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F4BTME300 High Frequency PCB PTFE RF Circuit Board with Immersion Silver


(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)


Hello everyone,
Today, we will discuss the F4BTME high frequency circuit board—specifically, the F4BTME300 PCB.


This PCB measures 170 mm x 95 mm and is designed as a double-sided board featuring two layers. It accommodates surface mount components, while through-hole components are not part of this design. The layer stackup includes a top layer with 35 µm (1 oz) copper, starting with 0.5 oz plating, paired with a core material of F4BTME300 that has a thickness of 3.0 mm. The bottom layer also consists of 35 µm (1 oz) copper with plating. This PCB utilizes immersion silver for excellent solderability and protection. Notably, it does not have a solder mask applied, allowing direct access to the copper layers.


PCB Specifications

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F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver

PCB SIZE

170 x 95mm = 1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 35um(0.5 oz+plate) TOP layer

F4BTME300 - 3.0mm

copper ------- 35um(0.5 oz+plate) BOT Layer

Minimum Trace and Space:

7 mil / 7 mil

Minimum / Maximum Holes:

0.5 mm / 0.6 mm

Number of Different Holes:

5

Number of Drill Holes:

16

Number of Milled Slots:

0

Number of Internal Cutouts:

2

Impedance Control:

no

BOARD MATERIAL

 

Glass Epoxy:

F4BTME300 DK 3.0

Final foil external:

1oz

Final foil internal:

N/A

Final height of PCB:

3.1 mm ±10%

PLATING AND COATING

 

Surface Finish

Immersion silver

Solder Mask Apply To:

no

Solder Mask Color:

no

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

NO

Colour of Component Legend

NO

Manufacturer Name or Logo:

Marked on the board in a conductor and leged FREE AREA

VIA

Non-Plated through hole(PTH), minimum size 0.5mm.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


F4BTME300 PCB


The base color of the F4BTME300 PCB is brown.


F4BTME High Frequency Laminates

The F4BTME series laminates are produced through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.


These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant nano-ceramics, leading to enhanced dielectric performance, superior heat resistance, reduced thermal expansion, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.


Additionally, F4BTME laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of phase intermodulation (PIM), precise line control, and minimized conductor loss.


The dielectric constant ranges from 2.98 to 3.5, with ED copper foil available in 0.5 oz, 1 oz, 1.5 oz, and 2 oz options. RTF copper is available in 0.5 oz and 1 oz, with thicknesses ranging from 0.254 mm to 12.0 mm.


Data Sheet (F4BTME300)

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Product Technical Parameters & Product Models & Data Sheet
PropertyTest ConditionsUnitF4BTME298F4BTME300F4BTME320F4BTME350
Dielectric Constant (Typical)10GHz/2.983.03.23.5
DK Tolerance//±0.06±0.06±0.06±0.07
Loss Tangent @10GHz10GHz/0.00180.00180.00200.0025
Loss Tangent @20GHz20GHz/0.00230.00230.00260.0035
Volume ResistivityStandardMΩ.cm≥1×10^7
Surface ResistivityStandardMΩ≥1×10^6
Thermal ConductivityZ directionW/(M.K)0.420.420.500.54
PIM (F4BTME only)/dBc≤-160
Flammability/UL-94V-0

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