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Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Product Description

RT/duroid 6035HTC high frequency circuit materials from Rogers Corporation are ceramic-filled PTFE composites specifically designed for high-power RF and microwave applications. These laminates feature superior thermal conductivity, nearly 2.4 times that of standard RT/duroid 6000 products, and are equipped with copper foil (electrodeposited and reverse treated) that offers excellent long-term thermal stability. RT/duroid 6035HTC is an exceptional choice for demanding high-power applications.



Features and Benefits

1.High Thermal Conductivity: Improved dielectric heat dissipation allows for lower operating temperatures in high-power applications.
2.Low Loss Tangent: Delivers excellent high-frequency performance.
3.Thermally Stable Low Profile and Reverse Treat Copper Foil: Reduces insertion loss and enhances the thermal stability of traces.
4.Advanced Filler System: Improves drillability and extends tool life compared to alumina-containing circuit materials.


Typical Applications

1.High Power RF and Microwave Amplifiers
2.Power Amplifiers, Couplers, Filters
3.Combiners, Power Dividers



PCB Capability (RT/duroid 6035HTC)

PCB Capability (RT/duroid 6035HTC)

PCB Material:

Ceramic-filled PTFE composites

Designation:

RT/duroid 6035HTC

Dielectric constant:

3.50±0.05

Layer count:

Double Layer, Multilayer, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

Laminate thickness:

10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..


Data Sheet of RT/duroid 6035HTC

Click to expand/collapse the table

Property

Typical Value RT/duroid 6035HTC

Direction

Unit

Condition

Test Method

Dielectric Constant, εr Process

3.50 ± 0.05

Z

-

10 GHz/23°C

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant, εr
Design

3.6

Z

-

8 GHz - 40 GHz

Differential Phase Length Method         

Dissipation Factor,

0.0013

Z

-

10 GHz/23°C

IPC-TM-650, 2.5.5.5

Thermal Coefficient of εr

-66

Z

ppm/°C

-50°C to 150°C

mod IPC-TM-650, 2.5.5.5

Dielectric Strength

835

-

V/Mil

15 mil thickness

IPC-TM-650, 2.5.6.2

Breakdown Voltage

12.59

-

kV

15 mil thickness

IPC-TM-650, 2.5.6

Volume Resistivity

108

-

MΩ•cm

COND A

IPC-TM-650, 2.5.17.1

Surface Resistivity

108

-

MΩ

COND A

IPC-TM-650, 2.5.17.1

Tensile Modulus

329
244

    MD
CMD

kpsi

40 hrs @ 23°C/50RH

ASTM D638

Dimensional Stability

-0.11
-0.08

     CMD
MD

mm/m
(mils/inch)

0.030” 1 oz EDC foil
Thickness
after etch +E4/105

IPC-TM-650, 2.4.39A

Coefficient of Thermal
Expansion (-55 to 288 °C)

19

X

ppm/°C

23°C/50% RH

IPC-TM-650 2.4.41

19

Y

39

Z

Thermal Conductivity

1.44

-

W/m/K

80°C

ASTM C518

Moisture Absorption

0.06

-

%

D24/23

IPC-TM-650 2.6.2.1 ASTM D570     

Density

2.2

-

gm/cm3

23°C

ASTM D-792

Copper Peel Strength

7.9

-

pli

20 sec.@ 288°C

IPC-TM-650 2.4.8

Flammability

V-0

-

-

-

UL  94

Lead-Free Process
Compatible

YES

 

 

 



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