Home > RF PCB > Low DK High Frequency PCB > Rogers DiClad 880 High Frequency PCB - 20mil 30mil 60mil with Gold, Tin, and Silver Finishes
Rogers DiClad 880 High Frequency PCB
Material:Rogers DiClad 880 (Woven Fiberglass/PTFE) / 20-60mil
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-13 working days
Payment Method:T/T, Paypal

* PCBs are custom-made, picture & parameters for reference

Rogers DiClad 880 High Frequency PCB - 20mil 30mil 60mil with Gold, Tin, and Silver Finishes


(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only.)


Brief Introduction

The Rogers DiClad 880 High Frequency PCB is a high-performance circuit board designed for applications requiring low dielectric constant and low loss tangent. Built on Rogers DiClad 880 laminates, this PCB features woven fiberglass-reinforced PTFE composites (without ceramic fillers), offering excellent dimensional stability and uniform electrical properties. The dielectric constant (Dk) and dissipation factor (Df) are precisely controlled by adjusting the ratio of woven fiberglass to PTFE, ensuring consistent performance across a wide frequency range. Available with gold, tin, and silver surface finishes, it is ideal for high-frequency and RF applications.


DiClad 880 PCB


Features

1. Extremely Low Loss Tangent (0.0009): Ensures minimal signal loss, ideal for high-frequency applications.
2. Excellent Dimensional Stability: Maintains consistent performance across the XY direction.
3. Product Performance Uniformity: Uniform electrical and mechanical properties across the board.


Benefits

1. Highly Uniform Electrical Properties: Consistent performance across a wide frequency range.
2. Consistent Mechanical Performance: Reliable operation in demanding environments.
3. Excellent Chemical Resistance: Resistant to chemicals used in PCB manufacturing processes.


Typical Applications

1. Commercial Phased Array Networks
2. Digital Radio Antennas
3. Filters, Couplers, and LNAs (Low Noise Amplifiers)
4. Low Loss Base Station Antennas
5. Radar Feed Networks
6. Missile Guidance Systems


Our PCB Capability (DiClad 880)

Click to expand/collapse the table
PCB Capability (DiClad 880)
PCB Material:Woven Fiberglass Reinforced, PTFE-based Composites
Designation:DiClad 880
Dielectric constant:2.20 (10 GHz)
Dissipation factor:0.0009 (10 GHz)
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:1oz (35µm), 2oz (70µm)
Dielectric thickness:20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc.

Our Advantages

1. Engineering Design Support: Prevents issues during pre-production.
2. Certified Manufacturing: ISO9001, ISO14001, ISO13485, and UL certified.
3. AOI Inspection: Ensures high-quality production with automated optical inspection.
4. Comprehensive PCB Capabilities: Supports R&D, sales, and marketing.
5. High On-Time Delivery Rate: Over 98% on-time delivery.
6. Any Layer HDI PCBs: Advanced technology for high-density interconnects.
7. Large Production Facility: 16,000㎡ workshop with a monthly output of 30,000㎡ and 8,000 types of PCBs.
8. Quick Turnaround: Fast CADCAM checking and free PCB quotations.
9. Diverse Shipping Options: FedEx, DHL, TNT, and EMS available.
10. Flexible Ordering: No minimum order quantity (MOQ); low-cost prototypes and small runs.


Appendix: Typical Properties of DiClad 880

Click to expand/collapse the table
PropertyDiClad 880ConditionTest Method
Electrical Properties
Dielectric Constant @ 10 GHz2.17, 2.20C23/50IPC TM-650 2.5.5.5
Dielectric Constant @ 1 MHz2.17, 2.20C23/50IPC TM-650 2.5.5.3
Dissipation Factor @ 10 GHz0.0009C23/50IPC TM-650 2.5.5.5
Dissipation Factor @ 1 MHz0.0008C23/50IPC TM-650 2.5.5.3
Thermal Coefficient of Er (ppm/°C)-160-10°C to +140°CIPC TM-650 2.5.5.5 Adapted
Peel Strength (lbs/inch)14After Thermal StressIPC TM-650 2.4.8
Volume Resistivity (MΩ-cm)1.4 x 10⁹C96/35/90IPC TM-650 2.5.17.1
Surface Resistivity (MΩ)2.9 x 10⁶C96/35/90IPC TM-650 2.5.17.1
Arc Resistance (seconds)>180D48/50ASTM D-495
Mechanical Properties
Tensile Modulus (kpsi)267, 202A, 23°CASTM D-638
Tensile Strength (kpsi)8.1, 7.5A, 23°CASTM D-882
Compressive Modulus (kpsi)237A, 23°CASTM D-695
Flexural Modulus (kpsi)357A, 23°CASTM D-790
Dielectric Breakdown (kV)>45D48/50ASTM D-149
Thermal Properties
CTE - x (ppm/°C)250°C to 100°CIPC TM-650 2.4.24
CTE - y (ppm/°C)340°C to 100°CIPC TM-650 2.4.24
CTE - z (ppm/°C)2520°C to 100°CIPC TM-650 2.4.24
Thermal Conductivity (W/mK)0.261100°CASTM E-1225
Physical Properties
Density (g/cm³)2.23A, 23°CASTM D-792 Method A
Water Absorption (%)0.02E1/105 + D24/23IPC TM-650 2.6.2.2
FlammabilityUL94-V0C48/23/50, E24/125UL 94 Vertical Burn
Total Mass Loss (%)0.01125°C, ≤10⁻⁶ torrNASA SP-R-0022A
Collected Volatile Condensable Material (%)0.01125°C, ≤10⁻⁶ torrNASA SP-R-0022A
Water Vapor Regain (%)0.01125°C, ≤10⁻⁶ torrNASA SP-R-0022A

DiClad 880 PCB Detail


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