip patch antennas, and voltage-controlled oscillators.

This 4-layer hybrid board combines a 10mil (0.254mm) RO3003™ core with a 0.15mm FR4 TG170°C core, bonded together with prepreg. The stackup is finished with 1oz copper on outer layers and 0.5oz on inner layers. The board features a countersink slot from L2 to L4 with no plating required. With 1oz copper on all layers and ENIG surface finish, this PCB meets the demands of high-reliability microwave and RF applications.

Key Features of RO3003™ Hybrid PCB

• Dielectric Constant (Dk): 3.00 ± 0.04 @ 10GHz (process)

• Dissipation Factor (Df): 0.0010 @ 10GHz/23°C

• Thermal Coefficient of εr: -3 ppm/°C (-50°C to +150°C)

• High Thermal Conductivity: 0.50 W/m/K @ 50°C

• Low Moisture Absorption: 0.04%

• CTE: X/Y=17/16 ppm/°C, Z=25 ppm/°C (-55°C to 288°C)

• Decomposition Temperature (Td): 500°C

• Countersink slot L2-L4, no plating required

• Lead-Free Process Compatible, UL 94 V-0 flammability rating

• Excellent dimensional stability

Benefits of RO3003™ Hybrid PCB

• Stable Dk (3.00±0.04) — Consistent impedance control for high-frequency designs

• Ultra-Low Df (0.0010 @ 10GHz) — Minimal signal loss for RF and microwave applications

• Excellent Temperature Stability — TCDK of -3 ppm/°C ensures stable performance across temperature

• Uniform Mechanical Properties — Ideal for multilayer board designs with different dielectric constants

• Countersink Slot L2-L4 — Enables integration of components and connectors without plating

• High Td (500°C) — Exceptional thermal stability for demanding applications

• ENIG Finish — Excellent solderability, corrosion resistance, and wire bondability

PCB Construction Details

PCB Stackup (4-Layer Hybrid Structure)

Layer 1 (Top): Copper, 35 μm (1 oz)

Dielectric: RO3003™ Core, 0.254 mm (Dk 3.00 ± 0.04 @ 10GHz)

Layer 2 (Inner): Copper, 35 μm (1 oz)

Prepreg: 0.15 mm

Layer 3 (Inner): Copper, 35 μm (1 oz)

Dielectric: FR4 TG170°C Core, 0.15 mm

Layer 4 (Bottom): Copper, 35 μm (1 oz)

Total thickness: 0.694 mm

Countersink Slot L2-L4 (No Plating Required)

• Slot depth: From Layer 2 to Layer 4

• Plating: Not required

• Purpose: For component mounting or connector integration

• Surface finish: ENIG over exposed pads

Rogers RO3003™ – Product Introduction

RO3003™ is a ceramic-filled PTFE composite laminate offering a dielectric constant (Dk) of 3.00 ± 0.04 at 10GHz and an ultra-low dissipation factor (Df) of 0.0010. The material features a thermal coefficient of εr of -3 ppm/°C, ensuring stable electrical performance across a wide temperature range (-50°C to +150°C). With a thermal conductivity of 0.50 W/m/K and a decomposition temperature (Td) of 500°C, RO3003™ provides excellent thermal management for high-frequency applications.

The material exhibits outstanding dimensional stability with X/Y CTE of 17/16 ppm/°C and Z-axis CTE of 25 ppm/°C (-55°C to 288°C), closely matched to copper for reliable plated through holes. Its low moisture absorption (0.04%) ensures consistent electrical performance in humid environments.

Key Material Properties:

• Dk: 3.00 ± 0.04 @ 10GHz (process)

• Df: 0.0010 @ 10GHz/23°C

• TCDK: -3 ppm/°C (-50°C to +150°C)

• Thermal Conductivity: 0.50 W/m/K @ 50°C

• CTE X/Y: 17/16 ppm/°C, CTE Z: 25 ppm/°C (-55°C to 288°C)

• Td: 500°C

• Moisture Absorption: 0.04%

• Flammability: UL 94 V-0

• Lead-Free Process Compatible

Features and Benefits Summary

Feature	Benefit
Dk 3.00 ± 0.04 @ 10GHz	Stable dielectric constant for consistent impedance control
Df 0.0010 @ 10GHz	Ultra-low loss for high-frequency RF and microwave designs
TCDK: -3 ppm/°C	Excellent temperature stability, minimal variation
CTE: 17/16/25 ppm/°C	Excellent dimensional stability, reliable plated through holes
Td: 500°C	Exceptional thermal stability for demanding applications
Countersink Slot L2-L4	Enables component mounting without plating
IPC-6012 Class 3	High reliability for aerospace, defense, and automotive applications
ENIG finish	Excellent solderability, corrosion resistance, wire bondability

RO3003™ Typical Properties (Data Sheet)

Primary Application Areas

• Automotive radar (up to 77 GHz)

• Microwave, RF, and radar systems

• Band pass filters

• Microstrip patch antennas

• Voltage-controlled oscillators (VCOs)

• Phased array antennas

• Satellite communications and base station antennas

Quality Assurance

• Type of artwork supplied: Gerber RS-274-X

• Accepted standard: IPC-6012 Class 3

• Availability: Worldwide

• 100% Electrical test prior to shipment

• ISO 9001:2015 & UL certified facility

Standard Thickness, Panel Sizes & Claddings

Parameter	Options
Standard Thicknesses (RO3003)	0.005" (0.13mm) ±0.0005", 0.010" (0.25mm) ±0.0007", 0.020" (0.51mm) ±0.0010", 0.030" (0.76mm) ±0.0015", 0.060" (1.52mm) ±0.0030"
Standard Panel Sizes	12"x18" (305x457mm), 24"x18" (610x457mm)
Electrodeposited Copper Foil	½ oz (18μm), 1 oz (35μm)
Rolled Copper Foil	½ oz (18μm), 1 oz (35μm)