F4BTME350 High Frequency PCB PTFE RF Circuit Board with Immersion Gold

(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)

1. Introduction to F4BTME350 High Frequency PCB

The F4BTME series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.

These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.

Furthermore, F4BTME laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.

This 2-layer rigid PCB is constructed entirely with F4BTME350 as the core material at 10mil (0.254mm) thickness, with immersion gold surface finish, black top solder mask, white top silkscreen, and 1oz RTF copper on both sides. Its DK of 3.5 offers excellent high-frequency performance, making it ideal for demanding applications such as 4G/5G base station antennas, LNAs, LNBs/LNCs, phased array antennas, satellite communications, and radar systems.

2. Key Features of F4BTME350 PCB

• Dielectric Constant (DK): 3.5 ± 0.07 at 10GHz

• Dissipation Factor (Df): 0.0025 at 10GHz / 0.0035 at 20GHz

• TCDK: -60 ppm/°C (-55°C to 150°C)

• CTE: X-axis 10 ppm/°C, Y-axis 12 ppm/°C, Z-axis 51 ppm/°C (-55°C to 288°C)

• Thermal Conductivity: 0.54 W/(M·K)

• Moisture Absorption: ≤0.05%

• PIM Value: ≤ -160 dBc (F4BTME only)

• Peel Strength (1oz F4BTME): >1.4 N/mm

• Volume Resistivity: ≥1×10⁷ MΩ·cm

• Surface Resistivity: ≥1×10⁶ MΩ

• Electrical Strength (Z direction): >32 KV/mm

• Breakdown Voltage (XY direction): >40 KV

• Density: 2.20 g/cm³

• Long-term Operating Temperature: -55°C to +260°C

• UL 94 V-0 Flammability Rating

• Radiation resistance and low outgassing

3. Benefits of F4BTME350 PCB

• Stable DK (3.5±0.07) — Consistent impedance control for high-frequency designs

• Low Df (0.0025 @ 10GHz) — Excellent signal integrity with minimal insertion loss

• Excellent PIM Performance (≤ -160 dBc) — Critical for low intermodulation distortion systems

• Low CTE (10/12/51 ppm/°C) — Exceptional dimensional stability, matched to copper

• High Thermal Conductivity (0.54 W/mK) — Superior heat dissipation for high-power applications

• Nano-Ceramic Filled PTFE — Enhanced dielectric constant, reduced thermal expansion

• RTF Copper Foil — Reduced conductor loss, excellent peel strength, precise line control

• Radiation Resistance & Low Outgassing — Suitable for aerospace applications

• Immersion Gold Finish — Excellent solderability, corrosion resistance, and wire bondability

4. PCB Construction Details

5. PCB Stackup (2-Layer Rigid Structure)

Layer: Copper_layer_1 (Top), Material: Copper (RTF), Thickness: 35 μm (1 oz)

Layer: Dielectric, Material: F4BTME350 Core, Thickness: 0.254 mm (10mil)

Layer: Copper_layer_2 (Bottom), Material: Copper (RTF), Thickness: 35 μm (1 oz)

6. PCB Statistics

Components: 12
Total Pads: 38
Thru Hole Pads: 17
Top SMT Pads: 21
Bottom SMT Pads: 0
Vias: 9
Nets: 2

7. Wangling F4BTME350 Material – Product Introduction

The F4BTME series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.

These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.

Furthermore, F4BTME laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.

F4BTME350 features a dielectric constant of 3.5±0.07 at 10GHz, dissipation factor of 0.0025 at 10GHz and 0.0035 at 20GHz, along with excellent thermal stability. The material operates reliably across a wide temperature range from -55°C to +260°C and is suitable for high-reliability RF and microwave applications.

