Rogers RT/Duroid 5870 62mil (1.575mm) High-Frequency PCB for Point-to-Point Digital Radio Antennas
(Note: Printed Circuit Boards (PCBs) are customized products. Images and specifications provided are for reference purposes only.)
Overview of Rogers RT/Duroid 5870 High-Frequency Material
The Rogers RT/Duroid 5870 is a high-performance PCB material specifically designed for advanced stripline and microstrip circuit applications. This material is made of glass microfiber-reinforced PTFE composites, ensuring superior performance in high-frequency designs.
One of its standout features is the exceptional uniformity of the dielectric constant due to the randomly oriented microfibers. This uniformity ensures consistency from panel to panel and maintains stability across a wide frequency range.
The low dissipation factor of RT/Duroid 5870 makes it ideal for applications extending into the Ku-band and above, enabling reliable performance at high frequencies. Additionally, this material is highly versatile and can be easily cut, sheared, or machined while offering resistance to solvents and reagents commonly used in PCB fabrication processes, including etching and plating.
Key Features of Rogers RT/Duroid 5870
1.Uniform Dielectric Constant:
The dielectric constant is highly uniform across panels and remains stable over a wide range of frequencies, ensuring consistent performance.
2.Low Dissipation Factor:
The low dissipation factor extends the usability of RT/Duroid 5870 in high-frequency ranges, such as the Ku-band and beyond.
3.High Machinability:
RT/Duroid 5870 materials can be easily cut, sheared, or machined to meet precise design requirements.
4.Chemical Resistance:
Resistant to solvents and reagents—both hot and cold—commonly used for etching and plating, ensuring long-term durability.
5.Wide Range of Applications:
Perfect for applications like radar systems, digital radio antennas, and millimeter-wave circuits.
Key Applications of Rogers RT/Duroid 5870
The Rogers RT/Duroid 5870 material is widely used in various high-frequency and precision applications, including:
- a.Commercial airline broadband antennas
- b.Microstrip and stripline circuits
- c.Millimeter-wave applications
- d.Military radar systems
- e.Missile guidance systems
- f.Point-to-point digital radio antennas
Its versatility and reliability make it a trusted choice for industries requiring high-frequency and low-loss PCB designs.
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PCB Specifications
Rogers RT/Duroid 5870 62mil 1.575mm High Frequency PCB for Point To Point Digital Radio Antennas |
|
PCB SIZE |
120 x 75mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RT/Duroid 5870 1.575mm |
|
copper ------- 18um(0.5oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
9 mil / 4 mil |
Minimum / Maximum Holes: |
0.3 mm / 1.0mm |
Number of Different Holes: |
3 |
Number of Drill Holes: |
92 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RT/Duroid 5870 1.575mm |
Final foil external: |
1.0 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.6 mm ±0.16 |
PLATING AND COATING |
|
Surface Finish |
Immersion gold |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.25mm. Via tented. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers RT/Duroid 5870
RT/duroid 5870 Typical Value |
||||||
Property |
RT/duroid 5870 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
2.33 |
Z |
N/A |
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 |
|
Dielectric Constant,εDesign |
2.33 |
Z |
N/A |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor,tanδ |
0.0005 |
Z |
N/A |
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 |
|
Thermal Coefficient of ε |
-115 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
|
Volume Resistivity |
2 x 107 |
Z |
Mohm cm |
C/96/35/90 |
ASTM D 257 |
|
Surface Resistivity |
2 x 107 |
Z |
Mohm |
C/96/35/90 |
ASTM D 257 |
|
Specific Heat |
0.96(0.23) |
N/A |
j/g/k |
N/A |
Calculated |
|
Tensile Modulus |
Test at 23℃ |
Test at 100℃ |
N/A |
MPa(kpsi) |
A |
ASTM D 638 |
1300(189) |
490(71) |
X |
||||
1280(185) |
430(63) |
Y |
||||
Ultimate Stress |
50(7.3) |
34(4.8) |
X |
|||
42(6.1) |
34(4.8) |
Y |
||||
Ultimate Strain |
9.8 |
8.7 |
X |
% |
||
9.8 |
8.6 |
Y |
||||
Compressive Modulus |
1210(176) |
680(99） |
X |
MPa(kpsi) |
A |
ASTM D 695 |
1360(198) |
860(125) |
Y |
||||
803(120) |
520(76) |
Z |
||||
Ultimate Stress |
30(4.4) |
23(3.4） |
X |
|||
37(5.3) |
25(3.7) |
Y |
||||
54(7.8) |
37(5.3) |
Z |
||||
Ultimate Strain |
4 |
4.3 |
X |
% |
||
3.3 |
3.3 |
Y |
||||
8.7 |
8.5 |
Z |
||||
Moisture Absorption |
0.02 |
N/A |
% |
0.62"(1.6mm) D48/50 |
ASTM D 570 |
|
Thermal Conductivity |
0.22 |
Z |
W/m/k |
80℃ |
ASTM C 518 |
|
Coefficient of Thermal Expansion |
22 |
X |
ppm/℃ |
0-100℃ |
IPC-TM-650 2.4.41 |
|
Td |
500 |
N/A |
℃ TGA |
N/A |
ASTM D 3850 |
|
Density |
2.2 |
N/A |
gm/cm3 |
N/A |
ASTM D 792 |
|
Copper Peel |
27.2(4.8) |
N/A |
Pli(N/mm) |
1oz(35mm)EDC foil |
IPC-TM-650 2.4.8 |
|
Flammability |
V-0 |
N/A |
N/A |
N/A |
UL 94 |
|
Lead-free Process Compatible |
Yes |
N/A |
N/A |
N/A |
N/A |
|