* PCBs are custom-made, picture & parameters for reference
DiClad 527 High-Frequency PCB: Advanced Composite Substrate Solutions
(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)
Substrate Introduction
Rogers DiClad 527 laminates are advanced composite materials designed for use as substrates in printed circuit boards. These laminates feature a higher proportion of fiberglass reinforcement compared to PTFE content, resulting in a balanced ratio that enhances dielectric constant (Dk) range and improves dimensional stability and registration.
Standard Panel Sizes for DiClad 527:
18" x 12" (457 x 305mm)
18" x 24" (457 x 610mm)
Standard Thicknesses for DiClad 527:
0.020" (0.508mm) with a tolerance of +/- 0.0020"
0.030" (0.762mm) with a tolerance of +/- 0.0020"
0.060" (1.524mm) with a tolerance of +/- 0.0020"
Standard Claddings for DiClad 527:
Electrodeposited Copper Foil
1/2 oz. (18µm)
1 oz. (35µm)
For additional PCB configurations, including different thicknesses, panel sizes, and claddings, please contact our Customer Service or Sales Engineering teams.
Key Benefits
1. Stable Dk: Maintains stability across a wide frequency range.
2. Low Circuit Losses: Minimizes losses at high frequencies.
3. Performance in Humidity: Exhibits minimal variation in high humidity environments.
4. Dimensional Stability: Ensures consistent dimensions.
5. Consistent Performance: Reliable product performance across applications.
6. Uniform Electrical Properties: Provides uniformity across frequencies.
7. Mechanical Reliability: Ensures robust mechanical performance.
8. Chemical Resistance: Offers excellent resistance to chemicals.
Typical Applications
1. Radar Feed Networks
2. Commercial Phased Array Networks
3. Low-Loss Base Station Antennas
4. Guidance Systems
5. Digital Radio Antennas
6. Filters, Couplers, and LNAs
Our PCB Capability (DiClad 527)
| PCB Capability (DiClad 527) | |
|---|---|
| PCB Material: | Woven Fiberglass/PTFE composite |
| Designation: | DiClad 527 |
| Dielectric constant: | 2.40-2.60 (10 GHz/23°C) |
| Dissipation factor: | 0.0017 (10 GHz/23°C) |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc. |
Our Advantages
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is a leading high-frequency PCB supplier and exporter based in Shenzhen, China. With over 19 years of experience, we specialize in serving industries such as cellular base station antennas, satellite systems, high-frequency passive components, microstrip and band line circuits, millimeter-wave equipment, radar systems, and digital radio frequency antennas. Our high-frequency PCBs are primarily built on materials from Rogers Corporation, Taconic, and Wangling, with dielectric constants ranging from 2.2 to 10.2.
DiClad 527 Data Sheet
| Property | DiClad 527 | Units | Test Conditions | Test Method |
|---|---|---|---|---|
| Dielectric Constant | 2.40-2.60 | - | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dielectric Constant | 2.40-2.60 | - | 23°C @ 50% RH, 1 MHz | IPC TM-650 2.5.5.3 |
| Dissipation Factor | 0.0017 | - | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dissipation Factor | 0.0010 | - | 23°C @ 50% RH, 1 MHz | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Er | -153 | ppm/°C | -10 to 140°C, 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 10⁹ | MΩ-cm | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 4.5 x 10⁷ | MΩ | C96/35/90 | IPC TM-650 2.5.17.1 |
| Dielectric Breakdown | >45 | kV | D48/50 | ASTM D-149 |
| Arc Resistance | >180 | seconds | - | ASTM D-495 |
| CTE - x | 14 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.41 |
| CTE - y | 21 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.41 |
| CTE - z | 173 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.26 | W/(m·K) | - | ASTM E1461 |
| Copper Peel Strength | 14 | lbs/in | 10s @288°C, 35μm foil | IPC TM-650 2.4.8 |
| Flammability | V-0 | - | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.03 | % | E1/105+D24/23 | IPC TM-650 2.6.2.2 |
| Density | 2.31 | g/cm³ | C24/23/50 | ASTM D792 |
| Total Mass Loss | 0.02 | % | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
| Collected Volatiles | 0.00 | % | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
| Water Vapor Recovered | 0.01 | % | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
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