Hybrid PCB | Mixed Material 4-Layer PCB Made On 20 mil RO4350B + FR4 With Blind Via

(PCBs are custom-made products; the images and parameters shown are for reference only)

Introduction

Hello Everyone,
Continuing from our last article, today we will discuss the mixed material PCB made with 20 mil RO4350B and FR-4. In most cases, the high-frequency material plays a crucial role in signal transmission. Let's have a look the stack-up.

The stack-up consists of a core made of 20 mil (0.508mm) RO4350B high-frequency material for layers 1 and 2, where the signal transmission lines are located on the first layer of copper. Layers 3 and 4 consist of an epoxy glass material. These two cores are bonded together with a sheet of adhesive (prepreg).

Basic Specifications

Base Material	RO4350B 0.508 mm + FR4 0.6 mm + PP 0.306 mm
Layer Count	4 layers
Panel Size	75 mm x 82 mm = 1 type = 1 piece
Surface Finish	Immersion gold
Copper Weight	Outer layer 70 μm / Inner layer 35 μm
Solder Mask / Legend	Green / White
Final PCB Height	1.6 mm
Standard	IPC 6012 Class 2
Packing	20 panels packaged for shipment
Lead Time	10 working days
Shelf Life	6 months

Features and Benefits

1) The temperature coefficient of dielectric constant is among the lowest of any circuit board material, making it ideal for temperature sensitive applications;
2) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;
3) Signal integrity performance improvement over the stack-ups with all FR4 board;
4) ISO9001, ISO14001, IATF16949, UL Certified factory
5) Prototype to mass production capability

Applications

Mixer, Radar Data Acquisition Converter, Spread Spectrum, Duplexer

Parameter and Data Sheet