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Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RT/duroid 6035HTC High-Frequency Circuit Materials by Rogers Corporation

RT/duroid 6035HTC is a ceramic-filled PTFE composite designed for high power RF and microwave applications. With a thermal conductivity nearly 2.4 times greater than standard RT/duroid 6000 products, and featuring copper foil (both electrodeposited and reverse treated) that offers exceptional long-term thermal stability, RT/duroid 6035HTC laminates are an outstanding choice for high power applications.



Features and Benefits

1.High Thermal Conductivity Enhanced dielectric heat dissipation allows for lower operating temperatures in high power applications.
2.Low Loss Tangent Delivers excellent performance at high frequencies.
3.Thermally Stable Low Profile and Reverse Treated Copper Foil Results in lower insertion loss and superior thermal stability of traces.
4.Advanced Filler System Provides improved drillability and extended tool life compared to circuit materials that contain alumina.


Typical Applications

1.High Power RF and Microwave Amplifiers
2.Power Amplifiers, Couplers, Filters
3.Combiners, Power Dividers



PCB Capability (RT/duroid 6035HTC)

PCB Capability (RT/duroid 6035HTC)

PCB Material:

Ceramic-filled PTFE composites

Designation:

RT/duroid 6035HTC

Dielectric constant:

3.50±0.05

Layer count:

Double Layer, Multilayer, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP etc..


Data Sheet of RT/duroid 6035HTC

Click to expand/collapse the table

Property

Typical Value RT/duroid 6035HTC

Direction

Unit

Condition

Test Method

Dielectric Constant, εr Process

3.50 ± 0.05

Z

-

10 GHz/23°C

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant, εr
Design

3.6

Z

-

8 GHz - 40 GHz

Differential Phase Length Method         

Dissipation Factor,

0.0013

Z

-

10 GHz/23°C

IPC-TM-650, 2.5.5.5

Thermal Coefficient of εr

-66

Z

ppm/°C

-50°C to 150°C

mod IPC-TM-650, 2.5.5.5

Dielectric Strength

835

-

V/Mil

15 mil thickness

IPC-TM-650, 2.5.6.2

Breakdown Voltage

12.59

-

kV

15 mil thickness

IPC-TM-650, 2.5.6

Volume Resistivity

108

-

MΩ•cm

COND A

IPC-TM-650, 2.5.17.1

Surface Resistivity

108

-

MΩ

COND A

IPC-TM-650, 2.5.17.1

Tensile Modulus

329
244

    MD
CMD

kpsi

40 hrs @ 23°C/50RH

ASTM D638

Dimensional Stability

-0.11
-0.08

     CMD
MD

mm/m
(mils/inch)

0.030” 1 oz EDC foil
Thickness
after etch +E4/105

IPC-TM-650, 2.4.39A

Coefficient of Thermal
Expansion (-55 to 288 °C)

19

X

ppm/°C

23°C/50% RH

IPC-TM-650 2.4.41

19

Y

39

Z

Thermal Conductivity

1.44

-

W/m/K

80°C

ASTM C518

Moisture Absorption

0.06

-

%

D24/23

IPC-TM-650 2.6.2.1 ASTM D570     

Density

2.2

-

gm/cm3

23°C

ASTM D-792

Copper Peel Strength

7.9

-

pli

20 sec.@ 288°C

IPC-TM-650 2.4.8

Flammability

V-0

-

-

-

UL  94

Lead-Free Process
Compatible

YES

 

 

 



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