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* PCBs are custom-made, picture & parameters for reference
Rogers TMM4 Microwave Printed Circuit Board 15mil 20mil 25mil 30mil 50mil 60mil With Immersion Gold
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Rogers TMM4 Microwave Material Overview
Rogers TMM4 is a thermoset microwave material that combines ceramic, hydrocarbon, and thermoset polymer composites, specifically designed for high reliability in plated-through-hole applications, including stripline and microstrip configurations. It features a dielectric constant of 4.70, offering a blend of electrical and mechanical properties that harness the advantages of both ceramic and traditional PTFE microwave materials, while eliminating the need for specialized production techniques. Notably, TMM4 does not require sodium naphthanate treatment prior to electroless plating.
Key Properties
Thermal Coefficient of Dielectric Constant: Exceptionally low, typically less than 30 PPM/°C.
Coefficient of Thermal Expansion: Isotropic and closely matched to copper, ensuring reliable plated-through holes and minimal etch shrinkage values.
Thermal Conductivity: Approximately twice that of conventional PTFE/ceramic materials, which aids in heat removal.
Thermoset Resins: TMM4 does not soften when heated, allowing for safe wire bonding of component leads to circuit traces without the risk of pad lifting or substrate deformation.
PCB Capability (TMM4)
| PCB Capability (TMM4) | |
|---|---|
| PCB Material: | Composite of Ceramic, hydrocarbon and thermoset polymer |
| Designator: | TMM4 |
| Dielectric constant: | 4.5 ± 0.045 (process); 4.7 (design) |
| Layer count: | Single Sided, Double Sided, Multi-layer, Hybrid designs |
| Copper weight: | 1oz (35µm), 2oz (70µm)-- |
| Laminate thickness: | 15mil,20mil,25mil,30mil,50mil,60mil,75mil,100mil,125mil,150mil,200mil,250mil,500mil |
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Typical Applications
• Chip testers
• Dielectric polarizers and lenses
• Filters and couplers
• Global Positioning System (GPS) antennas
• Patch antennas
• Power amplifiers and combiners
• RF and microwave circuitry
• Satellite communication systems
Typical Values of TMM4
| Property | TMM4 | Direction | Units | Condition | Test Method |
|---|---|---|---|---|---|
| Dielectric Constant, ε Process | Z | 4.5 ± 0.045 | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant, ε Design | - | 4.7 | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | Z | 0.002 | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | - | +15 | -55°C-125°C | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | - | 6 x 10⁸ | - | ASTM D257 | |
| Surface Resistivity | - | 1 x 10⁹ | - | ASTM D257 | |
| CTE - X | X | 16 | 0 to 140°C | ASTM E 831 | |
| CTE - Y | Y | 16 | 0 to 140°C | ASTM E 831 | |
| CTE - Z | Z | 21 | 0 to 140°C | ASTM E 831 | |
| Thermal Conductivity | Z | 0.7 | 80°C | ASTM C518 | |
| Moisture Absorption | - | 0.07-0.18 | D/24/23 | ASTM D570 | |
| Specific Gravity | - | 2.07 | A | ASTM D792 | |
| Specific Heat Capacity | - | 0.83 | A | Calculated | |
| Flammability | - | V-0 | - | UL 94 | |
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