* PCBs are custom-made, picture & parameters for reference
TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 with Immersion Gold
(Note: Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Overview of Rogers TMM4 High Frequency Circuit Materials
Rogers TMM4 is a composite material made from ceramic, hydrocarbon, and thermoset polymer components, specifically designed for printed circuit board (PCB) applications. It aims to enhance heat transfer while minimizing dielectric and insertion losses. This double-layer RF PCB is constructed on a 60 mil (1.524mm) Rogers TMM4 substrate with a dielectric constant of 4.5.
Key Features
- Stable Dielectric Constant: DK of 4.5 ± 0.045 at 10 GHz, ensuring consistent electrical performance across frequencies.
- Low Dissipation Factor: Df of 0.002 at 10 GHz, minimizing signal loss in high-frequency circuits.
- Excellent Thermal Stability: Thermal coefficient of dielectric constant of +15 ppm/K from -55°C to 125°C.
- Matched CTE to Copper: CTE of 16/16/21 ppm/K (X/Y/Z) closely matches copper, ensuring reliable plated-through holes.
- High Thermal Conductivity: 0.7 W/m/K facilitates effective heat removal for high-power applications.
Typical Applications
- Chip testers
- Dielectric polarizers and lenses
- Filters and couplers
- Global Positioning System (GPS) antennas
- Patch antennas
- Power amplifiers and combiners
- RF and microwave circuitry
- Satellite communication systems
PCB Specifications
TMM4 60mil 1.524mm High Frequency PCB DK4.5 for Chip Testers and GPS Antennas |
|
PCB SIZE |
90 x 90mm = 1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 17um(0.5 oz)+plate TOP layer |
TMM4 1.524mm |
|
copper ------- 17um(0.5 oz) + plate BOT Layer |
|
Minimum Trace and Space: |
4 mil / 4 mil |
Minimum / Maximum Holes: |
0.30 mm / 2.0 mm |
Number of Different Holes: |
5 |
Number of Drill Holes: |
2500 |
BOARD MATERIAL |
|
Base Material: |
TMM4 1.524mm |
Final foil external: |
1.0 oz |
Final height of PCB: |
1.6 mm ±10% |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
NO |
CONTOUR/CUTTING |
Routing |
VIA |
Plated through hole(PTH), minimum size 0.30mm. |
TEST |
100% Electrical Test prior shipment |
SERVICE AREA |
Worldwide, Globally. |
Our Capability (TMM4)
| PCB Capability (TMM4) | |
| PCB Material: | Composite of Ceramic, hydrocarbon and thermoset polymer |
| Designator: | TMM4 |
| Dielectric constant: | 4.5 ± 0.045 (process); 4.7 (design) |
| Layer count: | Single Sided, Double Sided, Multi-layer, Hybrid designs |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 15mil, 25mil, 30mil, 50mil, 60mil, 75mil, 100mil, 125mil, 150mil, 200mil, 250mil, 500mil |
Typical Values of TMM4
| Property | TMM4 | Direction | Units | Condition | Test Method |
|---|---|---|---|---|---|
| Dielectric Constant, ε Process | 4.5 ± 0.045 | Z | -- | 10 GHz | IPC-TM-650 2.5.5.5 |
| Dissipation Factor | 0.002 | Z | -- | 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +15 | -- | ppm/K | -55°C-125°C | IPC-TM-650 2.5.5.5 |
| CTE (X) | 16 | X | ppm/K | 0 to 140°C | ASTM E 831 |
| CTE (Y) | 16 | Y | ppm/K | 0 to 140°C | ASTM E 831 |
| CTE (Z) | 21 | Z | ppm/K | 0 to 140°C | ASTM E 831 |
| Thermal Conductivity | 0.7 | Z | W/m/K | 80°C | ASTM C518 |
| Copper Peel Strength | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float | IPC-TM-650 2.4.8 |
| Moisture Absorption | 0.07 | -- | % | D/24/23 | ASTM D570 |
| Lead-Free Process Compatible | YES | -- | -- | -- | -- |
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