8. Features and Benefits Summary

Feature	Benefit
DK 3.5 ± 0.07 @ 10GHz	Stable dielectric constant for consistent impedance control
Df 0.0025 @ 10GHz	Low loss for high-frequency RF and microwave designs
Excellent PIM (≤ -160 dBc)	Ideal for low intermodulation distortion systems
TCDK: -60 ppm/°C	Stable electrical performance over temperature
CTE: 10/12/51 ppm/°C	Excellent dimensional stability and reliable plated through holes
Thermal conductivity 0.54 W/m/K	Efficient heat removal for high-power applications
Nano-ceramic filled PTFE	Enhanced dielectric constant and reduced thermal expansion
RTF copper foil	Reduced conductor loss, precise line control
Radiation resistance & low outgassing	Ideal for aerospace, satellite, and defense applications
Immersion Gold finish	Excellent solderability, corrosion resistance, wire bondability

9. F4BTME350 Typical Properties (Data Sheet)

10. Primary Application Areas

• Base station antennas for 4G/5G communications

• Low Noise Amplifiers (LNAs), Low Noise Block downconverters (LNBs/LNCs)

• Phased array antennas, phase-sensitive antennas

• Satellite communications, aerospace and cabin equipment

• Microwave and RF modules, radar systems (including automotive radar)

• High-power amplifiers, passive components (e.g., power dividers, couplers, combiners)

• PCS/PCN large-format antennas, feed networks

11. Quality Assurance

• Type of artwork supplied: Gerber RS-274-X

• Accepted standard: IPC-Class-2

• Availability: Worldwide

• 100% Electrical test prior to shipment

12. Standard Thickness, Panel Sizes & Claddings

Note: F4BTME350 minimum thickness is 0.254mm. The following thicknesses are available as either total thickness including copper or dielectric thickness. Please specify when ordering.

Parameter	Options
Standard Dielectric Thicknesses (mm)	0.254 (min), 0.508, 0.762, 0.8, 1.0, 1.016, 1.27, 1.524, 2.0, 3.0, 4.0, 5.0, 6.0, 8.0, 10.0, 12.0
Thickness Tolerances (mm)	0.254: ±0.02, 0.508: ±0.04, 0.762: ±0.05, 0.8: ±0.05, 1.0: ±0.05, 1.016: ±0.05, 1.27: +0.06, 1.524: ±0.06, 2.0: ±0.075, 3.0: ±0.09, 4.0: ±0.1, 5.0: ±0.1, 6.0: ±0.12, 8.0: ±0.15, 10.0: ±0.18, 12.0: ±0.2
Standard Panel Sizes	460×610mm, 600×500mm, 914×1220mm (Note: thickness ≥4.0mm cannot provide 914×1220mm)
Standard Claddings (F4BTME)	Reverse-treated RTF Copper: 0.5oz (18μm), 1oz (35μm)
Standard Claddings (F4BTM)	ED Copper: 0.5oz (18μm), 1oz (35μm), 1.5oz (50μm), 2oz (70μm)
DK Options (F4BTME Series)	2.98, 3.0, 3.2, 3.5
Metal Base Options	F4BTM(E)***-AL (Aluminum base), F4BTM(E)***-CU (Copper base) for shielding/heat dissipation

13. F4BTM & F4BTME Series Aluminum/Copper Base Option

The F4BTM and F4BTME series can also be provided with an aluminum or copper base, where one side of the dielectric layer is covered with copper foil and the other side is laminated with copper or aluminum for shielding or heat dissipation purposes. Model designation: F4BTM***-AL, F4BTME***-AL, F4BTM***-CU, or F4BTME***-CU.

Model	Metal Base	Specific Gravity	Thermal Conductivity	Available Metal Thickness	Thickness Tolerance	Available Sizes
F4BTM(E)-2-A***-CU	Copper (Purple/Brass)	8.9	380 W/(M·K)	0.48, 0.98, 1.48, 1.98, 2.98, 3.98mm (other thicknesses available upon request)	+0.02, -0.05	460×610mm, 460×305mm
F4BTM(E)-2-A***-AL	Aluminum	2.7	180 W/(M·K)	0.48, 0.98, 1.48, 1.98, 2.98, 3.98mm (other thicknesses available upon request)	+0.02, -0.05	460×610mm, 460×305mm

Example: F4BTM300-AL represents F4BTM300 with aluminum base. F4BTME350-CU represents F4BTME350 with copper base.

14. Data Source Notes

• Dielectric Constant (Typical) is tested in the Z-direction of the material using GB/T 12636-1990 or IPC-TM-650 2.5.5.5 Stripline method.

• Other properties are tested using or referencing IPC-TM-650 or GBT4722-2017 standard test methods.

• All test data are typical measurement values intended to assist customers in material selection. They do not constitute any express or implied warranty and do not guarantee performance in specific applications. Customers are responsible for verifying the suitability of Wangling materials for each application.