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* PCBs are custom-made, picture & parameters for reference
Rogers DiClad 870 Microwave PCB - 31mil 93mil 125mil Woven Fiberglass Reinforced PTFE-Based Circuit Boards
(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only.)
General Description
The Rogers DiClad 870 Microwave PCB is a high-performance circuit board designed for RF and microwave applications. Built on Rogers DiClad 870 laminates, this PCB features woven fiberglass/PTFE composites that provide excellent dimensional stability and low dielectric constant (Dk 2.33 at 10 GHz and 1 MHz). With a low dissipation factor of 0.0013 at 10 GHz, the DiClad 870 PCB ensures minimal signal loss, making it ideal for high-frequency systems. Available in 31mil, 93mil, and 125mil thicknesses, it is suitable for a wide range of applications, including phased arrays, radar systems, and base station antennas.
Features & Benefits
1. Low Dielectric Constant (Dk): 2.33 at 10 GHz and 1 MHz for superior signal integrity.
2. Low Dissipation Factor (Df): 0.0013 at 10 GHz, ensuring minimal signal loss.
3. Low Moisture Absorption: Among the lowest for PTFE-based composites, enhancing reliability.
4. Stable Dk Over Frequency: Ensures easy design transition and scalability.
5. Low Dk Supports Wider Line Widths: Reduces insertion loss for better performance.
6. Copper-Matched CTE: Matches the coefficient of thermal expansion in the X and Y axes for reduced stress.
7. Excellent Outgassing Values: Meets TML, CVCM, and WVR standards for space applications.
8. UL94-V0 Compliance: Meets flammability standards for safety.
Typical Applications
1. Commercial Phased Array Networks
2. Digital Radio Antennas
3. Filters, Couplers, and LNAs (Low Noise Amplifiers)
4. Guidance Systems
5. Low Loss Base Station Antennas
6. Radar Feed Networks
Our PCB Capability (DiClad 870)
| PCB Capability (DiClad 870) | |
|---|---|
| PCB material: | Woven Fiberglass reinforced PTFE Laminates |
| Designation: | DiClad 870 |
| Dielectric constant: | 2.33 |
| Layer count: | Single-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 31mil (0.787mm), 93mil (2.286mm), 125mil (3.175mm) |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold plated etc. |
Our Advantages
1. Wide Range of High-Frequency Materials: Including Rogers, Taconic, Wangling, Isola, and Shengyi.
2. Large Production Facility: 16,000㎡ workshop with a monthly output of 30,000㎡ and 8,000 types of PCBs.
3. Certified Manufacturing: ISO9001, ISO14001, ISO13485, and UL certified.
4. Quick Turnaround: Fast CADCAM checking and free PCB quotations.
5. 20+ Years of Experience: Specializing in high-frequency PCB manufacturing.
6. Diverse Shipping Options: FedEx, DHL, TNT, and EMS available.
7. Flexible Ordering: No minimum order quantity (MOQ); low-cost prototypes and small runs.
8. High Reliability: On-time delivery rate >98%, customer complaint rate <1%.
Appendix: Data Sheet of DiClad 870
| Property | DiClad 870 | Condition | Test Method |
|---|---|---|---|
| Electrical Properties | |||
| Dielectric Constant @ 10 GHz | 2.33 | C23/50 | IPC TM-650 2.5.5.5 |
| Dielectric Constant @ 1 MHz | 2.33 | C23/50 | IPC TM-650 2.5.5.3 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 1 MHz | 0.0009 | C23/50 | IPC TM-650 2.5.5.3 |
| Volume Resistivity (MΩ-cm) | 1.5 x 10⁹ | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 3.4 x 10⁷ | C96/35/90 | IPC TM-650 2.5.17.1 |
| Mechanical Properties | |||
| Peel Strength (lbs/inch) | 14 | After Thermal Stress | IPC TM-650 2.4.8 |
| Tensile Strength (kpsi) | 14.9 (MD), 11.2 (CD) | A, 23°C | ASTM D-882 |
| Thermal Properties | |||
| CTE - x (ppm/°C) | 17 | 0°C to 100°C | IPC TM-650 2.4.24 |
| CTE - y (ppm/°C) | 29 | 0°C to 100°C | IPC TM-650 2.4.24 |
| CTE - z (ppm/°C) | 217 | 0°C to 100°C | IPC TM-650 2.4.24 |
| Thermal Conductivity (W/mK) | 0.257 | 100°C | ASTM E-1225 |
| Physical Properties | |||
| Flammability | UL94-V0 | C48/23/50, E24/125 | UL 94 Vertical Burn |
| Water Absorption (%) | 0.02 | E1/105 + D24/23 | IPC TM-650 2.6.2.2 |
| Density (g/cm³) | 2.26 | A, 23°C | ASTM D-792 Method A |
| Total Mass Loss (%) | 0.02 | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
| Collected Volatile Condensable Material (%) | 0.00 | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
| Water Vapor Regain (%) | 0.01 | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
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