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F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold


(PCB's are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction

This is a 2-layer high-frequency printed circuit board (PCB) built on Wangling F4BTME320 substrates. Both the top and bottom layers feature 70 µm (2 oz) copper, starting from 1 oz plating. The design supports surface mount components on the top side, while through-hole components are not utilized.


The technology specifications include a minimum trace width of 4 mil and a minimum spacing of 6 mil, enabling precise circuit design. The surface finish is immersion gold, which enhances solderability and provides excellent corrosion resistance. Additionally, a black solder mask is applied to the top side of the PCB, offering durability and an appealing aesthetic while protecting the underlying circuitry from environmental factors.


PCB Specifications

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F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold

PCB SIZE

70 x 70mm = 1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 70um(1 oz+plate) TOP layer

F4BTME320 - 1.0mm

copper ------- 70um(1 oz+plate) BOT Layer

Minimum Trace and Space:

4 mil / 6 mil

Minimum / Maximum Holes:

0.4 mm / 1.2 mm

Number of Different Holes:

7

Number of Drill Holes:

92

Number of Milled Slots:

2

Number of Internal Cutouts:

1

Impedance Control:

no

BOARD MATERIAL

 

Glass Epoxy:

F4BTME320 Dk3.2

Final foil external:

2 oz

Final foil internal:

N/A

Final height of PCB:

1.1 mm ±10%

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

Top, Black

Solder Mask Color:

Black

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

Top

Colour of Component Legend

White

Manufacturer Name or Logo:

Marked on the board in a conductor and leged FREE AREA

VIA

Plated through hole(PTH), minimum size 0.4mm.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


F4BTME320 PCB detail


F4BTME High-Frequency Laminates

F4BTME high-frequency laminates are composed of glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene resin, produced through scientific preparation and strict pressing processes. This series is based on the F4BM dielectric layer, enhanced with high-dielectric and low-loss nanoscale ceramics, resulting in:

Higher dielectric constant, Improved heat resistance, Lower coefficient of thermal expansion, Higher insulation resistance, Better thermal conductivity, Maintained low loss characteristics


F4BTME is cladded with reverse treated copper foil (RTF), offering an excellent PIM index, more accurate line control, and lower conductor loss, with optional thicknesses available in 0.5 oz and 1 oz.


Our PCB Capability (F4BTME)

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PCB Capability (F4BTME)
PCB Material:PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTME)F4BTMEDK (10GHz)DF (10 GHz)
F4BTME2982.98±0.060.0018
F4BTME3003.0±0.060.0018
F4BTME3203.2±0.060.0020
F4BTME3503.5±0.070.0025
Layer count:Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness:0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.

Data Sheet (F4BTME)

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Product Technical Parameters & Product Models & Data Sheet
PropertyTest ConditionsUnitF4BTME298F4BTME300F4BTME320F4BTME350
Dielectric Constant (Typical)10GHz/2.983.03.23.5
DK Tolerance//±0.06±0.06±0.06±0.07
Loss Tangent @10GHz10GHz/0.00180.00180.00200.0025
Loss Tangent @20GHz20GHz/0.00230.00230.00260.0035
Volume ResistivityStandardMΩ.cm≥1×10^7
Surface ResistivityStandardMΩ≥1×10^6
Thermal ConductivityZ directionW/(M.K)0.420.420.500.54
PIM (F4BTME only)/dBc≤-160
Flammability/UL-94V-0

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