* PCBs are custom-made, picture & parameters for reference
(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only.)
Brief Introduction
The Rogers DiClad 880 High Frequency PCB is a high-performance circuit board designed for applications requiring low dielectric constant and low loss tangent. Built on Rogers DiClad 880 laminates, this PCB features woven fiberglass-reinforced PTFE composites (without ceramic fillers), offering excellent dimensional stability and uniform electrical properties. The dielectric constant (Dk) and dissipation factor (Df) are precisely controlled by adjusting the ratio of woven fiberglass to PTFE, ensuring consistent performance across a wide frequency range. Available with gold, tin, and silver surface finishes, it is ideal for high-frequency and RF applications.
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Features
1. Extremely Low Loss Tangent (0.0009): Ensures minimal signal loss, ideal for high-frequency applications.
2. Excellent Dimensional Stability: Maintains consistent performance across the XY direction.
3. Product Performance Uniformity: Uniform electrical and mechanical properties across the board.
Benefits
1. Highly Uniform Electrical Properties: Consistent performance across a wide frequency range.
2. Consistent Mechanical Performance: Reliable operation in demanding environments.
3. Excellent Chemical Resistance: Resistant to chemicals used in PCB manufacturing processes.
Typical Applications
1. Commercial Phased Array Networks
2. Digital Radio Antennas
3. Filters, Couplers, and LNAs (Low Noise Amplifiers)
4. Low Loss Base Station Antennas
5. Radar Feed Networks
6. Missile Guidance Systems
Our PCB Capability (DiClad 880)
| PCB Capability (DiClad 880) | |
|---|---|
| PCB Material: | Woven Fiberglass Reinforced, PTFE-based Composites |
| Designation: | DiClad 880 |
| Dielectric constant: | 2.20 (10 GHz) |
| Dissipation factor: | 0.0009 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc. |
Our Advantages
1. Engineering Design Support: Prevents issues during pre-production.
2. Certified Manufacturing: ISO9001, ISO14001, ISO13485, and UL certified.
3. AOI Inspection: Ensures high-quality production with automated optical inspection.
4. Comprehensive PCB Capabilities: Supports R&D, sales, and marketing.
5. High On-Time Delivery Rate: Over 98% on-time delivery.
6. Any Layer HDI PCBs: Advanced technology for high-density interconnects.
7. Large Production Facility: 16,000㎡ workshop with a monthly output of 30,000㎡ and 8,000 types of PCBs.
8. Quick Turnaround: Fast CADCAM checking and free PCB quotations.
9. Diverse Shipping Options: FedEx, DHL, TNT, and EMS available.
10. Flexible Ordering: No minimum order quantity (MOQ); low-cost prototypes and small runs.
Appendix: Typical Properties of DiClad 880
| Property | DiClad 880 | Condition | Test Method |
|---|---|---|---|
| Electrical Properties | |||
| Dielectric Constant @ 10 GHz | 2.17, 2.20C23/50IPC TM-650 2.5.5.5|||
| Dielectric Constant @ 1 MHz | 2.17, 2.20C23/50IPC TM-650 2.5.5.3|||
| Dissipation Factor @ 10 GHz | 0.0009C23/50IPC TM-650 2.5.5.5|||
| Dissipation Factor @ 1 MHz | 0.0008C23/50IPC TM-650 2.5.5.3|||
| Thermal Coefficient of Er (ppm/°C) | -160-10°C to +140°CIPC TM-650 2.5.5.5 Adapted|||
| Peel Strength (lbs/inch) | 14After Thermal StressIPC TM-650 2.4.8|||
| Volume Resistivity (MΩ-cm) | 1.4 x 10⁹C96/35/90IPC TM-650 2.5.17.1|||
| Surface Resistivity (MΩ) | 2.9 x 10⁶C96/35/90IPC TM-650 2.5.17.1|||
| Arc Resistance (seconds) | >180D48/50ASTM D-495|||
| Mechanical Properties | |||
| Tensile Modulus (kpsi) | 267, 202A, 23°CASTM D-638|||
| Tensile Strength (kpsi) | 8.1, 7.5A, 23°CASTM D-882|||
| Compressive Modulus (kpsi) | 237A, 23°CASTM D-695|||
| Flexural Modulus (kpsi) | 357A, 23°CASTM D-790|||
| Dielectric Breakdown (kV) | >45D48/50ASTM D-149|||
| Thermal Properties | |||
| CTE - x (ppm/°C) | 250°C to 100°CIPC TM-650 2.4.24|||
| CTE - y (ppm/°C) | 340°C to 100°CIPC TM-650 2.4.24|||
| CTE - z (ppm/°C) | 2520°C to 100°CIPC TM-650 2.4.24|||
| Thermal Conductivity (W/mK) | 0.261100°CASTM E-1225|||
| Physical Properties | |||
| Density (g/cm³) | 2.23A, 23°CASTM D-792 Method A|||
| Water Absorption (%) | 0.02E1/105 + D24/23IPC TM-650 2.6.2.2|||
| Flammability | UL94-V0C48/23/50, E24/125UL 94 Vertical Burn|||
| Total Mass Loss (%) | 0.01125°C, ≤10⁻⁶ torrNASA SP-R-0022A|||
| Collected Volatile Condensable Material (%) | 0.01125°C, ≤10⁻⁶ torrNASA SP-R-0022A|||
| Water Vapor Regain (%) | 0.01125°C, ≤10⁻⁶ torrNASA SP-R-0022A|||
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